EEPROM Module, 256KX16, 250ns, Parallel, Hybrid, PDIP40,
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Xicor Inc. |
| Reach Compliance Code | unknown |
| Maximum access time | 250 ns |
| Data polling | YES |
| JESD-30 code | R-PDIP-T40 |
| JESD-609 code | e0 |
| memory density | 4194304 bit |
| Memory IC Type | EEPROM MODULE |
| memory width | 16 |
| Number of terminals | 40 |
| word count | 262144 words |
| character code | 256000 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| organize | 256KX16 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP40(UNSPEC) |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| page size | 256 words |
| Parallel/Serial | PARALLEL |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum standby current | 0.002 A |
| Maximum slew rate | 0.2 mA |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | HYBRID |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal location | DUAL |
| switch bit | YES |
| write protect | SOFTWARE |
| XM28C4096I-25 | XM28C4096-20 | XM28C4096-25 | XM28C4096-15 | XM28C4096I-15 | XM28C4096I-20 | |
|---|---|---|---|---|---|---|
| Description | EEPROM Module, 256KX16, 250ns, Parallel, Hybrid, PDIP40, | EEPROM Module, 256KX16, 200ns, Parallel, CMOS, | EEPROM Module, 256KX16, 250ns, Parallel, CMOS, | EEPROM Module, 256KX16, 150ns, Parallel, CMOS, | EEPROM Module, 256KX16, 150ns, Parallel, Hybrid, PDIP40, | EEPROM Module, 256KX16, 200ns, Parallel, Hybrid, PDIP40, |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | Xicor Inc. | Xicor Inc. | Xicor Inc. | Xicor Inc. | Xicor Inc. | Xicor Inc. |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| Maximum access time | 250 ns | 200 ns | 250 ns | 150 ns | 150 ns | 200 ns |
| Data polling | YES | YES | YES | YES | YES | YES |
| JESD-30 code | R-PDIP-T40 | R-XDMA-T40 | R-XDMA-T40 | R-XDMA-T40 | R-PDIP-T40 | R-PDIP-T40 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 |
| memory density | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit |
| Memory IC Type | EEPROM MODULE | EEPROM MODULE | EEPROM MODULE | EEPROM MODULE | EEPROM MODULE | EEPROM MODULE |
| memory width | 16 | 16 | 16 | 16 | 16 | 16 |
| Number of terminals | 40 | 40 | 40 | 40 | 40 | 40 |
| word count | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words |
| character code | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 |
| Maximum operating temperature | 85 °C | 75 °C | 75 °C | 75 °C | 85 °C | 85 °C |
| organize | 256KX16 | 256KX16 | 256KX16 | 256KX16 | 256KX16 | 256KX16 |
| Package body material | PLASTIC/EPOXY | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DIP | DIP | DIP | DIP | DIP | DIP |
| Encapsulate equivalent code | DIP40(UNSPEC) | DIP40(UNSPEC) | DIP40(UNSPEC) | DIP40(UNSPEC) | DIP40(UNSPEC) | DIP40(UNSPEC) |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | IN-LINE | IN-LINE |
| page size | 256 words | 256 words | 256 words | 256 words | 256 words | 256 words |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum standby current | 0.002 A | 0.002 A | 0.002 A | 0.002 A | 0.002 A | 0.002 A |
| Maximum slew rate | 0.2 mA | 0.2 mA | 0.2 mA | 0.2 mA | 0.2 mA | 0.2 mA |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | NO | NO | NO | NO |
| technology | HYBRID | CMOS | CMOS | CMOS | HYBRID | HYBRID |
| Temperature level | INDUSTRIAL | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | INDUSTRIAL | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| switch bit | YES | YES | YES | YES | YES | YES |
| write protect | SOFTWARE | SOFTWARE | SOFTWARE | SOFTWARE | SOFTWARE | SOFTWARE |
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