hochtemperaturbeständig, Liefermöglichkeiten auf Anfrage
Standard /
Standard
Mounting Type
/
Befestigungsarten
W
T
Z
Float mounted (see page 15)
/
Schwimmend (siehe Seite15)
Clinch nut 4-40 UNC (see page 59)
/
Einnietmutter 4-40 UNC (siehe Seite 59)
Clinch nut M3 (see page 59)
/
Einnietmutter M3 (siehe Seite 59)
Einnietmutter 4-40 UNC, selbstsichernd (siehe Seite 59)
Einnietmutter M3, selbstsichernd (siehe Seite 59)
TS
Clinch nut 4-40 UNC, self locking (see page 59)
ZS
Clinch nut M3, self locking (see page 59)
No. of Contacts /
Polzahl
Shell size /
Gehäusegröße
09
1
15
2
25
3
37
4
50
5
Contact Type /
Kontaktart
P
Pin contacts /
Stiftkontakte
S
Socket contacts /
Buchsenkontakte
Contact Design (e. g.)
/
Kontaktvariante (z. B.)
0
1
4
5
14
Solder pot
/
Löttopf
Straight PCB termination /
Leiterplattenanschluss, gerade
Wire-wrap /
Wire Wrap
Right angled PCB termination /
Leiterplattenanschluss, abgewinkelt
Straight PCB termination
/
Leiterplattenanschluss, gerade
For more contacts see page 16 onwards
/
Weitere Kontakte siehe Seite 16 ff.
Machined contacts /
Gedrehte Kontakte
S
Stamped contacts
/
Gestanzte Kontakte
Direction of Right Angled Contacts
/
Richtung der abgewinkelten Kontakte
Standard /
Standard
R
Reverse (Not available with stamped contacts)
/
Revers (nicht mit gestanzten Kontakten möglich)
Performance Classes Available in Accordance with DIN 41652
/
Lieferbare Gütestufen nach DIN 41652
Standard insulator /
Standardisolierkörper
G1
= 500 Contact cycles
/
Steckzyklen
= Performance class 1
/
Gütestufe 1
G2
= 200 Contact cycles
/
Steckzyklen
= Performance class 2
/
Gütestufe 2
G3
= 50 Contact cycles
/
Steckzyklen
= Performance class 3
/
Gütestufe 3
Pin connector with dimples
/
Stiftsteckverbinder mit Kontaktnoppen
FM insulator /
FM-Isolierkörper
All connectors are in accordance with the standards of performance class 1; no performance class
number necessary! (1.3 µm (51 microinches) Au over Ni)
Alle Steckverbinder erfüllen die Anforderungen der Gütestufe 1; Typenbezeichnung ohne Gütestufen!
(1,3 µm Au über Ni)
Modifications
/
Modifikationen
ALL DIMENSIONS IN MILLIMETERS - VALUES FOR INCHES IN BRACKETS - TECHNICAL DATA SUBJECT TO CHANGE
DS 10/2007
9
Technical Data
Technische Daten
Mechanical Data
Mechanische Daten
Mechanical Data
Mechanische Daten
Mating force per signal contact
Steckkraft pro Signalkontakt
Unmating force per signal contact
Ziehkraft pro Signalkontakt
max. torque *
max. Anzugsmoment *
* Not for locking screws
* Nicht für Verriegelungsschrauben
3,4 N
0,2 N
40 Ncm (0,295 ft.lb.)
40 Ncm
Electrical Data
Elektrische Daten
Electrical Data
Elektrische Daten
Current rating at room temperature
Maximale Stromstärke bei Raumtemperatur
Test voltage between 2 contacts / shell and contact
Prüfspannung zwischen 2 Kontakten bzw. Kontakt und Gehäuse
Meets transition resistance requirements per contact pair in line with DIN 41652:
Erfüllt Übergangswiderstand pro Kontaktpaar nach DIN 41652 für:
- Straight contacts
/
gerade Kontakte
- Right angled contacts
/
abgewinkelte Kontakte
- Right angled contacts - 50 way
/
abgewinkelte Kontakte bei 50 Polen
Insulation resistance between contacts
Isolationswiderstand Kontakt / Kontakt
Volume resistivity
Spezifischer Durchgangswiderstand
Dielectric strength
Spezifische Durchschlagsfestigkeit
5A
1200 V / 1 min.
10 m
25 m
35 m
5000 M
10
16
cm
50 kV / mm
Materials and Platings
Materialien und Oberflächen
Materials and Platings
Materialien und Oberflächen
Shell
Gehäuse
Type /
Type
Insulator
Isolierkörper
Steel
Stahl
FH
Polyester, heat resistant,
glass filled (UL94V-0), natural
Polyester,
hochtemperaturbeständig,
glasfaserverstärkt (UL94V-0), natur
150 °C (302 °F)
F
Polyester, glass filled
(UL94V-0), white
Polyester, glasfaserverstärkt
(UL94V-0), weiß
FM
Polyester, glass filled (UL94V-0),
green
Polyester, glasfaserverstärkt
(UL94V-0), grün
Relative temperature index according
to UL 746 B
rel.
