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TMS320DM6467TZUT1

Description
Digital Media System-on-Chip 529-FCBGA 0 to 85
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size2MB,352 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
Environmental Compliance
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TMS320DM6467TZUT1 Overview

Digital Media System-on-Chip 529-FCBGA 0 to 85

TMS320DM6467TZUT1 Parametric

Parameter NameAttribute value
Brand NameTexas Instruments
Is it Rohs certified?conform to
MakerTexas Instruments
Parts packaging codeBGA
package instructionFBGA, BGA529,23X23,32
Contacts529
Reach Compliance Codeunknow
Factory Lead Time1 week
Other featuresALSO REQUIRES 3.3V I/O SUPPLY
bit size32
FormatFIXED POINT
JESD-30 codeS-PBGA-B529
JESD-609 codee1
length19 mm
Humidity sensitivity level4
Number of terminals529
Maximum operating temperature85 °C
Minimum operating temperature
Package body materialPLASTIC/EPOXY
encapsulated codeFBGA
Encapsulate equivalent codeBGA529,23X23,32
Package shapeSQUARE
Package formGRID ARRAY, FINE PITCH
Peak Reflow Temperature (Celsius)245
power supply1.3,1.8/3.3 V
Certification statusNot Qualified
RAM (number of words)8192
Maximum seat height3.3 mm
Maximum supply voltage1.365 V
Minimum supply voltage1.235 V
Nominal supply voltage1.3 V
surface mountYES
technologyCMOS
Temperature levelOTHER
Terminal surfaceTin/Silver/Copper (Sn/Ag/Cu)
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width19 mm
uPs/uCs/peripheral integrated circuit typeMICROPROCESSOR CIRCUIT

TMS320DM6467TZUT1 Related Products

TMS320DM6467TZUT1 TMS320DM6467TCUT1 TMS320DM6467TCUT9 TMS320DM6467TZUTD1 TMS320DM6467TCUTD1
Description Digital Media System-on-Chip 529-FCBGA 0 to 85 Digital Media System-on-Chip 529-FCBGA 0 to 85 Digital Media System-on-Chip 529-FCBGA 0 to 85 Digital Signal Processors & Controllers - DSP, DSC Dig Media System-on- Digital Media System-on-Chip 529-FCBGA -40 to 85
Brand Name Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Is it Rohs certified? conform to conform to conform to conform to conform to
Parts packaging code BGA BGA BGA BGA BGA
package instruction FBGA, BGA529,23X23,32 HBGA, BGA529,23X23,32 FCBGA-529 FBGA, BGA529,23X23,32 HBGA, BGA529,23X23,32
Contacts 529 529 529 529 529
Reach Compliance Code unknow compli compliant compli compli
Other features ALSO REQUIRES 3.3V I/O SUPPLY ALSO REQUIRES 3.3V I/O SUPPLY ALSO REQUIRES 3.3V I/O SUPPLY ALSO REQUIRES 3.3V I/O SUPPLY ALSO REQUIRES 3.3V I/O SUPPLY
bit size 32 32 32 32 32
Format FIXED POINT FIXED POINT FIXED POINT FIXED POINT FIXED POINT
JESD-30 code S-PBGA-B529 S-PBGA-B529 S-PBGA-B529 S-PBGA-B529 S-PBGA-B529
JESD-609 code e1 e1 e1 e1 e1
length 19 mm 19 mm 19 mm 19 mm 19 mm
Humidity sensitivity level 4 4 4 4 4
Number of terminals 529 529 529 529 529
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code FBGA HBGA HBGA FBGA HBGA
Encapsulate equivalent code BGA529,23X23,32 BGA529,23X23,32 BGA529,23X23,32 BGA529,23X23,32 BGA529,23X23,32
Package shape SQUARE SQUARE SQUARE SQUARE SQUARE
Package form GRID ARRAY, FINE PITCH GRID ARRAY, HEAT SINK/SLUG GRID ARRAY, HEAT SINK/SLUG GRID ARRAY, FINE PITCH GRID ARRAY, HEAT SINK/SLUG
Peak Reflow Temperature (Celsius) 245 245 245 245 245
power supply 1.3,1.8/3.3 V 1.3,1.8/3.3 V 1.3,1.8/3.3 V 1.3,1.8/3.3 V 1.3,1.8/3.3 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
RAM (number of words) 8192 8192 8192 8192 8192
Maximum seat height 3.3 mm 3.3 mm 3.3 mm 3.3 mm 3.3 mm
Maximum supply voltage 1.365 V 1.365 V 1.365 V 1.365 V 1.365 V
Minimum supply voltage 1.235 V 1.235 V 1.235 V 1.235 V 1.235 V
Nominal supply voltage 1.3 V 1.3 V 1.3 V 1.3 V 1.3 V
surface mount YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS
Temperature level OTHER OTHER OTHER INDUSTRIAL INDUSTRIAL
Terminal surface Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form BALL BALL BALL BALL BALL
Terminal pitch 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 19 mm 19 mm 19 mm 19 mm 19 mm
uPs/uCs/peripheral integrated circuit type MICROPROCESSOR CIRCUIT MICROPROCESSOR CIRCUIT MICROPROCESSOR CIRCUIT MICROPROCESSOR CIRCUIT MICROPROCESSOR CIRCUIT
Maker Texas Instruments - Texas Instruments Texas Instruments -
Factory Lead Time 1 week 6 weeks 12 weeks - 6 weeks
Is it lead-free? - Lead free Lead free Contains lead Lead free
ECCN code - 3A991.A.2 3A991.A.2 - 3A991.A.2
Bus compatibility - ETHERNET; I2C; SPI; UART; USB ETHERNET; I2C; SPI; UART; USB - ETHERNET; I2C; SPI; UART; USB
maximum clock frequency - 35 MHz 35 MHz - 35 MHz
External data bus width - 48 48 - 48
Base Number Matches - 1 1 - 1

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