TMS320DM6467TCUT1 datasheet, PDF

Datasheet> All Categories > The embedded processor and controller> Microcontrollers and processors> TMS320DM6467TCUT1

TMS320DM6467TCUT1: DescriptionDigital Media System-on-Chip 529-FCBGA 0 to 85; CategoryThe embedded processor and controller Microcontrollers and processors; File Size2MB，352 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/; Environmental Compliance

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TMS320DM6467TCUT1 Overview

Digital Media System-on-Chip 529-FCBGA 0 to 85

TMS320DM6467TCUT1 Parametric

Parameter Name	Attribute value
Brand Name	Texas Instruments
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Parts packaging code	BGA
package instruction	HBGA, BGA529,23X23,32
Contacts	529
Reach Compliance Code	compli
ECCN code	3A991.A.2
Factory Lead Time	6 weeks
Other features	ALSO REQUIRES 3.3V I/O SUPPLY
bit size	32
Bus compatibility	ETHERNET; I2C; SPI; UART; USB
maximum clock frequency	35 MHz
External data bus width	48
Format	FIXED POINT
JESD-30 code	S-PBGA-B529
JESD-609 code	e1
length	19 mm
Humidity sensitivity level	4
Number of terminals	529
Maximum operating temperature	85 °C
Minimum operating temperature
Package body material	PLASTIC/EPOXY
encapsulated code	HBGA
Encapsulate equivalent code	BGA529,23X23,32
Package shape	SQUARE
Package form	GRID ARRAY, HEAT SINK/SLUG
Peak Reflow Temperature (Celsius)	245
power supply	1.3,1.8/3.3 V
Certification status	Not Qualified
RAM (number of words)	8192
Maximum seat height	3.3 mm
Maximum supply voltage	1.365 V
Minimum supply voltage	1.235 V
Nominal supply voltage	1.3 V
surface mount	YES
technology	CMOS
Temperature level	OTHER
Terminal surface	Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	19 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR CIRCUIT
Base Number Matches	1

TMS320DM6467TCUT1 Related Products

	TMS320DM6467TCUT1	TMS320DM6467TCUT9	TMS320DM6467TZUT1	TMS320DM6467TZUTD1	TMS320DM6467TCUTD1
Description	Digital Media System-on-Chip 529-FCBGA 0 to 85	Digital Media System-on-Chip 529-FCBGA 0 to 85	Digital Media System-on-Chip 529-FCBGA 0 to 85	Digital Signal Processors & Controllers - DSP, DSC Dig Media System-on-	Digital Media System-on-Chip 529-FCBGA -40 to 85
Brand Name	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to
Parts packaging code	BGA	BGA	BGA	BGA	BGA
package instruction	HBGA, BGA529,23X23,32	FCBGA-529	FBGA, BGA529,23X23,32	FBGA, BGA529,23X23,32	HBGA, BGA529,23X23,32
Contacts	529	529	529	529	529
Reach Compliance Code	compli	compliant	unknow	compli	compli
Other features	ALSO REQUIRES 3.3V I/O SUPPLY	ALSO REQUIRES 3.3V I/O SUPPLY	ALSO REQUIRES 3.3V I/O SUPPLY	ALSO REQUIRES 3.3V I/O SUPPLY	ALSO REQUIRES 3.3V I/O SUPPLY
bit size	32	32	32	32	32
Format	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT
JESD-30 code	S-PBGA-B529	S-PBGA-B529	S-PBGA-B529	S-PBGA-B529	S-PBGA-B529
JESD-609 code	e1	e1	e1	e1	e1
length	19 mm	19 mm	19 mm	19 mm	19 mm
Humidity sensitivity level	4	4	4	4	4
Number of terminals	529	529	529	529	529
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	HBGA	HBGA	FBGA	FBGA	HBGA
Encapsulate equivalent code	BGA529,23X23,32	BGA529,23X23,32	BGA529,23X23,32	BGA529,23X23,32	BGA529,23X23,32
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY, HEAT SINK/SLUG	GRID ARRAY, HEAT SINK/SLUG	GRID ARRAY, FINE PITCH	GRID ARRAY, FINE PITCH	GRID ARRAY, HEAT SINK/SLUG
Peak Reflow Temperature (Celsius)	245	245	245	245	245
power supply	1.3,1.8/3.3 V	1.3,1.8/3.3 V	1.3,1.8/3.3 V	1.3,1.8/3.3 V	1.3,1.8/3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
RAM (number of words)	8192	8192	8192	8192	8192
Maximum seat height	3.3 mm	3.3 mm	3.3 mm	3.3 mm	3.3 mm
Maximum supply voltage	1.365 V	1.365 V	1.365 V	1.365 V	1.365 V
Minimum supply voltage	1.235 V	1.235 V	1.235 V	1.235 V	1.235 V
Nominal supply voltage	1.3 V	1.3 V	1.3 V	1.3 V	1.3 V
surface mount	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	OTHER	OTHER	OTHER	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form	BALL	BALL	BALL	BALL	BALL
Terminal pitch	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	19 mm	19 mm	19 mm	19 mm	19 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR CIRCUIT	MICROPROCESSOR CIRCUIT	MICROPROCESSOR CIRCUIT	MICROPROCESSOR CIRCUIT	MICROPROCESSOR CIRCUIT
Is it lead-free?	Lead free	Lead free	-	Contains lead	Lead free
ECCN code	3A991.A.2	3A991.A.2	-	-	3A991.A.2
Factory Lead Time	6 weeks	12 weeks	1 week	-	6 weeks
Bus compatibility	ETHERNET; I2C; SPI; UART; USB	ETHERNET; I2C; SPI; UART; USB	-	-	ETHERNET; I2C; SPI; UART; USB
maximum clock frequency	35 MHz	35 MHz	-	-	35 MHz
External data bus width	48	48	-	-	48
Base Number Matches	1	1	-	-	1
Maker	-	Texas Instruments	Texas Instruments	Texas Instruments	-

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