Temperaturindex nach
UL 746 B
Heat deflection temperature limit
according to DIN 53461 HDT/A
Formbeständigkeitstemperatur nach
DIN 53461 HDT/A
Sub temperature limit
Untere Grenztemperatur
Shell plating (standard)
Gehäuseoberfläche (Standard)
Shell (standard)
Gehäuse (Standard)
Shell (K120)
Gehäuse (K120)
125 °C (257 °F)
130 °C (266 °F)
200 °C (392 °F)
255 °C ( 491 °F)
210 °C (410 °F)
-55 °C (-67 °F)
Tin plated over nickel
verzinnt über Nickel
-55 °C (-67 °F)
-55 °C (-67 °F)
Yellow chromate over zinc plating
Not RoHS compliant
verzinkt und gelb chromatiert
nicht RoHS konform
Pin connector shell without dimples
Stiftsteckverbindergehäuse ohne
Kontaktnoppen
Tin plated over nickel, pin connector
shell
with
dimples
verzinnt über Nickel,
Stiftsteckverbindergehäuse
mit
Kontaktnoppen
Tin plated over nickel, pin connector
shell
without
dimples
verzinnt über Nickel,
Stiftsteckverbindergehäuse
ohne
Kontaktnoppen
Pin connector shell with dimples
Stiftsteckverbindergehäuse mit Kontaktnoppen
Shell (K121)
Gehäuse (K121)
Contact material
Kontaktmaterial
Copper alloy
Kupfer-Legierung
10
DS 10/2007
TECHNISCHE ÄNDERUNGEN VORBEHALTEN – MAßE IN MILLIMETER (INCHES IN KLAMMERN)
Technical Data
Technische Daten
Modifications
Modifikationen
All FCT D-Sub connectors (including crimp versions etc.) are available in many different combinations of materials and platings. For example, shells can
be supplied in a non – magnetic version made of brass, which can be electroless nickel, or gold plated for use in aerospace technology.
Alle FCT D-Sub Steckverbinder (auch Crimp Versionen, usw.) sind in vielen verschiedenen Material- und Oberflächenkombinationen erhältlich. So z. B.
Gehäuse in nichtmagnetischer Ausführung aus Messing bzw. chemisch vernickelte oder vergoldete Gehäuse für Luft- und Raumfahrtanwendungen.
Contact Arrangements
Polbilder
Face view of socket connector
Blick auf Steckseite Buchsensteckverbinder
Face view of pin connector
Blick auf Steckseite Stiftsteckverbinder
Shell Size
Gehäusegröße
Number of Contacts
Polzahl
Pin Connector, Connecting Side
Stiftsteckverbinder, Ansicht steckseitig
1
9
2
15
3
25
4
37
5
50
DS 10/2007
ALL DIMENSIONS IN MILLIMETERS - VALUES FOR INCHES IN BRACKETS - TECHNICAL DATA SUBJECT TO CHANGE
If you have mature products based on RFID, barcode and wireless network integrated applications, such as warehouse wireless operation system, MES collection system, production traceability system, etc...
[b][color=#ff0000]5. Timer [/color][/b] The timer is an important part that is often used in MSP430 application systems. [color=#ff0000](I) The functions that can be realized are: [/color] 1. Timing c...
[size=4]Experiments have shown that radio waves, microwaves, infrared rays, visible light, ultraviolet rays, gamma rays, etc. are all electromagnetic waves, but the sources of the waves are different,...
My graduation project is a solar lighting system based on Zigbee, but I have no idea how to get started with Zigbee:~o I am completely confused about CC2430, protocols, and networks:faint: I would lik...
The project is urgent, I would like to ask an expert for help. In the IAR environment, how to define the starting address of the program in C language? The assembly is the ORG instruction, how should ...
introduction
With the continuous optimization of surface mount technology (SMT) and the rapid development of chip component manufacturing technology, the application of chip mounters in the el...[Details]
1. Introduction
Automobile pollution is one of the most important issues that people are most concerned about and need to solve urgently. As an important method for detecting automobile exhau...[Details]
Images in science fiction movies often break through the limits of reality, such as in the movie "Minority Report." Tom Cruise uses a multi-touch screen to browse information. Capacitive sensing te...[Details]
From the PIC16F946 datasheet, we know that there are two ways to write values to the LCD for display:
1. Directly write the value to LCDDATA1~LCDDATA23
2. Use disconnect t...[Details]
A multi-point temperature control heating control system was designed using the SST89E564RC single-chip microcomputer and a new temperature measuring device. The heating system can be controlled in...[Details]
A standard cell
is an electrochemical
cell
used as a voltage reference standard in many electrical standards laboratories
. If properly maintained, standard cells are very stable. The ...[Details]
my country is a big country in agriculture, grain production and consumption. Grains are a necessary condition for our nation to survive and develop. The flour processing industry will exist forever w...[Details]
Xiaomi, a well-known Internet phone in mainland China, won a million-unit order contract from China Unicom on November 20 last year, which made Xiaomi famous in mainland China. In April this year...[Details]
Experimental tasks
A DS18B20 is used to form a temperature measurement system. The temperature measurement accuracy reaches 0.1 degrees. The temperature range is between -20 degrees and +50 de...[Details]
This paper designs a 16x16LED Chinese character display bar based on single-chip dynamic scanning control, briefly analyzes the principle of Chinese character display, and studies how the LED displ...[Details]
In 2012, more than half of the cars in the European, Japanese and American car markets will be equipped with color displays, navigation systems, satellite communications and other in-vehicle infota...[Details]
At present, the traffic congestion in cities is quite serious. According to relevant news reports: In China, the traffic congestion has expanded from megacities such as Beijing, Shanghai, and Guangzho...[Details]
With the rapid development of wireless
digital communication
, more challenges have been raised for integrated circuit design and testing. In the product design stage, in order to ensure
t...[Details]
The launch of Shenzhou IX is imminent, and Tiangong is welcoming visitors again. Yesterday, Professor Fu Qiang, Vice President of the Institute of Science and Industrial Technology of Harbin Instit...[Details]
1 Battery technology determines the fate of energy vehicles
Regardless of whether new energy vehicles are hybrid or pure electric vehicles, they cannot do without the core technology of batter...[Details]
Embedded System
京公网安备 11010802033920号
EEWORLD
