DP3S128X32Y5-15C datasheet, PDF

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DP3S128X32Y5-15C: DescriptionSRAM Module, 128KX32, 15ns, CMOS, STACK, TSOP-64; Categorystorage storage; File Size249KB，7 Pages; ManufacturerB&B Electronics Manufacturing Company

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DP3S128X32Y5-15C Overview

SRAM Module, 128KX32, 15ns, CMOS, STACK, TSOP-64

DP3S128X32Y5-15C Parametric

Parameter Name	Attribute value
Maker	B&B Electronics Manufacturing Company
Parts packaging code	QMA
package instruction	,
Contacts	64
Reach Compliance Code	unknown
ECCN code	3A991.B.2.A
Maximum access time	15 ns
Other features	CONFIGURABLE AS 512K X 8
Spare memory width	16
JESD-30 code	R-XQMA-N64
memory density	4194304 bit
Memory IC Type	SRAM MODULE
memory width	32
Number of functions	1
Number of terminals	64
word count	131072 words
character code	128000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	128KX32
Package body material	UNSPECIFIED
Package shape	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	3 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	NO LEAD
Terminal location	QUAD

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4 Meg Based, 10 - 15ns, LP-STACK

30A236-04

4 Megabit 3.3 Volt High Speed SRAM

DP3S128X32Y5

ADVANCED INFORMATION

DESCRIPTION:

The DP3S128X32Y5 is the 128K x 32 SRAM module

the utilize the new and innovative space saving

TSOP stacking technology. The module is

constructed of four 128K x 8 SRAM’s that are

configured as 128K x 32.

The DP3S128X32Y5 provides for a compatible

upgrade path to lower density compatible modules.

The module features high speed access times with

common data inputs and outputs.

PIN NAMES

FEATURES:

•

Organizations Available:

128K x 32, 256K x 16 or 512K x 8

•

Access Times: 10, 12, 15ns

•

Fully Static Operation

- No clock or refresh required

•

Single +3.3V Power Supply, ±10% Tolerance

•

TTL Compatible

•

Common Data Inputs and Outputs

•

Package: 64-Pin TSOP Stack

PIN 1

INDEX

A0 - A16

I/O0 - I/O31

CE0 - CE3

VSS

N.C.

Address

Data Input / Output

Low Chip Enables

Write Enable

Output Enable

Power (+3.3V)

Ground

No Connect

PIN-OUT DIAGRAM

A16

A15

I/O7

I/O6

VSS

VDD

I/O5

I/O4

A14

A13

A12

A11

A10

(TOP VIEW)

FUNCTIONAL BLOCK DIAGRAM

CS0

I/O0

I/O\1

VDD

VSS

I/O2 10

I/O3 11

WE 12

A4 13

A5 14

A6 15

A7 16

30A236-04

REV. A

This document contains information on a product under consideration for

development at Dense-Pac Microsystems, Inc. Dense-Pac reserves the right

to change or discontinue information on this product without prior notice.

DP3S128X32Y5-15C Related Products

	DP3S128X32Y5-15C	DP3S128X32Y5-10C	DP3S128X32Y5-10CI	DP3S128X32Y5-15CI	DP3S128X32Y5-12C	DP3S128X32Y5-12CI
Description	SRAM Module, 128KX32, 15ns, CMOS, STACK, TSOP-64	SRAM Module, 128KX32, 10ns, CMOS, STACK, TSOP-64	SRAM Module, 128KX32, 10ns, CMOS, STACK, TSOP-64	SRAM Module, 128KX32, 15ns, CMOS, STACK, TSOP-64	SRAM Module, 128KX32, 12ns, CMOS, STACK, TSOP-64	SRAM Module, 128KX32, 12ns, CMOS, STACK, TSOP-64
Maker	B&B Electronics Manufacturing Company	B&B Electronics Manufacturing Company	B&B Electronics Manufacturing Company	B&B Electronics Manufacturing Company	B&B Electronics Manufacturing Company	B&B Electronics Manufacturing Company
Parts packaging code	QMA	QMA	QMA	QMA	QMA	QMA
Contacts	64	64	64	64	64	64
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A
Maximum access time	15 ns	10 ns	10 ns	15 ns	12 ns	12 ns
Other features	CONFIGURABLE AS 512K X 8	CONFIGURABLE AS 512K X 8	CONFIGURABLE AS 512K X 8	CONFIGURABLE AS 512K X 8	CONFIGURABLE AS 512K X 8	CONFIGURABLE AS 512K X 8
Spare memory width	16	16	16	16	16	16
JESD-30 code	R-XQMA-N64	R-XQMA-N64	R-XQMA-N64	R-XQMA-N64	R-XQMA-N64	R-XQMA-N64
memory density	4194304 bit	4194304 bit	4194304 bit	4194304 bit	4194304 bit	4194304 bit
Memory IC Type	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE
memory width	32	32	32	32	32	32
Number of functions	1	1	1	1	1	1
Number of terminals	64	64	64	64	64	64
word count	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words
character code	128000	128000	128000	128000	128000	128000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	85 °C	85 °C	70 °C	85 °C
organize	128KX32	128KX32	128KX32	128KX32	128KX32	128KX32
Package body material	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	3 V	3 V	3 V	3 V	3 V	3 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	INDUSTRIAL
Terminal form	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD
Terminal location	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD

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Shortcut: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

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