Preliminary
SF2243A
•
•
•
•
•
Low Insertion Loss
Excellent Size-to-performance Ratio
Hermetic 13.3 x 6.5 mm Surface-mount Case
Single-ended Input and Output
Complies with Directive 2002/95/EC (RoHS)
Pb
Value
+18
10
-40 to +85
233 MHz
SAW Filter
Units
dBm
VDC
°C
Absolute Maximum Ratings
Rating
Maximum Incident Power in Passband
Maximum DC Voltage on any Non-ground Terminal
Storage Temperature Range in Tape and Reel
Suitable for Lead-free Soldering - Maximum Soldering Profile
260 °C for 30 s
SMP-53-S
Electrical Specifications
Characteristic
Center Frequency
Maximum Insertion Loss
Passband Ripple, 231.0 to 235.0 MHz
1 dB Bandwidth
3 dB Bandwidth
45 dB Bandwidth
Rejection Referenced to IL
MIN
:
1 to 210 MHz
246 to 400 MHz
Operating Temperature Range
Frequency Temperature Coefficient
Wafer Material
T
A
1
BW
1
BW
3
BW
45
1, 2, 3
45
45
-20
-23
LiTaO
3
50
50
+70
°C
ppm/°C
dB
1, 2
4.0
-
-
Sym
f
C
IL
MAX
Notes
1
Min
Typ
233.0
11.0
0.6
5.3
6.0
8.3
Max
12.0
1.0
-
-
10.0
Units
MHz
dB
dB
P-P
MHz
MHz
MHz
Impedance Matching to 50
Ω
Single-ended Source and Load
Case Style
Lid Symbolization (YY = year, WW = week)
External L-C
SMP-53-S 13.3 x 6.5 mm Nominal Footprint
SF2243A, YYWW
CAUTION: Electrostatic Sensitive Device. Observe precautions for handling.
Notes:
1.
2.
3.
4.
5.
6.
7.
Unless noted otherwise, all specifications apply over the operating temperature range with filter soldered to the specified demonstration board with
impedance matching to 50
Ω
and measured with 50
Ω
network analyzer.
Unless noted otherwise, all frequency specifications are referenced to the nominal center frequency, fc.
Rejection is measured as attenuation below the minimum IL point in the passband. Rejection in final user application is dependent on PCB layout
and external impedance matching design. See Application Note No. 42 for details.
The turnover temperature, T
O
, is the temperature of maximum (or turnover) frequency, f
o
. The nominal frequency at any case temperature, T
c
, may
be calculated from: f=f
o
[1-FTC(T
o
-T
c
)
2
].
The design, manufacturing process, and specifications of this filter are subject to change.
Either Port 1 or Port 2 may be used for either input or output in the design. However, impedances and impedance matching may vary between Port
1 and Port 2, so that the filter must always be installed in one direction per the circuit design.
US and international patents may apply.
www.RFM.com E-mail: info@rfm.com
©2010 by RF Monolithics, Inc.
Page 1 of 5
SF2243A - 12/13/10
SMP-53-S Ceramic Surface-mount 10-terminal Case
13.3 x 6.5 mm Nominal Footprint
Case Dimensions
Dimension
A
B
C
D
E
F
G
Terminals
10
5
All others
Solder Pad
Plating
Lid Plating
Body
Pb Free
mm
Nom
13.3
6.5
2.3
1.91
1.02
1.0
Inches
Nom
.524
.256
.091
.075
.040
0.039
Min
Max
Min
Max
2.00
.078
Electrical Connections
Connection
Input
Output
Case Ground
Case Material
Materials
0.3 to 1.0 µm Gold over 1.27 to 8.89 µm Nickel
2.0 to 3.0 µm Nickel
Al
2
O
3
Ceramic
Typical Matching Network
10
5
WXR=
L1 = 27 nH, C1 = 18 pF, L2 = 33 nH, C2 = 20 pF
Case Outline Drawing
B
G
A
TOP VIEW
www.RFM.com E-mail: info@rfm.com
©2010 by RF Monolithics, Inc.
&
/
(
UHWO L)
:$6
.
/
&
QL=
PCB Footprint (mm)
BOTTOM VIEW
Page 4 of 5
SF2243A - 12/13/10
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