M38510/00204BFC datasheet, PDF

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M38510/00204BFC: DescriptionJ-K Flip-Flop, TTL/H/L Series, 2-Func, Negative Edge Triggered, 2-Bit, Complementary Output, TTL, CQFP16,; Categorylogic logic; File Size897KB，65 Pages; ManufacturerSRI International Sarnoff

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M38510/00204BFC Overview

J-K Flip-Flop, TTL/H/L Series, 2-Func, Negative Edge Triggered, 2-Bit, Complementary Output, TTL, CQFP16,

M38510/00204BFC Parametric

Parameter Name	Attribute value
Maker	SRI International Sarnoff
package instruction	DFP, FL16,.3
Reach Compliance Code	unknown
Other features	MASTER SLAVE OPERATION
series	TTL/H/L
JESD-30 code	R-CQFP-F16
Logic integrated circuit type	J-K FLIP-FLOP
Number of digits	2
Number of functions	2
Number of terminals	16
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Output polarity	COMPLEMENTARY
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DFP
Encapsulate equivalent code	FL16,.3
Package shape	RECTANGULAR
Package form	FLATPACK
power supply	5 V
propagation delay (tpd)	40 ns
Certification status	Qualified
Filter level	38535Q/M;38534H;883B
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	TTL
Temperature level	MILITARY
Terminal form	FLAT
Terminal pitch	1.27 mm
Terminal location	QUAD
Trigger type	NEGATIVE EDGE
minfmax	15 MHz

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INCH-POUND

MIL-M-38510/2G

8 February 2005

SUPERSEDING

MIL-M-38510/2E

24 December 1974

MIL-M-0038510/2F (USAF)

24 OCTOBER 1975

MILITARY SPECIFICATION

MICROCIRCUITS, DIGITAL, TTL, FLIP-FLOPS, MONOLITHIC SILICON

Inactive for new design after 7 September 1995

This specification is approved for use by all Departments

and Agencies of the Department of Defense.

The requirements for acquiring the product herein shall consist of this specification sheet and MIL-PRF 38535

1. SCOPE

1.1 Scope. This specification covers the detail requirements for monolithic silicon, TTL, bistable logic

microcircuits. Three product assurance classes and a choice of case outlines/lead finish are provided for each type

and are reflected in the complete part number. For this product, the requirements of MIL-M-38510 have been

superseded by MIL-PRF-38535, (see 6.4).

1.2 Part or Identifying Number (PIN). The PIN is in accordance with MIL-PRF-38535, and as specified herein.

1.2.1 Device types. The device types are as follows:

Device type

Circuit

Single J-K master-slave flip-flop

Dual J-K master-slave flip-flop, no preset

Dual J-K master-slave flip-flop

Dual D-type edge-triggered flip-flop

Single edge-triggered J-K flip-flop

Dual D-type edge-triggered flip-flop, buffered output

1.2.2 Device class. The device class is the product assurance level as defined in MIL-PRF-38535.

Comments, suggestions, or questions on this document should be addressed to: Commander, Defense

Supply Center Columbus, ATTN: DSCC-VAS, P. O. Box 3990, Columbus, OH 43218-3990, or emailed to

bipolar@dscc.dla.mil.

Since contact information can change, you may want to verify the currency of this

address information using the ASSIST Online database at

http://assist.daps.dla.mil

AMSC N/A

FSC 5962

MIL-M-38510/2G

2.2 Government documents.

2.2.1 Specifications and Standards. The following specifications and standards form a part of this

specification to the extent specified herein. Unless otherwise specified, the issues of these documents are

those cited in the solicitation or contract.

DEPARTMENT OF DEFENSE SPECIFICATIONS

MIL-PRF-38535 -

Integrated Circuits (Microcircuits) Manufacturing, General Specification for.

DEPARTMENT OF DEFENSE STANDARDS

MIL-STD-883

MIL-STD-1835

Test Method Standard for Microelectronics.

