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W3DG6416V75D2

Description
Synchronous DRAM Module, 16MX64, CMOS, DIMM-168
Categorystorage    storage   
File Size130KB,5 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
Download Datasheet Parametric Compare View All

W3DG6416V75D2 Overview

Synchronous DRAM Module, 16MX64, CMOS, DIMM-168

W3DG6416V75D2 Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerMicrosemi
Parts packaging codeDIMM
package instructionDIMM,
Contacts168
Reach Compliance Codecompliant
ECCN codeEAR99
access modeFOUR BANK PAGE BURST
Other featuresAUTO/SELF REFRESH
JESD-30 codeR-XDMA-N168
memory density1073741824 bit
Memory IC TypeSYNCHRONOUS DRAM MODULE
memory width64
Number of functions1
Number of ports1
Number of terminals168
word count16777216 words
character code16000000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize16MX64
Package body materialUNSPECIFIED
encapsulated codeDIMM
Package shapeRECTANGULAR
Package formMICROELECTRONIC ASSEMBLY
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
self refreshYES
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)3.3 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formNO LEAD
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
White Electronic Designs
128MB- 16Mx64 SDRAM UNBUFFERED
FEATURES
PC100 and PC133 compatible
Burst Mode Operation
Auto and Self Refresh capability
LVTTL compatible inputs and outputs
Serial Presence Detect with EEPROM
Fully synchronous: All signals are registered on
the positive edge of the system clock
Programmable Burst Lengths: 1, 2, 4, 8 or Full
Page
3.3V 6 0.3v Power Supply
168 pin DIMM JEDEC
W3DG6416V-D2
DESCRIPTION
The W3DG6416V is a 16Mx64 synchronous DRAM
module which consists of eight 8Mx16 SDRAM
components in TSOP II package and one 2K EEPROM
in an 8 pin TSSOP package for Serial Presence Detect
which are mounted on a 168 pin DIMM multilayer FR4
Substrate.
PIN CONFIGURATIONs (FRONT SIDE/BACK SIDE)
PIN FRONT PIN
1
V
SS
29
2
DQ0
30
3
DQ1
31
4
DQ2
32
5
DQ3
33
34
6
V
CC
7
DQ4
35
8
DQ5
36
9
DQ6
37
10
DQ7
38
11
DQ8
39
40
12
V
SS
13
DQ9
41
14 DQ10
42
15
DQ11
43
16 DQ12
44
17 DQ13
45
18
V
CC
46
19 DQ14
47
20 DQ15
48
21
NC
49
22
NC
50
23
V
SS
51
24
NC
52
25
NC
53
54
26
V
CC
27
WE#
55
28 DQM0 56
FRONT
DQM1
CS0
DNU
V
SS
A0
A2
A4
A6
A8
A10/AP
BA1
V
CC
V
CC
CK0
V
SS
DNU
CS2
DQM2
DQM3
DNU
V
CC
NC
NC
NC
NC
V
SS
DQ16
DQ17
PIN FRONT PIN
57 DQ18 85
58 DQ19 86
87
59
V
CC
60 DQ20 88
61
NC
89
62
NC
90
63 CKE1 91
92
64
V
SS
65 DQ21 93
66 DQ22 94
67 DQ23 95
68
V
SS
96
69 DQ24 97
70 DQ25 98
71 DQ26 99
72 DQ27 100
101
73
V
CC
74 DQ28 102
75 DQ29 103
76 DQ30 104
77 DQ31 105
78
V
SS
106
79
CK2 107
80
NC
108
81
*WP 109
82 **SDA 110
83 **SCL 111
112
84
V
CC
BACK
V
SS
DQ32
DQ33
DQ34
DQ35
V
CC
DQ36
DQ37
DQ38
DQ39
DQ40
V
SS
DQ41
DQ42
DQ43
DQ44
DQ45
V
CC
DQ46
DQ47
NC
NC
V
SS
NC
NC
V
CC
CAS#
DQM4
PIN
113
114
115
116
117
118
119
120
121
122
123
124
125
126
127
128
129
130
131
132
133
134
135
136
137
138
139
140
BACK
DQM5
CS1
RAS#
V
SS
A1
A3
A5
A7
A9
BA0
A11
V
CC
NC
NC
V
SS
CKE0
CS3
DQM6
DQM7
NC
V
CC
NC
NC
NC
NC
V
SS
DQ48
DQ49
PIN
141
142
143
144
145
146
147
148
149
150
151
152
153
154
155
156
157
158
159
160
161
162
163
164
165
166
167
168
BACK
DQ50
DQ51
V
CC
DQ52
NC
NC
DNU
V
SS
DQ53
DQ54
DQ55
V
SS
DQ56
DQ57
DQ58
DQ59
V
CC
DQ60
DQ61
DQ62
DQ63
V
SS
NC
NC
**SA0
**SA1
**SA2
V
CC
A0 – A11
BA0-1
DQ0-63
CK0,CK2
CKE0,CKE1
CS0-CS3
RAS#
CAS#
WE#
DQM0-7
V
CC
V
SS
SDA
SCL
DNU
NC
PIN NAMES
Address input (Multiplexed)
Select Bank
Data Input/Output
Clock input
Clock Enable input
Chip select Input
Row Address Strobe
Column Address Strobe
Write Enable
DQM
Power Supply (3.3V)
Ground
Serial data I/O
Serial clock
Do not use
No Connect
* WP (write protect) option is available on
pin 81, see ordering information on page 5.
** These pins should be NC in the system which
does not support SPD.
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
June 2003
Rev. 1
1
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com

