KMCJ5324100-7 datasheet, PDF - EEWORLD Datasheet

KMCJ5324100-7: DescriptionDRAM Card, 4MX32, 70ns, MOS; Categorystorage storage; File Size321KB，12 Pages; ManufacturerSAMSUNG; Websitehttp://www.samsung.com/Products/Semiconductor/

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KMCJ5324100-7 Overview

DRAM Card, 4MX32, 70ns, MOS

Parameter Name	Attribute value
Maker	SAMSUNG
package instruction	,
Reach Compliance Code	unknown
ECCN code	EAR99
access mode	FAST PAGE
Maximum access time	70 ns
Other features	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
Spare memory width	16
JESD-30 code	X-XXMA-X88
memory density	134217728 bit
Memory IC Type	DRAM CARD
memory width	32
Number of functions	1
Number of ports	1
Number of terminals	88
word count	4194304 words
character code	4000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	4MX32
Output characteristics	3-STATE
Package body material	UNSPECIFIED
Package shape	UNSPECIFIED
Package form	MICROELECTRONIC ASSEMBLY
Certification status	Not Qualified
refresh cycle	2048
Maximum supply voltage (Vsup)	5.25 V
Minimum supply voltage (Vsup)	4.75 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	MOS
Temperature level	COMMERCIAL
Terminal form	UNSPECIFIED
Terminal location	UNSPECIFIED

	KMCJ5324100-7	KMCJ5324100-8	KMCJ5324100-6
Description	DRAM Card, 4MX32, 70ns, MOS	DRAM Card, 4MX32, 80ns, MOS	DRAM Card, 4MX32, 60ns, MOS
Maker	SAMSUNG	SAMSUNG	SAMSUNG
Reach Compliance Code	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99
access mode	FAST PAGE	FAST PAGE	FAST PAGE
Maximum access time	70 ns	80 ns	60 ns
Other features	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
Spare memory width	16	16	16
JESD-30 code	X-XXMA-X88	X-XXMA-X88	X-XXMA-X88
memory density	134217728 bit	134217728 bit	134217728 bit
Memory IC Type	DRAM CARD	DRAM CARD	DRAM CARD
memory width	32	32	32
Number of functions	1	1	1
Number of ports	1	1	1
Number of terminals	88	88	88
word count	4194304 words	4194304 words	4194304 words
character code	4000000	4000000	4000000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C
organize	4MX32	4MX32	4MX32
Output characteristics	3-STATE	3-STATE	3-STATE
Package body material	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
Package shape	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
Package form	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY
Certification status	Not Qualified	Not Qualified	Not Qualified
refresh cycle	2048	2048	2048
Maximum supply voltage (Vsup)	5.25 V	5.25 V	5.25 V
Minimum supply voltage (Vsup)	4.75 V	4.75 V	4.75 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V
surface mount	NO	NO	NO
technology	MOS	MOS	MOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
Terminal location	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED

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