DIP-632-014BLF datasheet, PDF - EEWORLD Datasheet

DIP-632-014BLF: DescriptionIC Socket, DIP32, 32 Contact(s), 2.54mm Term Pitch, 0.6inch Row Spacing, Solder, LEAD FREE; CategoryThe connector socket; File Size102KB，1 Pages; ManufacturerAmphenol; Websitehttp://www.amphenol.com/; Environmental Compliance

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DIP-632-014BLF Overview

IC Socket, DIP32, 32 Contact(s), 2.54mm Term Pitch, 0.6inch Row Spacing, Solder, LEAD FREE

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Amphenol
package instruction	LEAD FREE
Reach Compliance Code	compliant
ECCN code	EAR99
body width	0.7 inch
subject depth	0.165 inch
body length	1.5 inch
Contact to complete cooperation	TIN (100) OVER NICKEL
Contact completed and terminated	TIN (200) OVER NICKEL
Contact material	BE-CU
Contact style	RND PIN-SKT
Device slot type	IC SOCKET
Type of equipment used	DIP32
Shell material	GLASS FILLED POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER
JESD-609 code	e3
Manufacturer's serial number	DIP
Plug contact pitch	0.1 inch
Installation method	STRAIGHT
Number of contacts	32
PCB contact pattern	RECTANGULAR
PCB contact row spacing	0.6 mm
Terminal pitch	2.54 mm
Termination type	SOLDER

PDM: Rev:F

STATUS:

Released

Printed: Sep 28, 2009

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