|
TMS320C6672ACYPA25 |
TMS320C6672ACYP |
TMS320C6672ACYP25 |
TMS320C6672ACYPA |
| Description |
Multicore Fixed and Floating-Point Digital Signal Processor 841-FCBGA -40 to 100 |
Multicore Fixed and Floating-Point Digital Signal Processor 841-FCBGA 0 to 85 |
Multicore Fixed and Floating-Point Digital Signal Processor 841-FCBGA 0 to 85 |
Multicore Fixed and Floating-Point Digital Signal Processor 841-FCBGA -40 to 100 |
| Brand Name |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
| Is it lead-free? |
Lead free |
Lead free |
Lead free |
Lead free |
| Is it Rohs certified? |
conform to |
conform to |
conform to |
conform to |
| Parts packaging code |
BGA |
BGA |
BGA |
BGA |
| package instruction |
FBGA, BGA841,29X29,32 |
FBGA, BGA841,29X29,32 |
FBGA, BGA841,29X29,32 |
FBGA, BGA841,29X29,32 |
| Contacts |
841 |
841 |
841 |
841 |
| Reach Compliance Code |
compli |
compli |
compli |
compli |
| ECCN code |
5A991.B.4.A |
5A991.B.4.A |
5A991.B.4.A |
5A991.B.4.A |
| Factory Lead Time |
16 weeks |
6 weeks |
6 weeks |
6 weeks |
| barrel shifter |
NO |
NO |
NO |
NO |
| bit size |
32 |
32 |
32 |
32 |
| boundary scan |
YES |
YES |
YES |
YES |
| External data bus width |
64 |
64 |
64 |
64 |
| Format |
FLOATING POINT |
FLOATING POINT |
FLOATING POINT |
FLOATING POINT |
| Integrated cache |
YES |
YES |
YES |
YES |
| Internal bus architecture |
SINGLE |
SINGLE |
SINGLE |
SINGLE |
| JESD-30 code |
S-PBGA-B841 |
S-PBGA-B841 |
S-PBGA-B841 |
S-PBGA-B841 |
| JESD-609 code |
e1 |
e1 |
e1 |
e1 |
| length |
24 mm |
24 mm |
24 mm |
24 mm |
| low power mode |
YES |
YES |
YES |
YES |
| Humidity sensitivity level |
4 |
4 |
4 |
4 |
| Number of DMA channels |
144 |
144 |
144 |
144 |
| Number of terminals |
841 |
841 |
841 |
841 |
| Number of timers |
10 |
10 |
10 |
10 |
| On-chip data RAM width |
8 |
8 |
8 |
8 |
| On-chip program ROM width |
8 |
8 |
8 |
8 |
| Maximum operating temperature |
100 °C |
85 °C |
85 °C |
100 °C |
| Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
| encapsulated code |
FBGA |
FBGA |
FBGA |
FBGA |
| Encapsulate equivalent code |
BGA841,29X29,32 |
BGA841,29X29,32 |
BGA841,29X29,32 |
BGA841,29X29,32 |
| Package shape |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
| Package form |
GRID ARRAY, FINE PITCH |
GRID ARRAY, FINE PITCH |
GRID ARRAY, FINE PITCH |
GRID ARRAY, FINE PITCH |
| Peak Reflow Temperature (Celsius) |
245 |
245 |
245 |
245 |
| power supply |
1,1.5,1.8 V |
1,1.5,1.8 V |
1,1.5,1.8 V |
1,1.5,1.8 V |
| Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
| RAM (number of words) |
16384 |
16384 |
16384 |
16384 |
| ROM programmability |
MROM |
MROM |
MROM |
MROM |
| Maximum seat height |
3.39 mm |
3.39 mm |
3.39 mm |
3.39 mm |
| Maximum supply voltage |
1.155 V |
1.155 V |
1.155 V |
1.155 V |
| Minimum supply voltage |
1.045 V |
1.045 V |
1.045 V |
1.045 V |
| Nominal supply voltage |
1.1 V |
1.1 V |
1.1 V |
1.1 V |
| surface mount |
YES |
YES |
YES |
YES |
| technology |
CMOS |
CMOS |
CMOS |
CMOS |
| Temperature level |
INDUSTRIAL |
OTHER |
OTHER |
INDUSTRIAL |
| Terminal surface |
Tin/Silver/Copper (Sn/Ag/Cu) |
Tin/Silver/Copper (Sn/Ag/Cu) |
Tin/Silver/Copper (Sn/Ag/Cu) |
Tin/Silver/Copper (Sn/Ag/Cu) |
| Terminal form |
BALL |
BALL |
BALL |
BALL |
| Terminal pitch |
0.8 mm |
0.8 mm |
0.8 mm |
0.8 mm |
| Terminal location |
BOTTOM |
BOTTOM |
BOTTOM |
BOTTOM |
| Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
| width |
24 mm |
24 mm |
24 mm |
24 mm |
| uPs/uCs/peripheral integrated circuit type |
DIGITAL SIGNAL PROCESSOR, OTHER |
DIGITAL SIGNAL PROCESSOR, OTHER |
DIGITAL SIGNAL PROCESSOR, OTHER |
DIGITAL SIGNAL PROCESSOR, OTHER |
| Base Number Matches |
1 |
1 |
1 |
1 |