SL2150F/KG/LH3S datasheet, PDF

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SL2150F/KG/LH3S: DescriptionTelecom Circuit, 1-Func, 5 X 5 MM, MO-220VHHD-1, MLP-28; CategoryWireless rf/communication Telecom circuit; File Size582KB，22 Pages; ManufacturerZarlink Semiconductor (Microsemi); Websitehttp://www.zarlink.com/

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SL2150F/KG/LH3S Overview

Telecom Circuit, 1-Func, 5 X 5 MM, MO-220VHHD-1, MLP-28

SL2150F/KG/LH3S Parametric

Parameter Name	Attribute value
Maker	Zarlink Semiconductor (Microsemi)
package instruction	HVQCCN,
Reach Compliance Code	unknown
JESD-30 code	S-XQCC-N28
JESD-609 code	e0
length	5 mm
Number of functions	1
Number of terminals	28
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	UNSPECIFIED
encapsulated code	HVQCCN
Package shape	SQUARE
Package form	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Certification status	Not Qualified
Maximum seat height	1 mm
Nominal supply voltage	5 V
surface mount	YES
Telecom integrated circuit types	TELECOM CIRCUIT
Temperature level	INDUSTRIAL
Terminal surface	TIN LEAD
Terminal form	NO LEAD
Terminal pitch	0.5 mm
Terminal location	QUAD
width	5 mm

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SL2150F

Front End Power Splitter with AGC

Data Sheet

October

2005

Features

•

Single chip quadruple power splitter (primary

channel, secondary channel, OOB channel and

loop through)

Wide dynamic range on all channels

Independent AGC facility incorporated into all

channel paths

CSO, CTB, CXM all better than -62dBc for

+3dBmV agc attack point

Full ESD protection. (Normal ESD handling

procedures should be observed)

Ordering Information

SL2150F/KG/LH2S 28 Pin QFN Tubes

SL2150F/KG/LH2T 28 Pin QFN Tape & Reel

SL2150F/KG/LH3T 28 Pin QFN* Tape & Reel

SL2150F/KG/LH3S 28 Pin QFN* Tubes

*Pb Free Matte Tin

•

Description

The SL2150F is a wide dynamic range single chip power

splitter for cable set top box multi-tuner applications.

The device offers four buffered outputs from a single

input.

All signal paths contain an independently controllable

AGC facility.

Applications

•

Multi-tuner cable set top box and cable modem

applications

Data communications systems

Terrestrial TV tuner loop though

AGC1

AGC2

AGC3

AGC4

AGC

Control

RFOUT1

RFOUT1B

AGC

Control

RFINPUT

RFINPUTB

Power

Splitter

AGC

Control

RFOUT2

RFOUT2B

RFOUT3

RFOUT3B

AGC

Control

RFOUT4

RFOUT4B

Figure 1 - SL2150F Block Diagram

Zarlink Semiconductor Inc.

Zarlink, ZL and the Zarlink Semiconductor logo are trademarks of Zarlink Semiconductor Inc.

SL2150F

2.0

Functional Description

Data Sheet

The SL2150F is a broadband wide dynamic range power splitter with AGC and is optimized for application in multi

tuner cable set top box applications. It also has application in any system where a wide dynamic range broadband

power splitter is required.

The pin assignment is contained in Figure 2 and the block diagram in Figure 1. The port internal peripheral circuits

are contained in Figure 15 - "Port Peripheral Circuitry".

In normal application the RF input is interfaced to the device input. The input preamplifier is designed for low noise

figure, within the operating region of 50 to 860 MHz and for high intermodulation distortion intercept so offering good

signal to noise plus composite distortion spurious performance when loaded with a multi carrier system. The

preamplifier when combined with the input network shown in Figure 3 - "RF Input Matching Network" provides an

impedance match to a 75

Ω

source. The typical impedance is shown in Figure 4 - "Typical Single-Ended RF Input

Impedance with Input Match".

The input NF and input referred two-tone intermodulation test condition spectrum are shown in Figure 5 - "Input NF

at 25 deg C" and Figure 6 - "Two Tone Intermodulation Test Condition Spectrum, Input Referred" respectively.

The output of the preamplifier is then power split to four independently controlled AGC stages.

Each AGC stage provides for a minimum of 30 dB of gain control across the input frequency range. The typical AGC

characteristic and NF versus gain setting are contained in Figure 7 - "Typical AGC versus Control Voltage

Characteristic" and Figure 8 - "Typical Variation in NF versus Gain Setting" respectively.

The input referred third order intercept point is independent of gain setting.

Finally, each of the AGC stages drive an output buffer of nominal differential output impedance of 440Ω, which

provides a nominal 5.5 dB of conversion gain when terminated into a differential 75Ω load.

In application it is important to avoid saturation of the output stage, therefore it is recommended that the output

standing current be sunk to Vcc through an inductor. A resistive pull up can also be used as shown in Figure 14 -

"Example Application Driving 200 Ohm Load with Resistive Pull Up", however the resistor values should not exceed

38 ohm single ended.

If an inductive current sink is used the maximum available gain from the device is circa 20 dB. This gain can be

reduced by application of an external load between the differential output ports. The gain can be approximately

calculated from the following formula:

GAIN = 20*log ((Parallel combination of 440 ohm and external load between ports) / 44 ohm) + 2dB

For example, when driving a 200 ohm load as in Figure 13 - "Example Application Driving 200 Ohm Load with

Inductive Pull Up", the gain equals

Gain

= 20 *log ((440 * 200)/(440+200)/44) +2dB

= 12dB.

Zarlink Semiconductor Inc.

SL2150F/KG/LH3S Related Products

	SL2150F/KG/LH3S	SL2150F/KG/LH3T
Description	Telecom Circuit, 1-Func, 5 X 5 MM, MO-220VHHD-1, MLP-28	Telecom Circuit, 1-Func, 5 X 5 MM, MO-220VHHD-1, MLP-28
Maker	Zarlink Semiconductor (Microsemi)	Zarlink Semiconductor (Microsemi)
package instruction	HVQCCN,	HVQCCN,
Reach Compliance Code	unknown	unknown
JESD-30 code	S-XQCC-N28	S-XQCC-N28
JESD-609 code	e0	e3
length	5 mm	5 mm
Number of functions	1	1
Number of terminals	28	28
Maximum operating temperature	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C
Package body material	UNSPECIFIED	UNSPECIFIED
encapsulated code	HVQCCN	HVQCCN
Package shape	SQUARE	SQUARE
Package form	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Certification status	Not Qualified	Not Qualified
Maximum seat height	1 mm	1 mm
Nominal supply voltage	5 V	5 V
surface mount	YES	YES
Telecom integrated circuit types	TELECOM CIRCUIT	TELECOM CIRCUIT
Temperature level	INDUSTRIAL	INDUSTRIAL
Terminal surface	TIN LEAD	MATTE TIN
Terminal form	NO LEAD	NO LEAD
Terminal pitch	0.5 mm	0.5 mm
Terminal location	QUAD	QUAD
width	5 mm	5 mm

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