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Description Synchronous DRAM Module, 16MX64, CMOS, DIMM-168 Synchronous DRAM Module, 16MX64, CMOS, DIMM-168 Synchronous DRAM Module, 16MX64, CMOS, DIMM-168 Synchronous DRAM Module, 16MX64, CMOS, DIMM-168 Synchronous DRAM Module, 16MX64, CMOS, DIMM-168 Synchronous DRAM Module, 16MX64, CMOS, DIMM-168
Maker Microsemi Microsemi Microsemi Microsemi Microsemi Microsemi
Parts packaging code DIMM DIMM DIMM DIMM DIMM DIMM
package instruction DIMM, DIMM, DIMM, DIMM, DIMM, DIMM,
Contacts 168 168 168 168 168 168
Reach Compliance Code compliant compliant compliant compliant compli compli
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
access mode FOUR BANK PAGE BURST FOUR BANK PAGE BURST FOUR BANK PAGE BURST FOUR BANK PAGE BURST FOUR BANK PAGE BURST FOUR BANK PAGE BURST
Other features AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH
JESD-30 code R-XDMA-N168 R-XDMA-N168 R-XDMA-N168 R-XDMA-N168 R-XDMA-N168 R-XDMA-N168
memory density 1073741824 bit 1073741824 bit 1073741824 bit 1073741824 bit 1073741824 bi 1073741824 bi
Memory IC Type SYNCHRONOUS DRAM MODULE SYNCHRONOUS DRAM MODULE SYNCHRONOUS DRAM MODULE SYNCHRONOUS DRAM MODULE SYNCHRONOUS DRAM MODULE SYNCHRONOUS DRAM MODULE
memory width 64 64 64 64 64 64
Number of functions 1 1 1 1 1 1
Number of ports 1 1 1 1 1 1
Number of terminals 168 168 168 168 168 168
word count 16777216 words 16777216 words 16777216 words 16777216 words 16777216 words 16777216 words
character code 16000000 16000000 16000000 16000000 16000000 16000000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
organize 16MX64 16MX64 16MX64 16MX64 16MX64 16MX64
Package body material UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED
encapsulated code DIMM DIMM DIMM DIMM DIMM DIMM
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
self refresh YES YES YES YES YES YES
Maximum supply voltage (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) 3 V 3 V 3 V 3 V 3 V 3 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
surface mount NO NO NO NO NO NO
technology CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal form NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL
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