UPD70F3613M1GBA2-GAH-AX datasheet, PDF

Datasheet> All Categories > The embedded processor and controller> Microcontrollers and processors> UPD70F3613M1GBA2-GAH-AX

Preview

UPD70F3613M1GBA2-GAH-AX: DescriptionUPD70F3613M1GBA2-GAH-AX; CategoryThe embedded processor and controller Microcontrollers and processors; File Size756KB，38 Pages; ManufacturerRenesas Electronics Corporation; Websitehttps://www.renesas.com/; Environmental Compliance

Download Datasheet Download user manual Parametric View All

UPD70F3613M1GBA2-GAH-AX Overview

UPD70F3613M1GBA2-GAH-AX

UPD70F3613M1GBA2-GAH-AX Parametric

Parameter Name	Attribute value
Brand Name	Renesas
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Renesas Electronics Corporation
Parts packaging code	LFQFP
package instruction	LFQFP, QFP64,.47SQ,20
Contacts	64
Manufacturer packaging code	PLQP0064KF-B64
Reach Compliance Code	compliant
Has ADC	YES
Address bus width
bit size	32
CPU series	V850
maximum clock frequency	16 MHz
DAC channel	NO
DMA channel	YES
External data bus width
JESD-30 code	S-PQFP-G64
length	10 mm
Number of I/O lines	51
Number of terminals	64
Maximum operating temperature	125 °C
Minimum operating temperature	-40 °C
PWM channel	YES
Package body material	PLASTIC/EPOXY
encapsulated code	LFQFP
Encapsulate equivalent code	QFP64,.47SQ,20
Package shape	SQUARE
Package form	FLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	3.3/5.5 V
Certification status	Not Qualified
RAM (bytes)	12288
rom(word)	196608
ROM programmability	FLASH
Filter level	AEC-Q100
Maximum seat height	1.7 mm
speed	20 MHz
Maximum slew rate	35 mA
Maximum supply voltage	5.5 V
Minimum supply voltage	3.3 V
surface mount	YES
technology	CMOS
Temperature level	AUTOMOTIVE
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	10 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER, RISC

User Manual

Preview

Download Datasheet

View All

Datasheet

V850ES/FE3-L

32-bit Single-Chip Microcontroller

Hardware

µPD70F3610(A)

µPD70F3610(A1)

µPD70F3610(A2)

µPD70F3613(A)

µPD70F3613(A1)

µPD70F3613(A2)

µPD70F3611(A)

µPD70F3611(A1)

µPD70F3611(A2)

µPD70F3614(A)

µPD70F3614(A1)

µPD70F3614(A2)

µPD70F3612(A)

µPD70F3612(A1)

µPD70F3612(A2)

Document No. U19190EE1V0DS00

Date Published March 2008

NEC Electronics 2008

Printed in Germany

V850ES/FE3-L

Notes for CMOS Devices

Precaution against ESD for semiconductors

Strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and

ultimately degrade the device operation. Steps must be taken to stop generation of static electricity

as much as possible, and quickly dissipate it once, when it has occurred. Environmental control

must be adequate. When it is dry, humidifier should be used. It is recommended to avoid using

insulators that easily build static electricity. Semiconductor devices must be stored and transported

in an anti-static container, static shielding bag or conductive material. All test and measurement

tools including work bench and floor should be grounded. The operator should be grounded using

wrist strap. Semiconductor devices must not be touched with bare hands. Similar precautions need

to be taken for PW boards with semiconductor devices on it.

Handling of unused input pins for CMOS

No connection for CMOS device inputs can be cause of malfunction. If no connection is provided to

the input pins, it is possible that an internal input level may be generated due to noise, etc., hence

causing malfunction. CMOS devices behave differently than Bipolar or NMOS devices. Input levels

of CMOS devices must be fixed high or low by using a pull-up or pull-down circuitry. Each unused

pin should be connected to VDD or GND with a resistor, if it is considered to have a possibility of

being an output pin. All handling related to the unused pins must be judged device by device and

related specifications governing the devices.

Status before initialization of MOS devices

Power-on does not necessarily define initial status of MOS device. Production process of MOS

does not define the initial operation status of the device. Immediately after the power source is

turned ON, the devices with reset function have not yet been initialized. Hence, power-on does not

guarantee out-pin levels, I/O settings or contents of registers. Device is not initialized until the reset

signal is received. Reset operation must be executed immediately after power-on for devices

having reset function.

Datasheet U19190EE1V0DS00

V850ES/FE3-L

Legal Notes

• The information in this document is current as of January 2007. The information is subject to change

without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or

data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all products

and/or types are available in every country. Please check with an NEC sales representative for

availability and additional information.

• No part of this document may be copied or reproduced in any form or by any means without prior

written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that

may appear in this document.

• NEC Electronics does not assume any liability for infringement of patents, copyrights or other

intellectual property rights of third parties by or arising from the use of NEC Electronics products

listed in this document or any other liability arising from the use of such NEC Electronics products.

No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual

property rights of NEC Electronics or others.

• Descriptions of circuits, software and other related information in this document are provided for

illustrative purposes in semiconductor product operation and application examples. The incorporation

of these circuits, software and information in the design of customer's equipment shall be done under

the full responsibility of customer. NEC Electronics assumes no responsibility for any losses incurred

by customers or third parties arising from the use of these circuits, software and information.

• While NEC Electronics endeavors to enhance the quality, reliability and safety of NEC Electronics

products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated

entirely. To minimize risks of damage to property or injury (including death) to persons arising from

defects in NEC Electronics products, customers must incorporate sufficient safety measures in their

design, such as redundancy, fire-containment and anti-failure features.

