RISC Microprocessor, 8-Bit, 1.5MHz, MOS, CDIP40
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Hitachi （Renesas ） |
| package instruction | DIP, DIP40,.6 |
| Reach Compliance Code | unknown |
| bit size | 8 |
| JESD-30 code | R-XDIP-T40 |
| JESD-609 code | e0 |
| Number of terminals | 40 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | -20 °C |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP40,.6 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Certification status | Not Qualified |
| speed | 1.5 MHz |
| surface mount | NO |
| technology | MOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR, RISC |
| HD68A00 | HD68B09E | HD68A50 | HD6809E | HD6843 | HD68A09E | HD68A43 | |
|---|---|---|---|---|---|---|---|
| Description | RISC Microprocessor, 8-Bit, 1.5MHz, MOS, CDIP40 | RISC Microprocessor, 8-Bit, 2MHz, MOS, CDIP40 | Serial I/O Controller, 1 Channel(s), 0.06103515625MBps, NMOS, CDIP24, CERAMIC, DIP-24 | RISC Microprocessor, 8-Bit, 1MHz, MOS, CDIP40 | Secondary Storage Controller, MOS, CDIP40 | RISC Microprocessor, 8-Bit, 1.5MHz, MOS, CDIP40 | Secondary Storage Controller, MOS, CDIP40 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | Hitachi （Renesas ） | Hitachi （Renesas ） | Hitachi （Renesas ） | Hitachi （Renesas ） | Hitachi （Renesas ） | Hitachi （Renesas ） | Hitachi （Renesas ） |
| package instruction | DIP, DIP40,.6 | DIP, DIP40,.6 | DIP, DIP24,.6 | DIP, DIP40,.6 | DIP, DIP40,.6 | DIP, DIP40,.6 | DIP, DIP40,.6 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| JESD-30 code | R-XDIP-T40 | R-XDIP-T40 | R-CDIP-T24 | R-XDIP-T40 | R-XDIP-T40 | R-XDIP-T40 | R-XDIP-T40 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| Number of terminals | 40 | 40 | 24 | 40 | 40 | 40 | 40 |
| Maximum operating temperature | 70 °C | 70 °C | 75 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| Minimum operating temperature | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C |
| Package body material | CERAMIC | CERAMIC | CERAMIC, METAL-SEALED COFIRED | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
| encapsulated code | DIP | DIP | DIP | DIP | DIP | DIP | DIP |
| Encapsulate equivalent code | DIP40,.6 | DIP40,.6 | DIP24,.6 | DIP40,.6 | DIP40,.6 | DIP40,.6 | DIP40,.6 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| surface mount | NO | NO | NO | NO | NO | NO | NO |
| technology | MOS | MOS | NMOS | MOS | MOS | MOS | MOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL EXTENDED | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| bit size | 8 | 8 | - | 8 | - | 8 | - |
| speed | 1.5 MHz | 2 MHz | - | 1 MHz | - | 1.5 MHz | - |
| uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | MICROPROCESSOR, RISC | - | MICROPROCESSOR, RISC | - |
| power supply | - | 5 V | 5 V | 5 V | - | 5 V | - |
| Nominal supply voltage | - | 5 V | 5 V | 5 V | - | 5 V | - |
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