Interface Standard Electronic Component Case Outlines

(Copies of these documents are available online at

http://assist.daps.dla.mil/quicksearch/

http://assist.daps.dla.mil

or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D,

Philadelphia, PA 19111-5094.)

2.3 Order of precedence. In the event of a conflict between the text of this specification and the references

cited herein, the text of this document takes precedence. Nothing in this document, however, supersedes

applicable laws and regulations unless a specific exemption has been obtained.

3. REQUIREMENTS

3.1 Qualification. Microcircuits furnished under this specification shall be products that are manufactured by

a manufacturer authorized by the qualifying activity for listing on the applicable qualified manufacturers list before

contract award (see 4.3 and 6.3).

3.2 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535 and

as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The

modification in the QM plan shall not affect the form, fit, or function as described herein.

3.3 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall

be as specified in MIL-PRF-38535 and herein.

3.3.1 Terminal connections and logic diagrams. The terminal connections and logic diagrams shall be as

specified on figures 1.

3.3.2 Truth tables and logic equations. The truth tables and logic equations shall be as specified on figure 2.

3.3.3 Schematic circuits. The schematic circuits shall be maintained by the manufacturer and made available

to the qualifying activity and the preparing activity (DSCC-VAS) upon request.

3.3.4 Case outlines. The case outlines shall be as specified in 1.2.3.

3.4 Lead material and finish. The lead material and finish shall be in accordance with MIL-PRF-38535 (see

6.6).

3.5 Electrical performance characteristics. The electrical performance characteristics are as specified in

table I, and apply over the full recommended case operating temperature range, unless otherwise specified.

3.6 Electrical test requirements. The electrical test requirements for each device class shall be the

subgroups specified in table II. The electrical tests for each subgroup are described in table III. Subgroups 7

and 8 testing requires only a summary of attributes data.

3.7 Marking. Marking shall be in accordance with MIL-PRF-38535.

MIL-M-38510/2G

8/ Input condition – Clear for device types 05 and 07.

9/ See table III for complete terminal conditions.

10/ Minimum limit specified is the frequency of the input pulse. The output frequency shall be one-half of

the input frequency.

11/ For device types 02 and 03,limits are 0 to 120

µA.

TABLE II. Electrical test requirements.

Subgroups (see table III)

Class S

Class B

devices

1*, 2, 3, 7,

8, 9

1, 2, 3, 7, 8,

9, 10, 11

1, 2, 3,

N/A

1, 2, 3

1*, 2, 3,

7, 9

1, 2, 3, 7

N/A

1, 2, 3

10, 11

1, 2, 3

MIL-PRF-38535

test requirements

Interim electrical parameters

Final electrical test parameters

Group A test requirements

Group B test when using the method 5005

QCI option

Group C end-point electrical

parameters

Additional electrical subgroups for

Group C periodic inspections

Group D end-point electrical parameters

*PDA applies to subgroup 1.

4. VERIFICATION

4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-

38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM

plan shall not effect the form, fit, or function as described herein.

4.2 Screening. Screening shall be in accordance with MIL-PRF-38535 and shall be conducted on all devices

prior to qualification and quality conformance inspection. The following additional criteria shall apply:

a. The burn-in test duration, test condition, and test temperature, or approved alternatives shall be as

specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test

circuit shall be maintained under document control by the device manufacturer's Technology Review

Board (TRB) in accordance with MIL-PRF-38535 and shall be made available to the acquiring or

preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power

dissipation, as applicable, in accordance with the intent specified in test method 1015 of MIL-STD-

883.

b. Interim and final electrical test parameters shall be as specified in table II, except interim electrical

parameters test prior to burn-in is optional at the discretion of the manufacturer.

c. Additional screening for space level product shall be as specified in MIL-PRF-38535, appendix B.

4.3 Qualification inspection. Qualification inspection shall be in accordance with MIL-PRF-38535.

4.4 Technology Conformance inspection (TCI). Technology conformance inspection shall be in accordance

with MIL-PRF-38535 and herein for groups A, B, C, and D inspections (see 4.4.1 through 4.4.4).

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