● 36-Pin, 6mm x 6mm TQFN Provides High Isolation in
a Small Package
Modulator Operation: (2140MHz):
● Meets Four-Carrier WCDMA 65dBc ACLR
● 23.3dBm Typical OIP3
● 51.5dBm Typical OIP2
● 45.7dBc Typical Sideband Suppression
● -40dBm Typical LO Leakage
● -173.2dBm/Hz Typical Output Noise, Eliminating the
Need for an RF Output Filter
● Broadband Baseband Input
● DC-Coupled Input Provides for Direct Launch DAC
Interface, Eliminating the Need for Costly I/Q
Buffer Amplifiers
Demodulator Operation (1890MHz):
● 39dBm Typical IIP3
● 58dBm Typical IIP2
● 9.2dB Typical Conversion Loss
● 9.4dB Typical NF
Ordering Information
appears at end of data sheet.
For related parts and recommended products to use with this part, refer
to
www.maximintegrated.com/MAX2022.related.
WCDMA, ACLR, ALTCLR and Noise vs. RF Output
Power at 2140MHz for Single, Two, and Four Carriers
-60
-62
ACLR AND ALT CLR (dBc)
-64
-66
-68
-70
-72
-74
-76
-78
-80
-50
1C ALT
NOISE FLOOR
2C ALT
4C 2C
1C
-165
-175
2C ADJ
1C ADJ
-155
-145
4C ADJ
4C ALT
-125
-135
0
-40
-30
-20
-10
RF OUTPUT POWER PER CARRIER (dBm)
19-3572; Rev 1; 9/12
NOISE FLOOR (dBm/Hz)
MAX2022
High-Dynamic-Range, Direct Up/
Downconversion 1500MHz to 3000MHz
Quadrature Modulator/Demodulator
RBIASLO3 Maximum Current ............................................10mA
Continuous Power Dissipation (Note 1) ..............................7.6W
Operating Case Temperature Range (Note 2) ... -40°C to +85°C
Maximum Junction Temperature .....................................+150°C
Storage Temperature Range ............................ -65°C to +150°C
Lead Temperature (soldering, 10s) ................................. +300°C
Soldering Temperature (reflow) .......................................+260°C
Absolute Maximum Ratings
VCC_ to GND
.......................................................-0.3V to +5.5V
BBIP, BBIN, BBQP, BBQN to GND
.......... -2.5V to (V
CC
+ 0.3V)
LO, RF to GND Maximum Current
.....................................50mA
RF Input Power ..............................................................+20dBm
Baseband Differential I/Q Input Power ...........................+20dBm
LO Input Power ..............................................................+10dBm
RBIASLO1 Maximum Current ............................................10mA
RBIASLO2 Maximum Current ............................................10mA
Note 1:
Based on junction temperature T
J
= T
C
+ (θ
JC
x V
CC
x I
CC
). This formula can be used when the temperature of the exposed
pad is known while the device is soldered down to a PCB. See the
Applications Information
section for details. The junction
temperature must not exceed +150°C.
Note 2:
T
C
is the temperature on the exposed pad of the package. T
A
is the ambient temperature of the device and PCB.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Package Thermal Characteristics
TQFN
Junction-to-Ambient
Thermal Resistance (θ
JA
) (Notes 3, 4) .....................+34°C/W
Junction-to-Case
Thermal Resistance (θ
JC
) (Notes 1, 4) ....................+8.5°C/W
Note 3:
Junction temperature T
J
= T
A
+ (θ
JA
x V
CC
x I
CC
). This formula can be used when the ambient temperature of the PCB is
known. The junction temperature must not exceed +150°C.
Note 4:
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to
www.maximintegrated.com/thermal-tutorial.
DC Electrical Characteristics
(MAX2022
Typical Application Circuit,
V
CC
= 4.75V to 5.25V, V
GND
= 0V, I/Q ports terminated into 50Ω to GND, LO and RF ports
terminated into 50Ω to GND, R1 = 432Ω, R2 = 562Ω, R3 = 301Ω, T
C
= -40°C to +85°C, unless otherwise noted. Typical values are at
V
CC
= +5V, T
C
= +25°C, unless otherwise noted.)