• NEC Electronics products are classified into the following three quality grades: “Standard”, “Special”

and “Specific”.

The "Specific" quality grade applies only to NEC Electronics products developed based on a

customer-designated “quality assurance program” for a specific application. The recommended

applications of NEC Electronics product depend on its quality grade, as indicated below. Customers

must check the quality grade of each NEC Electronics product before using it in a particular

application.

"Standard":

Computers, office equipment, communications equipment, test and

measurement equipment, audio and visual equipment, home electronic

appliances, machine tools, personal electronic equipment and industrial robots.

"Special":

Transportation equipment (automobiles, trains, ships, etc.), traffic control

systems, anti-disaster systems, anti-crime systems, safety equipment and

medical equipment (not specifically designed for life support).

"Specific":

Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control

systems, life support systems and medical equipment for life support, etc.

The quality grade of NEC Electronics products is “Standard” unless otherwise expressly specified in

NEC Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products

in applications not intended by NEC Electronics, they must contact NEC Electronics sales

representative in advance to determine NEC Electronics 's willingness to support a given application.

Notes: 1.

"NEC Electronics" as used in this statement means NEC Electronics Corporation and also

includes its majority-owned subsidiaries.

"NEC Electronics products" means any product developed or manufactured by or for NEC

Electronics (as defined above).

SuperFlash® is a registered trademark of Silicon Storage Technology, Inc. in several coun-

tries including the United States and Japan. This product uses SuperFlash® technology

licensed from Silicon Storage Technology, Inc.

Datasheet U19190EE1V0DS00

V850ES/FE3-L

Table of Contents

1.1

1.2

1.3

1.4

1.5

1.6

1.7

Pin Group Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Device package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Pin Groups 1x: Pins supplied by EVDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Pin Groups 2x: Pins supplied by EVDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Pin Groups 3x: Pins supplied by BVDD. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Pin Groups 4: Pins supplied by AVREF0. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Pin Groups 6: Pins supplied by EVDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Pin Groups 7: Pins supplied by VRO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

2.1

2.2

2.3

2.4

2.5

2.5.1

2.5.2

2.5.3

2.5.4

2.6

2.6.1

2.6.2

2.6.3

2.6.3.1

2.7

2.7.1

2.7.2

2.7.3

2.7.4

2.7.5

2.7.6

2.7.7

2.7.8

2.8

2.9

2.10

2.11

2.12

2.13

Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Capacities . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Operating condition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Voltage Regulator Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Clock Generator Circuit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Main System Clock Oscillation Circuit Characteristics . . . . . . . . . . . . . . . . . . . . . . 11

Sub System Clock Oscillation Circuit Characteristics . . . . . . . . . . . . . . . . . . . . . . . 12

Internal-OSC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

PLL Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Input/Output Level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

PIN leakage current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Power supply current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

FE3-L µPD70F3610, µPD70F3611, µPD70F3612, µPD70F3613, µPD70F3614 . . . . . 16

AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

CLKOUT Output Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

RESET, Interrupt, ADTRG Timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Key Return Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Timer Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

CSI Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

UART Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

IIC Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

CAN Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

A/D Converter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

POC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

LVI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

RAM Retention Flag . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

Data Retention Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

Flash Memory Programming Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

3.1

3.2

3.2.1

3.2.2

Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

Package Dimension . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

Product Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

Marking of pin 1 at a QFP (Quad Flat Package) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

Identification of Lead-Free Products . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

Change History. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

Datasheet U19190EE1V0DS00

Recommended Resources

Using a single transistor to build a smart battery charger circuit diagram

Discrete component sound and light control stair delay switch circuit (10)

Transformed into a 12V regulated power supply circuit

Using a fixed three-terminal voltage stabilizing integrated circuit to make an adjustable DC voltage stabilizing power supply circuit

Firecracker sound controlled lantern control circuit

DN35 typical application circuit diagram c

Shortcut: S0 S1 S2 S3 S4 S5 S6 S7 S8 S9 SA SB SC SD SE SF SG SH SI SJ SK SL SM SN SO SP SQ SR SS ST SU SV SW SX SY SZ T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 TA TB TC TD TE TF TG TH TI TJ TK TL TM TN TO TP TQ TR TS TT TU TV TW TX TY TZ U0 U1 U2 U3 U4 U6 U7 U8 UA UB UC UD UE UF UG UH UI UJ UK UL UM UN UP UQ UR US UT UU UV UW UX UZ V0 V1 V2 V3 V4 V5 V6 V7 V8 V9 VA VB VC VD VE VF VG VH VI VJ VK VL VM VN VO VP VQ VR VS VT VU VV VW VX VY VZ W0 W1 W2 W3 W4 W5 W6 W7 W8 W9 WA WB WC WD WE WF WG WH WI WJ WK WL WM WN WO WP WR WS WT WU WV WW WY X0 X1 X2 X3 X4 X5 X7 X8 X9 XA XB XC XD XE XF XG XH XK XL XM XN XO XP XQ XR XS XT XU XV XW XX XY XZ Y0 Y1 Y2 Y4 Y5 Y6 Y9 YA YB YC YD YE YF YG YH YK YL YM YN YP YQ YR YS YT YX Z0 Z1 Z2 Z3 Z4 Z5 Z6 Z8 ZA ZB ZC ZD ZE ZF ZG ZH ZJ ZL ZM ZN ZP ZR ZS ZT ZU ZV ZW ZX ZY

Popular Components