FSA8009 – Audio Jack Send / End Detection with MIC / Video Switch
March 2012
FSA8009
Audio Jack Send / End Detection with MIC / Video Switch
Features
Detection
Switch Type
V
DD
THD (MIC)
ESD (Air Gap)
Operating Temperature
Package
Top Mark
Ordering Information
Accessory Plug-In
3- or 4-Pole Audio Jack
Send / End Key Pressed
Microphone & Video
2.5 to 4.3V
0.01% Typical
16kV
-40°C to 85°C
10-Lead UMLP
1.4x1.8x0.5mm, 0.4mm Pitch
KP
FSA8009UMX
Description
The FSA8009 is an audio jack microphone / video switch for
3- or 4-pole accessories with send / end (S/E) detection. In
addition to detection, the FSA8009 features an integrated
microphone / video switch that allows the processor to
configure the audio jack. The architecture is designed to
allow common third-party headphones to be used for
listening to music from mobile handsets, personal media
players, and portable peripheral devices.
Determines When Send / End Button Key is Pressed
Integrates a MIC / Video Switch for 4-Pole Configuration
Reduces Pop / Click Caused by Microphone Bias
Related Resources
For samples and questions, please contact:
Analog.Switch@fairchildsemi.com.
Applications
3.5mm and 2.5mm Audio Jacks
Cellular Phones, Smartphones
MP3 and PMP
FSA8009 Demonstration Board
Typical Application
Baseband
Processor
GPIO
V
IO
2.8V
V
IO
10KΩ
TTL Level Input EN
Open Drain Output S/E
TTL Level Input SEL
VDD
R_VDD
GPIO1
GPIO2
GPIO3
Audio
CODEC
MIC Bias
MIC
L SPKR
R SPKR
C
MIC
Enable
L R GND MIC
+
-
REF
1
2 3 4
R
MIC
VID
J_MIC
16-32Ω
GND
Applications
Processor
Video Out
Figure 1. Mobile Phone Example
© 2010 Fairchild Semiconductor Corporation
FSA8009 • Rev. 1.0.1
www.fairchildsemi.com
16-32Ω
NC, S/E Key
MIC
FSA8009 – Audio Jack Send / End Detection with MIC / Video Switch
Physical Dimensions
0.15 C
1.40
A
2X
B
1.70
0.663
1
(9X)
0.563
1.80
PIN#1 IDENT
0.40
2.10
TOP VIEW
0.10 C
0.15 C
2X
(10X)
0.225
0.55 MAX.
RECOMMENDED
LAND PATTERN
1.45
9X
0.45
0.152
0.08 C
0.05
SEATING C
PLANE
0.55
SIDE VIEW
0.35
(9X)
0.45
3
DETAIL A
1
PIN#1 IDENT
10
0.15
(10X)
0.25
0.10 C A B
0.05 C
0.40
1.85
(10X)
0.225
0.40
6
OPTIONAL MINIMIAL
TOE LAND PATTERN
NOTES:
A. PACKAGE DOES NOT FULLY CONFORM TO
JEDEC STANDARD.
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS AND TOLERANCES PER
ASME Y14.5M, 1994.
D. LAND PATTERN RECOMMENDATION IS
BASED ON FSC DESIGN ONLY.
E. DRAWING FILENAME: MKT-UMLP10Arev3.
BOTTOM VIEW
0.55
0.45
0.10
0.10
0.10
DETAIL A
SCALE : 2X
PACKAGE
EDGE
LEAD
OPTION 1
SCALE : 2X
LEAD
OPTION 2
SCALE : 2X
Figure 3. 10-Lead UMLP Package Drawing
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without
notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most
recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which
covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
Ordering Information
Part Number
FSA8009UMX
Operating Temperature Range
-40 to +85°C
Top Mark
KP
Package
10-Lead 1.4 x 1.8 x 0.55mm, 0.4mm Pitch,
Ultrathin Molded Leadless Package (UMLP)
© 2010 Fairchild Semiconductor Corporation
FSA8009 • Rev. 1.0.1
www.fairchildsemi.com
7
Embedded System
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