PARAMETER
Supply Voltage
Total Supply Current
Total Power Dissipation
SYMBOL
V
CC
I
TOTAL
Pins 3, 13, 15, 31, 33 all connected to V
CC
CONDITIONS
MIN
4.75
TYP
5.00
292
1460
MAX
5.25
342
1796
UNITS
V
mA
mW
Recommended AC Operating Conditions
PARAMETER
RF Frequency (Note 5)
LO Frequency (Note 5)
IF Frequency (Note 5)
LO Power Range
SYMBOL
f
RF
f
LO
f
IF
P
LO
-3
CONDITIONS
MIN
1500
1500
TYP
MAX
3000
3000
1000
+3
UNITS
MHz
MHz
MHz
dBm
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Maxim Integrated
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2
MAX2022
High-Dynamic-Range, Direct Up/
Downconversion 1500MHz to 3000MHz
Quadrature Modulator/Demodulator
AC Electrical Characteristics (Modulator)
(MAX2022
Typical Application Circuit,
V
CC
= 4.75V to 5.25V, V
GND
= 0V, I/Q differential inputs driven from a 100Ω differential
DC-coupled source, 0V common-mode input, P
LO
= 0dBm, f
LO
= 1900MHz to 2200MHz, 50Ω LO and RF system impedance, R1 =
432Ω, R2 = 562Ω, R3 = 301Ω, T
C
= -40°C to +85°C. Typical values are at V
CC
= 5V, V
BBI
= 109mV
P-P
differential, V
BBQ
= 109mV
P-P
differential, f
IQ
= 1MHz, T
C
= +25°C, unless otherwise noted.) (Notes 6, 7)
PARAMETER
BASEBAND INPUT
Baseband Input Differential
Impedance
BB Common-Mode Input Voltage
Range
Output Power
RF OUTPUTS (f
LO
= 1960MHz)
Output IP3
V
BBI
, V
BBQ
= 547mV
P-P
differential per
tone into 50Ω, f
BB1
= 1.8MHz,
f
BB2
= 1.9MHz
V
BBI
, V
BBQ
= 547mV
P-P
differential per
tone into 50Ω, f
BB1
= 1.8MHz,
f
BB2
= 1.9MHz
21.8
dBm
(Note 8)
T
C
= +25°C
-2.5
-24
43
0
+1.5
Ω
V
dBm
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Output IP2
Output Power
Output Power Variation Over
Temperature
Output-Power Flatness
ACLR (1st Adjacent Channel
5MHz Offset)
LO Leakage
Sideband Suppression
RF Return Loss
Output Noise Density
LO Input Return Loss
RF OUTPUTS (f
LO
= 2140MHz)
Output IP3
48.9
-20.5
dBm
dBm
dB/°C
dB
dBc
dBm
dBc
dB
dBm/Hz
dB
T
C
= -40°C to +85°C
f
LO
= 1960MHz, sweep f
BB
,
P
RF
flatness for f
BB
from 1MHz to 50MHz
Single-carrier WCDMA (Note 9),
RFOUT = -16dBm
No external calibration, with each baseband
input terminated in 50Ω to GND
No external calibration
f
meas
= 2060MHz (Note 10)
-0.004
0.6
70
-46.7
47.3
15.3
-173.4
10.1
V
BBI
, V
BBQ
= 547mV
P-P
differential per
tone into 50Ω, f
BB1
= 1.8MHz,
f
BB2
= 1.9MHz
V
BBI
, V
BBQ
= 547mV
P-P
differential per
tone into 50Ω, f
BB1
= 1.8MHz,
f
BB2
= 1.9MHZ
23.3
dBm
Output IP2
Output Power
Output Power Variation Over
Temperature
Output-Power Flatness
51.5
-20.8
dBm
dBm
dB/°C
dB
T
C
= -40°C to +85°C
f
LO
= 2140MHz, sweep f
BB
,
P
RF
flatness for f
BB
from 1MHz to 50MHz
-0.005
0.32
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Maxim Integrated
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3
MAX2022
High-Dynamic-Range, Direct Up/
Downconversion 1500MHz to 3000MHz
Quadrature Modulator/Demodulator
AC Electrical Characteristics (Modulator) (continued)
(MAX2022
Typical Application Circuit,
V
CC
= 4.75V to 5.25V, V
GND
= 0V, I/Q differential inputs driven from a 100Ω differential
DC-coupled source, 0V common-mode input, P
LO
= 0dBm, f
LO
= 1900MHz to 2200MHz, 50Ω LO and RF system impedance, R1 =
432Ω, R2 = 562Ω, R3 = 301Ω, T
C
= -40°C to +85°C. Typical values are at V
CC
= 5V, V
BBI
= 109mV
P-P
differential, V
BBQ
= 109mV
P-P
differential, f
IQ
= 1MHz, T
C
= +25°C, unless otherwise noted.) (Notes 6, 7)
PARAMETER
ACLR (1st Adjacent Channel
5MHz Offset)
LO Leakage
Sideband Suppression
RF Return Loss
Output Noise Density
LO Input Return Loss
f
meas
= 2240MHz (Note 10)
SYMBOL
CONDITIONS
Single-carrier WCDMA (Note 9),
RFOUT = -16dBm, f
LO
= 2GHz
No external calibration, with each baseband
input terminated in 50Ω to GND
No external calibration
MIN
TYP
70
-40.4
45.7
13.5
-173.2
18.1
MAX
UNITS
dBc
dBm
dBc
dB
dBm/Hz
dB
AC Electrical Characteristics (Demodulator, LO = 1880MHz)
(MAX2022
Typical Application Circuit
when operated as a demodulator. I/Q outputs are recombined using network shown in
Figure 5.
