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SN74AUP2G14YFPR

Description
Low-Power Dual Schmitt-Trigger Inverter 6-DSBGA -40 to 85
Categorylogic    logic   
File Size2MB,26 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
Environmental Compliance
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SN74AUP2G14YFPR Overview

Low-Power Dual Schmitt-Trigger Inverter 6-DSBGA -40 to 85

SN74AUP2G14YFPR Parametric

Parameter NameAttribute value
Brand NameTexas Instruments
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerTexas Instruments
Parts packaging codeBGA
package instructionVFBGA, BGA8,2X4,16
Contacts6
Reach Compliance Codecompli
ECCN codeEAR99
Factory Lead Time1 week
Samacsys DescriptiLOW-POWER DUAL SCHMITT-TRIGGER INVERTER
seriesAUP/ULP/V
JESD-30 codeR-PBGA-B6
JESD-609 codee1
length1.17 mm
Load capacitance (CL)30 pF
Logic integrated circuit typeINVERTER
MaximumI(ol)0.004 A
Humidity sensitivity level1
Number of functions2
Number of entries1
Number of terminals6
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeVFBGA
Encapsulate equivalent codeBGA8,2X4,16
Package shapeRECTANGULAR
Package formGRID ARRAY, VERY THIN PROFILE, FINE PITCH
method of packingTR
Peak Reflow Temperature (Celsius)260
power supply1.2/3.3 V
Maximum supply current (ICC)0.01 mA
Prop。Delay @ Nom-Su25.5 ns
propagation delay (tpd)25.5 ns
Certification statusNot Qualified
Schmitt triggerYES
Maximum seat height0.5 mm
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)0.8 V
Nominal supply voltage (Vsup)1.1 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Silver/Copper (Sn/Ag/Cu)
Terminal formBALL
Terminal pitch0.4 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width0.77 mm

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Description Low-Power Dual Schmitt-Trigger Inverter 6-DSBGA -40 to 85 Low-Power Dual Schmitt-Trigger Inverter 6-SON -40 to 85 Low-Power Dual Schmitt-Trigger Inverter 6-SON -40 to 85 Low-Power Dual Schmitt-Trigger Inverter 6-SON -40 to 85
Brand Name Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Is it lead-free? Lead free Lead free Lead free Lead free
Is it Rohs certified? conform to conform to conform to conform to
Maker Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Parts packaging code BGA SON SON SON
package instruction VFBGA, BGA8,2X4,16 VSON, SOLCC6,.04,20 VSON, SOLCC6,.04,14 VSON, SOLCC6,.04,14
Contacts 6 6 6 6
Reach Compliance Code compli compli compli compli
ECCN code EAR99 EAR99 EAR99 EAR99
Factory Lead Time 1 week 6 weeks 1 week 6 weeks
series AUP/ULP/V AUP/ULP/V AUP/ULP/V AUP/ULP/V
JESD-30 code R-PBGA-B6 R-PDSO-N6 S-PDSO-N6 S-PDSO-N6
JESD-609 code e1 e4 e4 e4
length 1.17 mm 1.45 mm 1 mm 1 mm
Load capacitance (CL) 30 pF 30 pF 30 pF 30 pF
Logic integrated circuit type INVERTER INVERTER INVERTER INVERTER
MaximumI(ol) 0.004 A 0.004 A 0.004 A 0.004 A
Humidity sensitivity level 1 1 1 1
Number of functions 2 2 2 2
Number of entries 1 1 1 1
Number of terminals 6 6 6 6
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code VFBGA VSON VSON VSON
Encapsulate equivalent code BGA8,2X4,16 SOLCC6,.04,20 SOLCC6,.04,14 SOLCC6,.04,14
Package shape RECTANGULAR RECTANGULAR SQUARE SQUARE
Package form GRID ARRAY, VERY THIN PROFILE, FINE PITCH SMALL OUTLINE, VERY THIN PROFILE SMALL OUTLINE, VERY THIN PROFILE SMALL OUTLINE, VERY THIN PROFILE
method of packing TR TR TR TR
Peak Reflow Temperature (Celsius) 260 260 260 260
power supply 1.2/3.3 V 1.2/3.3 V 1.2/3.3 V 1.2/3.3 V
Maximum supply current (ICC) 0.01 mA 0.01 mA 0.01 mA 0.01 mA
Prop。Delay @ Nom-Su 25.5 ns 25.5 ns 25.5 ns 25.5 ns
propagation delay (tpd) 25.5 ns 25.5 ns 25.5 ns 25.5 ns
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Schmitt trigger YES YES YES YES
Maximum seat height 0.5 mm 0.6 mm 0.4 mm 0.4 mm
Maximum supply voltage (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) 0.8 V 0.8 V 0.8 V 0.8 V
Nominal supply voltage (Vsup) 1.1 V 1.1 V 1.1 V 1.2 V
surface mount YES YES YES YES
technology CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface Tin/Silver/Copper (Sn/Ag/Cu) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form BALL NO LEAD NO LEAD NO LEAD
Terminal pitch 0.4 mm 0.5 mm 0.35 mm 0.35 mm
Terminal location BOTTOM DUAL DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 0.77 mm 1 mm 1 mm 1 mm
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