• 350 Watts Peak Pulse Power per Line(tp = 8/20µs)
• Monolithic Design
• Protects 4 Lines
• Unidirectional & Bidirectional Configurations
• ESD Protection > 25 kilovolts
• Low Clamping Voltage
• Low Leakage Current
• Avaiable in Multiple Voltages
• RoHS Compliant
• REACH Compliant
APPLICATIoNS
• SMART Phones
• Portable Electronics
• FireWire, Ethernet and USB Interfaces
MEChANICAL ChARACTERISTICS
•
•
•
•
Molded JEDEC SOT-23-6 Package
Approximate Weight: 16 milligrams
Lead-Free Pure-Tin Plating (Annealed)
Solder Reflow Temperature:
Pure-Tin - Sn, 100: 260-270°C
• Flammability Rating UL 94V-0
• 8mm Tape and Reel per EIA Standard 481
PIN CoNFIGURATIoNS
1
2
3
6
5
4
1
2
3
BIDIRECTIONAL
6
5
4
UNIDIRECTIONAL
05132.R8 10/12
Page 1
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05132
Only One Name Means ProTek’Tion™
SMS05 - SMS24C
TYPICAL DEVICE ChARACTERISTICS
MAXIMUM RATINGS
@ 25°C Unless otherwise Specified
PARAMETER
Peak Pulse Power (tp = 8/20µs) - See Figure 1
Operating Temperature
Storage Temperature
SYMBoL
P
PP
T
L
T
STG
VALUE
350
-55 to 150
-55 to 150
UNITS
Watts
°C
°C
ELECTRICAL ChARACTERISTICS PER LINE
@ 25°C Unless otherwise Specified
PART
NUMBER
(Notes 1-3)
DEVICE
MARkING
RATED
STAND-oFF
VoLTAGE
V
WM
VoLTS
SMS05
SMS05C
SMS12
SMS12C
SMS15
SMS15C
SMS24
SMS24C
1.
2.
3.
4.
MINIMUM
BREAkDoWN
VoLTAGE
@ 1mA
V
(BR)
VoLTS
6.0
6.0
13.3
13.3
16.7
16.7
26.7
26.7
MAXIMUM
CLAMPING
VoLTAGE
(Fig. 2)
@ I
P
= 1A
V
C
VoLTS
9.8
9.8
19.0
19.0
24.0
24.0
40.0
40.0
MAXIMUM
LEAkAGE
CURRENT
@V
WM
I
D
µA
20
20
1
1
1
1
1
1
TYPICAL
CAPACITANCE
(Note 4)
@0V, 1Mhz
Cj
pF
150
150
80
80
50
50
40
40
PRH
PRL
PRI
PRM
PRJ
PRN
PRK
PRO
5.0
5.0
12.0
12.0
15.0
15.0
24.0
24.0
NoTES
Part numbers with an additional “C” suffix are bidirectional, i.e., SMS05C.
Unidirectional Only: For SMSxx, test between pin 1 to 2 or 5, 4 to 2 or 5, 6 to 2 or 5, 3 to 2 or 5. For SMSxxC, test between 2 to 1, 3, 4, 5, or 6.
Bidirectional Only: For SMSxxC, test between pin 5 to 1 or 3 or 4 or 6. Electrical characteristics apply in both directions.
Unidirectional Only: For SMSxx, capacitance measured between pins 1, 3, 4, 6 to 2. For SMSxxC, capactiance measured between pins 2 to 1, 3, 4, 5, or 6.
05132.R8 10/12
Page 2
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05132
Only One Name Means ProTek’Tion™
SMS05 - SMS24C
TYPICAL DEVICE ChARACTERISTICS
FIGURE 1
PEAk PULSE PoWER VS PULSE TIME
10,000
P
PP
- Peak Pulse Power - Watts
1,000
350W, 8/20µs Waveform
100
10
0.1
1
10
100
t
d
- Pulse Duration - µs
1,000
10,000
120
I
PP
- Peak Pulse Current - % of I
PP
FIGURE 2
PULSE WAVE FoRM
t
f
Peak Value I
PP
TEST
WAVEFORM
PARAMETERS
t
f
= 8µs
t
d
= 20µs
100
80
% of Rated Power
FIGURE 3
PoWER DERATING CURVE
Peak Pulse Power
8/20µs
100
80
60
40
20
0
0
5
e
-t
60
40
20
0
Average Power
t
d
= t/(I
PP
/2)
10
15
t - Time - µs
20
25
30
0
25
50
75 100 125
T
A
- Ambient Temperature - °C
150
05132.R8 10/12
Page 3
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05132
Only One Name Means ProTek’Tion™
SMS05 - SMS24C
TYPICAL DEVICE ChARACTERISTICS
FIGURE 4
oVERShooT & CLAMPING VoLTAGE FoR SMS05C
40
30
5 Volts per Division
20
10
0
ESD Test Pulse - 25 kilovolt, 1/30ns (Waveshape)
160
FIGURE 5
TYPICAL REVERSE VoLTAGE VS CAPACITANCE FoR SMS05
C - Capacitance - pF
120
80
40
0
0
1
2
3
4
V
R
- Reverse Voltage - Volts
5
6
05132.R8 10/12
Page 4
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05132
Only One Name Means ProTek’Tion™
SMS05 - SMS24C
APPLICATIoN INFoRMATIoN
Line 1
Line 2
3
I/O Port
2
1
4
5
6
Line 3
Line 4
FIGURE 1 - CoMMoN-MoDE I/o PoRT PRoTECTIoN (UNIDIRECTIoNAL)
Circuit connectivity is as follows:
• Line 1 connected to pin 1.
• Line 2 connected to pin 3.
• Line 3 connected to pin 4.
• Line 4 connected to pin 6.
• Pin 5 connected to ground.
• Pin 6 not connected.
Line 1
Line 2
3
I/O Port
2
1
4
5
6
Line 3
Line 4
FIGURE 1 - CoMMoN-MoDE I/o PoRT PRoTECTIoN (BIDIRECTIoNAL)
Circuit connectivity is as follows:
• Line 1 connected to pin 1.
• Line 2 connected to pin 3.
• Line 3 connected to pin 4.
• Line 4 connected to pin 5.
• Pin 6 connected to ground.
• Pin 2 not connected.
CIRCUIT BoARD RECoMMENDATIoNS
Circuit board layout is critical for electromagnetic compatibility protection. The following guidelines are recommended:
• The protection device should be placed near the input terminals or connectors, the device will divert the transient current
immediately before it can be coupled into the nearby traces.
• The path length between the TVS device and the protected line should be minimized.
• All conductive loops including power and ground loops should be minimized.
• The transient current return path to ground should be kept as short as possible to reduce parasitic inductance.
• Ground planes should be used whenever possible. For multilayer PCBs, use ground vias.
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