F-211
QTE–014–01–F–D–DP–A
®
QTE–014–01–L–D–A–RT1
(0,80mm) .0315"
QTE SERIES
QTE–060–01–L–D–A
HIGH SPEED GROUND PLANE HEADER
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?QTE
Insulator Material:
Liquid Crystal
Polymer
Terminal Material:
Phosphor Bronze
Plating:
Au or Sn over 50µ" (1,27µm) Ni
Current Rating:
Contacts: 1.3A @ 95°C
Ground Plane: 10.1A @ 95°C
Operating Temp Range:
-55°C to +125°C
Voltage Rating:
225 VAC mated with QSE
& 5mm Stack Height
Max Cycles:
100
Unmating Force (-RT1 option):
-RT1 option increases
unmating force up to 50%
RoHS Compliant:
Yes
Board Mates:
QSE
Cable Mates:
EQCD, EQSD,
EQDP, EQRF
(See Application
Specific note)
®
Integral metal plane
for power or ground
Standard
stack heights
from 5mm
to 25mm
• E.L.P.
TM
plating
option (–C)
• Retention pin option
fina
l
i
nch.com
TM
ols
otoc ted
Pr or
Supp
XAUI
®
PCI Express
SATA
et I/O)
MGT (Rock
Infiniband
at
EXTENDED LIFE PRODUCT
10 year Mixed Flowing Gas with 50µ" Gold
Call Samtec for maximum cycles mated with QSE
Polarized
5mm Stack Height
Single-Ended Signaling
Differential Pair Signaling
Differential Pair Signaling
Type
–D
–D
–DP
Rated @ 3dB Insertion Loss
9 GHz / 18 Gbps
8 GHz / 16 Gbps
8.5 GHz / 17 Gbps
ALSO
AVAILABLE
Board Spacing Standoffs.
See SO Series.
Processing:
Performance data for other stack heights and complete test data
available at www.samtec.com?QTE or contact sig@samtec.com
notes
Download app ppnote
com/a
www.samtec.
m
@ samtec.co
Contact SIG n protocols
o
for questions
Lead–Free Solderable:
Yes
SMT Lead Coplanarity:
(0,10mm) .004" max (020-060)
(0,15mm) .006" max (080)
Board Stacking:
For applications requiring
more than two connectors
per board or 4 banks or more,
contact ipg@samtec.com
QTE
PINS PER ROW
NO. OF PAIRS
LEAD
STYLE
PLATING
OPTION
TYPE
A
OTHER
OPTION
–020, –040, –060, –080
(40 total pins per bank = –D)
APPLICATION
SPECIFIC OPTION
• 14mm, 15mm, 22mm
and 30mm stack height
(Caution: Some automatic
placement/inspection
machines may have
component height
restrictions. Please
consult machinery
specifications.)
• 30µ" (0,76µm) Gold
(Specify -H plating for
Data Rate cable mating
applications.)
• Edge Mount
• 100 positions per row
• Guide Posts, Screw Down
& Friction Lock
Call Samtec.
*Note:
–C Plating passes
10 year MFG testing
Note:
Some lengths, styles
and options are non-standard,
non-returnable.
–014, –028, –042, –056
(14 pairs per bank = –D–DP)
Specify
LEAD
STYLE
from
chart
–K
–F
= Gold Flash
on Signal Pins and
Ground Plane,
Matte Tin on tails
–D
= Single-Ended
–D–DP
= Differential Pair
(–01 only)
= (7,00mm)
.275" DIA
Polyimide Film
Pick & Place
Pad
–D–DP = (No. of Positions per Row/14)
x (20,00) .7875
–D = (No. of Positions per Row/20)
x (20,00) .7875
(20,00) .7875
–L
= 10µ" (0,25µm)
Gold on Signal Pins
and Ground Plane,
Matte Tin on tails
–TR
= Tape & Reel
Packaging
(N/A on 56 &
80 positions)
01
–C*
(0,80)
.0315
(0,20)
.008
(7,11)
= Electro-Polished
.280
Selective
50µ" (1,27µm) min
Au over 150µ"
(3,81µm) Ni on Signal
Pins in contact area,
10µ" (0,25µm) min Au
over 50µ" (1,27µm) Ni
on Ground Plane in
contact area,
Matte Tin over 50µ"
(1,27µm) min Ni on
all solder tails
QTE
LEAD
STYLE
HEIGHT
WITH
QSE*
(5,00)
.197
(8,00)
.315
(11,00)
.433
(16,00)
.630
(19,00)
.748
(25,00)
.984
–RT1
= Retention
Option
(-01 Lead
Style only)
(N/A on 56 &
80 positions
or –L (latch)
option)
(5,97)
.235
02
A
(4,27)
.168
(7,26)
.286
(10,27)
.404
(15,25)
.600
(18,26)
.718
(24,24)
.954
–01
–02
–03
–04
–05
A
(3,30)
.130
(0,76)
.030
(0,89)
.035 DIA
(1,57)
.062
DIA
–RT1
–L
= Latching
Option
(N/A on 42,
56, 60 & 80
positions or
–RT1 option)
(1,57)
.062
(0,64)
.025
––L
–07
*Processing conditions
will affect mated height.
WWW.SAMTEC.COM
京公网安备 11010802033920号
EEWORLD
