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SN74AUP2G04DSFR

Description
Low-Power Dual Inverter Gate 6-SON -40 to 85
Categorylogic    logic   
File Size2MB,24 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
Environmental Compliance
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SN74AUP2G04DSFR Overview

Low-Power Dual Inverter Gate 6-SON -40 to 85

SN74AUP2G04DSFR Parametric

Parameter NameAttribute value
Brand NameTexas Instruments
Is it lead-free?Lead free
Is it Rohs certified?conform to
Parts packaging codeSON
package instructionVSON, SOLCC6,.04,14
Contacts6
Reach Compliance Codecompli
ECCN codeEAR99
Factory Lead Time6 weeks
seriesAUP/ULP/V
JESD-30 codeS-PDSO-N6
JESD-609 codee4
length1 mm
Load capacitance (CL)30 pF
Logic integrated circuit typeINVERTER
MaximumI(ol)0.004 A
Humidity sensitivity level1
Number of functions2
Number of entries1
Number of terminals6
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeVSON
Encapsulate equivalent codeSOLCC6,.04,14
Package shapeSQUARE
Package formSMALL OUTLINE, VERY THIN PROFILE
method of packingTR
Peak Reflow Temperature (Celsius)260
power supply1.2/3.3 V
Maximum supply current (ICC)0.0009 mA
Prop。Delay @ Nom-Su25.5 ns
propagation delay (tpd)25.5 ns
Certification statusNot Qualified
Schmitt triggerNO
Maximum seat height0.4 mm
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)0.8 V
Nominal supply voltage (Vsup)1.2 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceNickel/Palladium/Gold (Ni/Pd/Au)
Terminal formNO LEAD
Terminal pitch0.35 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width1 mm
Base Number Matches1

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Description Low-Power Dual Inverter Gate 6-SON -40 to 85 Low-Power Dual Inverter Gate 6-SC70 -40 to 85 Low-Power Dual Inverter Gate 6-SON -40 to 85 Low-Power Dual Inverter Gate 6-DSBGA -40 to 85
Brand Name Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Is it lead-free? Lead free Lead free Lead free Lead free
Is it Rohs certified? conform to conform to conform to conform to
Parts packaging code SON SOIC SON BGA
package instruction VSON, SOLCC6,.04,14 TSSOP, TSSOP6,.08 VSON, SOLCC6,.04,20 VFBGA, BGA6,2X3,16
Contacts 6 6 6 6
Reach Compliance Code compli compli compli compli
ECCN code EAR99 EAR99 EAR99 EAR99
series AUP/ULP/V AUP/ULP/V AUP/ULP/V AUP/ULP/V
JESD-30 code S-PDSO-N6 R-PDSO-G6 R-PDSO-N6 R-XBGA-B6
JESD-609 code e4 e4 e4 e1
length 1 mm 2 mm 1.45 mm 1.17 mm
Load capacitance (CL) 30 pF 30 pF 30 pF 30 pF
Logic integrated circuit type INVERTER INVERTER INVERTER INVERTER
MaximumI(ol) 0.004 A 0.004 A 0.004 A 0.004 A
Humidity sensitivity level 1 1 1 1
Number of functions 2 2 2 2
Number of entries 1 1 1 1
Number of terminals 6 6 6 6
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY UNSPECIFIED
encapsulated code VSON TSSOP VSON VFBGA
Encapsulate equivalent code SOLCC6,.04,14 TSSOP6,.08 SOLCC6,.04,20 BGA6,2X3,16
Package shape SQUARE RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, VERY THIN PROFILE GRID ARRAY, VERY THIN PROFILE, FINE PITCH
method of packing TR TR TR TR
Peak Reflow Temperature (Celsius) 260 260 260 260
power supply 1.2/3.3 V 1.2/3.3 V 1.2/3.3 V 1.2/3.3 V
Maximum supply current (ICC) 0.0009 mA 0.01 mA 0.0009 mA 0.0009 mA
Prop。Delay @ Nom-Su 25.5 ns 25.5 ns 25.5 ns 25.5 ns
propagation delay (tpd) 25.5 ns 25.5 ns 25.5 ns 25.5 ns
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Schmitt trigger NO NO NO NO
Maximum seat height 0.4 mm 1.1 mm 0.6 mm 0.5 mm
Maximum supply voltage (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) 0.8 V 0.8 V 0.8 V 0.8 V
Nominal supply voltage (Vsup) 1.2 V 1.2 V 1.2 V 1.2 V
surface mount YES YES YES YES
technology CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form NO LEAD GULL WING NO LEAD BALL
Terminal pitch 0.35 mm 0.65 mm 0.5 mm 0.4 mm
Terminal location DUAL DUAL DUAL BOTTOM
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 1 mm 1.25 mm 1 mm 0.77 mm
Factory Lead Time 6 weeks 6 weeks 6 weeks -
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