I/O Controller Interface IC Single Socket CardBus Controller
| Parameter Name | Attribute value |
| Brand Name | Texas Instruments |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Parts packaging code | BGA |
| package instruction | LFBGA, |
| Contacts | 257 |
| Reach Compliance Code | compli |
| Address bus width | 32 |
| Bus compatibility | PCI |
| maximum clock frequency | 24.576 MHz |
| Maximum data transfer rate | 132 MBps |
| Drive interface standards | IEEE1394; IEEE1394A |
| External data bus width | 32 |
| JESD-30 code | S-PBGA-B257 |
| JESD-609 code | e0 |
| length | 16 mm |
| Humidity sensitivity level | 3 |
| Number of terminals | 257 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | LFBGA |
| Package shape | SQUARE |
| Package form | GRID ARRAY, LOW PROFILE, FINE PITCH |
| Peak Reflow Temperature (Celsius) | 220 |
| Certification status | Not Qualified |
| Maximum seat height | 1.4 mm |
| Maximum supply voltage | 3.6 V |
| Minimum supply voltage | 3 V |
| Nominal supply voltage | 3.3 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | BALL |
| Terminal pitch | 0.8 mm |
| Terminal location | BOTTOM |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 16 mm |
| uPs/uCs/peripheral integrated circuit type | BUS CONTROLLER, PCMCIA |
| Base Number Matches | 1 |
| PCI4515AGHK | PCI4515AZHK | |
|---|---|---|
| Description | I/O Controller Interface IC Single Socket CardBus Controller | I/O Controller Interface IC Single Socket CardBus Controller |
| Brand Name | Texas Instruments | Texas Instruments |
| Is it lead-free? | Contains lead | Contains lead |
| Is it Rohs certified? | incompatible | conform to |
| Parts packaging code | BGA | BGA |
| package instruction | LFBGA, | LFBGA, |
| Contacts | 257 | 257 |
| Reach Compliance Code | compli | unknow |
| Address bus width | 32 | 32 |
| Bus compatibility | PCI | PCI |
| maximum clock frequency | 24.576 MHz | 24.576 MHz |
| Maximum data transfer rate | 132 MBps | 132 MBps |
| Drive interface standards | IEEE1394; IEEE1394A | IEEE1394; IEEE1394A |
| External data bus width | 32 | 32 |
| JESD-30 code | S-PBGA-B257 | S-PBGA-B257 |
| JESD-609 code | e0 | e1 |
| length | 16 mm | 16 mm |
| Humidity sensitivity level | 3 | 3 |
| Number of terminals | 257 | 257 |
| Maximum operating temperature | 70 °C | 70 °C |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | LFBGA | LFBGA |
| Package shape | SQUARE | SQUARE |
| Package form | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH |
| Peak Reflow Temperature (Celsius) | 220 | 260 |
| Certification status | Not Qualified | Not Qualified |
| Maximum seat height | 1.4 mm | 1.4 mm |
| Maximum supply voltage | 3.6 V | 3.6 V |
| Minimum supply voltage | 3 V | 3 V |
| Nominal supply voltage | 3.3 V | 3.3 V |
| surface mount | YES | YES |
| technology | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Silver/Copper (Sn/Ag/Cu) |
| Terminal form | BALL | BALL |
| Terminal pitch | 0.8 mm | 0.8 mm |
| Terminal location | BOTTOM | BOTTOM |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED |
| width | 16 mm | 16 mm |
| uPs/uCs/peripheral integrated circuit type | BUS CONTROLLER, PCMCIA | BUS CONTROLLER, PCMCIA |
| Part Number | Manufacturer | Description |
|---|---|---|
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