5962-9069601MLA datasheet, PDF

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5962-9069601MLA: DescriptionStandard SRAM, 256X4, 15ns, CMOS, CDIP24, 0.300 INCH, CERDIP-24; Categorystorage storage; File Size151KB，6 Pages; ManufacturerCypress Semiconductor

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5962-9069601MLA Overview

Standard SRAM, 256X4, 15ns, CMOS, CDIP24, 0.300 INCH, CERDIP-24

5962-9069601MLA Parametric

Parameter Name	Attribute value
Maker	Cypress Semiconductor
Parts packaging code	DIP
package instruction	DIP,
Contacts	24
Reach Compliance Code	unknown
ECCN code	3A001.A.2.C
Maximum access time	15 ns
JESD-30 code	R-GDIP-T24
JESD-609 code	e0
length	31.877 mm
memory density	1024 bit
Memory IC Type	STANDARD SRAM
memory width	4
Number of functions	1
Number of ports	1
Number of terminals	24
word count	256 words
character code	256
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	256X4
Output characteristics	3-STATE
Exportable	YES
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Filter level	MIL-STD-883
Maximum seat height	5.08 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal surface	TIN LEAD
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	7.62 mm

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Description	Standard SRAM, 256X4, 15ns, CMOS, CDIP24, 0.300 INCH, CERDIP-24	Standard SRAM, 256X4, 10ns, CMOS, CDIP24, 0.300 INCH, CERDIP-24	Standard SRAM, 256X4, 7ns, CMOS, PDSO24, 0.300 INCH, PLASTIC, SOJ-24	Standard SRAM, 256X4, 12ns, CMOS, CDIP24, 0.300 INCH, CERDIP-24	Standard SRAM, 256X4, 7ns, CMOS, PDSO24, 0.300 INCH, PLASTIC, SOJ-24	Standard SRAM, 256X4, 9ns, CMOS, PDSO24, 0.300 INCH, PLASTIC, SOJ-24	Standard SRAM, 256X4, 9ns, CMOS, PDSO24, 0.300 INCH, PLASTIC, SOJ-24
Parts packaging code	DIP	DIP	SOJ	DIP	SOJ	SOJ	SOJ
package instruction	DIP,	DIP,	SOJ,	DIP,	SOJ,	SOJ,	SOJ,
Contacts	24	24	24	24	24	24	24
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	3A001.A.2.C	3A001.A.2.C	EAR99	3A001.A.2.C	EAR99	EAR99	EAR99
Maximum access time	15 ns	10 ns	7 ns	12 ns	7 ns	9 ns	9 ns
JESD-30 code	R-GDIP-T24	R-GDIP-T24	R-PDSO-J24	R-GDIP-T24	R-PDSO-J24	R-PDSO-J24	R-PDSO-J24
length	31.877 mm	31.877 mm	15.367 mm	31.877 mm	15.367 mm	15.367 mm	15.367 mm
memory density	1024 bit	1024 bit	1024 bit	1024 bit	1024 bit	1024 bit	1024 bit
Memory IC Type	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	4	4	4	4	4	4	4
Number of functions	1	1	1	1	1	1	1
Number of ports	1	1	1	1	1	1	1
Number of terminals	24	24	24	24	24	24	24
word count	256 words	256 words	256 words	256 words	256 words	256 words	256 words
character code	256	256	256	256	256	256	256
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	125 °C	125 °C	70 °C	125 °C	70 °C	70 °C	70 °C
organize	256X4	256X4	256X4	256X4	256X4	256X4	256X4
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Exportable	YES	YES	YES	YES	YES	YES	YES
Package body material	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	DIP	SOJ	DIP	SOJ	SOJ	SOJ
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	SMALL OUTLINE	IN-LINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	5.08 mm	5.08 mm	3.556 mm	5.08 mm	3.556 mm	3.556 mm	3.556 mm
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	YES	NO	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	COMMERCIAL	MILITARY	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	THROUGH-HOLE	THROUGH-HOLE	J BEND	THROUGH-HOLE	J BEND	J BEND	J BEND
Terminal pitch	2.54 mm	2.54 mm	1.27 mm	2.54 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
width	7.62 mm	7.62 mm	7.5057 mm	7.62 mm	7.5057 mm	7.5057 mm	7.5057 mm
Maker	Cypress Semiconductor	-	-	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor

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