Memory IC, 2KX8, MOS, CDIP24
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Motorola ( NXP ) |
| package instruction | DIP, DIP24,.6 |
| Reach Compliance Code | unknown |
| Maximum access time | 450 ns |
| JESD-30 code | R-XDIP-T24 |
| JESD-609 code | e0 |
| memory density | 16384 bit |
| memory width | 8 |
| Number of terminals | 24 |
| word count | 2048 words |
| character code | 2000 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 2KX8 |
| Output characteristics | 3-STATE |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP24,.6 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Certification status | Not Qualified |
| surface mount | NO |
| technology | MOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| TMS2716C | TMS2716L | |
|---|---|---|
| Description | Memory IC, 2KX8, MOS, CDIP24 | Memory IC, 2KX8, MOS, CDIP24, |
| Is it Rohs certified? | incompatible | incompatible |
| Maker | Motorola ( NXP ) | Motorola ( NXP ) |
| package instruction | DIP, DIP24,.6 | DIP, DIP24,.6 |
| Reach Compliance Code | unknown | unknown |
| Maximum access time | 450 ns | 450 ns |
| JESD-30 code | R-XDIP-T24 | R-XDIP-T24 |
| JESD-609 code | e0 | e0 |
| memory density | 16384 bit | 16384 bit |
| memory width | 8 | 8 |
| Number of terminals | 24 | 24 |
| word count | 2048 words | 2048 words |
| character code | 2000 | 2000 |
| Maximum operating temperature | 70 °C | 70 °C |
| organize | 2KX8 | 2KX8 |
| Output characteristics | 3-STATE | 3-STATE |
| Package body material | CERAMIC | CERAMIC |
| encapsulated code | DIP | DIP |
| Encapsulate equivalent code | DIP24,.6 | DIP24,.6 |
| Package shape | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE |
| Certification status | Not Qualified | Not Qualified |
| surface mount | NO | NO |
| technology | MOS | MOS |
| Temperature level | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL |
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