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HD68A43

Description
Secondary Storage Controller, MOS, CDIP40
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size99KB,1 Pages
ManufacturerHitachi (Renesas )
Websitehttp://www.renesas.com/eng/
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HD68A43 Overview

Secondary Storage Controller, MOS, CDIP40

HD68A43 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerHitachi (Renesas )
package instructionDIP, DIP40,.6
Reach Compliance Codeunknown
JESD-30 codeR-XDIP-T40
JESD-609 codee0
Number of terminals40
Maximum operating temperature70 °C
Minimum operating temperature-20 °C
Package body materialCERAMIC
encapsulated codeDIP
Encapsulate equivalent codeDIP40,.6
Package shapeRECTANGULAR
Package formIN-LINE
Certification statusNot Qualified
surface mountNO
technologyMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL

HD68A43 Related Products

HD68A43 HD68B09E HD68A50 HD6809E HD6843 HD68A00 HD68A09E
Description Secondary Storage Controller, MOS, CDIP40 RISC Microprocessor, 8-Bit, 2MHz, MOS, CDIP40 Serial I/O Controller, 1 Channel(s), 0.06103515625MBps, NMOS, CDIP24, CERAMIC, DIP-24 RISC Microprocessor, 8-Bit, 1MHz, MOS, CDIP40 Secondary Storage Controller, MOS, CDIP40 RISC Microprocessor, 8-Bit, 1.5MHz, MOS, CDIP40 RISC Microprocessor, 8-Bit, 1.5MHz, MOS, CDIP40
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible
Maker Hitachi (Renesas ) Hitachi (Renesas ) Hitachi (Renesas ) Hitachi (Renesas ) Hitachi (Renesas ) Hitachi (Renesas ) Hitachi (Renesas )
package instruction DIP, DIP40,.6 DIP, DIP40,.6 DIP, DIP24,.6 DIP, DIP40,.6 DIP, DIP40,.6 DIP, DIP40,.6 DIP, DIP40,.6
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown
JESD-30 code R-XDIP-T40 R-XDIP-T40 R-CDIP-T24 R-XDIP-T40 R-XDIP-T40 R-XDIP-T40 R-XDIP-T40
JESD-609 code e0 e0 e0 e0 e0 e0 e0
Number of terminals 40 40 24 40 40 40 40
Maximum operating temperature 70 °C 70 °C 75 °C 70 °C 70 °C 70 °C 70 °C
Minimum operating temperature -20 °C -20 °C -20 °C -20 °C -20 °C -20 °C -20 °C
Package body material CERAMIC CERAMIC CERAMIC, METAL-SEALED COFIRED CERAMIC CERAMIC CERAMIC CERAMIC
encapsulated code DIP DIP DIP DIP DIP DIP DIP
Encapsulate equivalent code DIP40,.6 DIP40,.6 DIP24,.6 DIP40,.6 DIP40,.6 DIP40,.6 DIP40,.6
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
surface mount NO NO NO NO NO NO NO
technology MOS MOS NMOS MOS MOS MOS MOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL EXTENDED COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
Terminal pitch 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL
bit size - 8 - 8 - 8 8
power supply - 5 V 5 V 5 V - - 5 V
speed - 2 MHz - 1 MHz - 1.5 MHz 1.5 MHz
Nominal supply voltage - 5 V 5 V 5 V - - 5 V
uPs/uCs/peripheral integrated circuit type - MICROPROCESSOR, RISC SERIAL IO/COMMUNICATION CONTROLLER, SERIAL MICROPROCESSOR, RISC - MICROPROCESSOR, RISC MICROPROCESSOR, RISC
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