Losses
of combining network not included in measurements. RF and LO ports are driven from 50Ω sources. Typical values are for V
CC
= 5V, I/Q
DC returns = 160Ω resistors to GND, P
RF
= 0dBm, P
LO
= 0dBm, f
RF
= 1890MHz, f
LO
= 1880MHz, f
IF
= 10MHz, T
C
= +25°C, unless
otherwise noted.) (Notes 6, 11)
PARAMETER
Conversion Loss
Noise Figure
Input Third-Order
Intercept Point
Input Second-Order
Intercept Point
LO Leakage at RF Port
Gain Compression
Image Rejection
RF Port Return Loss
LO Port Return Loss
IF Port Differential Impedance
Minimum Demodulation 3dB
Bandwidth
Minimum 1dB Gain Flatness
C9 = 1.2pF
C3 = 22pF
SYMBOL
L
C
NF
SSB
IIP3
f
RF1
= 1890MHz, f
RF2
= 1891MHz,
P
RF1
= P
RF2
= 0dBm, f
IF1
= 10MHz,
f
IF2
= 11MHz
f
RF1
= 1890MHz, f
RF2
= 1891MHz,
P
RF1
= P
RF2
= 0dBm, f
IF1
= 10MHz,
f
IF2
= 11MHz, f
IM2nd
= 21MHz
Unnulled
P
RF
= 20dBm
CONDITIONS
MIN
TYP
9.2
9.4
39
MAX
UNITS
dB
dB
dBm
IIP2
58
-40
0.10
35
17
9
43
>500
>450
dBm
dBm
dB
dB
dB
dB
Ω
MHz
MHz
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Maxim Integrated
│
4
MAX2022
High-Dynamic-Range, Direct Up/
Downconversion 1500MHz to 3000MHz
Quadrature Modulator/Demodulator
AC Electrical Characteristics (Demodulator, LO = 2855MHz)
(MAX2022
Typical Application Circuit
when operated as a demodulator. I/Q outputs are recombined using network shown in
Figure 5.
Losses
of combining network not included in measurements. RF and LO ports are driven from 50Ω sources. Typical values are for V
CC
= 5V, I/Q
DC returns = 160Ω resistors to GND, P
RF
= 0dBm, P
LO
= 0dBm, f
RF
= 2655MHz, f
LO
= 2855MHz, f
IF
= 200MHz, T
C
= +25°C, unless
otherwise noted.) (Notes 6, 11)
PARAMETER
Conversion Loss
Noise Figure
Input Third-Order Intercept Point
SYMBOL
L
C
NF
SSB
IIP3
f
RF1
= 2655MHz, f
RF2
= 2656.2MHz,
P
RF1
= P
RF2
= 0dBm, f
IF1
= 10MHz,
f
IF2
= 198.8MHz
f
RF1
= 2655MHz, f
RF2
= 2656.2MHz,
P
RF1
= P
RF2
= 0dBm, f
IF1
= 200MHz,
f
IF2
= 198.8MHz, f
IM2nd
= 398.8MHz
I+
LO Leakage at IF Port
I-
Q+
Q-
Gain Compression
I/Q Gain Mismatch
I/Q Phase Mismatch
RF Port Return Loss
LO Port Return Loss
IF Port Differential Impedance
Minimum Demodulation 3dB
Bandwidth
Minimum 1dB Gain Flatness
C9 = 22pF, L1 = 4.7nH, C14 = 0.7pF
C3 = 6.8pF
P
RF
= 20dBm
CONDITIONS
MIN
TYP
11.2
11.4
34.5
MAX
UNITS
dB
dB
dBm
Input Second-Order Intercept
Point
LO Leakage at RF Port
IIP2
60
-31.3
-25.2
-23.5
-26
-22.3
0.10
0.3
0.5
22.5
14.2
43
>500
>450
dBm
dBm
dBm
dB
dB
deg
dB
dB
Ω
MHz
MHz
Note 5:
Recommended functional range, not production tested. Operation outside this range is possible, but with degraded perfor-
mance of some parameters.
Note 6:
All limits include external component losses of components, PCB, and connectors.
Note 7:
It is advisable not to operate the I and Q inputs continuously above 2.5V
P-P
differential.
Note 8:
Guaranteed by design and characterization.
Note 9:
Single-carrier WCDMA peak-to-average ratio of 10.5dB for 0.1% complementary cumulative distribution function.
Note 10: No baseband drive input. Measured with the baseband inputs terminated in 50Ω to GND. At low-output power levels, the
output noise density is equal to the thermal noise floor.
Note 11: It is advisable not to operate the RF input continuously above +17dBm.
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