DS3685J datasheet, PDF - EEWORLD Datasheet

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DS3685J: DescriptionIC,LATCH,SINGLE,8-BIT,BIPOLAR,DIP,16PIN,CERAMIC; Categorylogic logic; File Size193KB，4 Pages; ManufacturerNational Semiconductor（TI ）; Websitehttp://www.ti.com

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DS3685J Overview

IC,LATCH,SINGLE,8-BIT,BIPOLAR,DIP,16PIN,CERAMIC

DS3685J Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	National Semiconductor（TI ）
Reach Compliance Code	compliant
JESD-30 code	R-XDIP-T16
JESD-609 code	e0
Logic integrated circuit type	D LATCH
Number of digits	8
Number of functions	1
Number of terminals	16
Maximum operating temperature	70 °C
Minimum operating temperature
Output characteristics	3-STATE
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP16,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Certification status	Not Qualified
surface mount	NO
technology	BIPOLAR
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

DS3685J Related Products

	DS3685J	DS3685J/A+	DS3685N/A+	DS3685N	DS3685N/B+
Description	IC,LATCH,SINGLE,8-BIT,BIPOLAR,DIP,16PIN,CERAMIC	IC,LATCH,SINGLE,8-BIT,BIPOLAR,DIP,16PIN,CERAMIC	IC,LATCH,SINGLE,8-BIT,BIPOLAR,DIP,16PIN,PLASTIC	IC,LATCH,SINGLE,8-BIT,BIPOLAR,DIP,16PIN,PLASTIC	IC,LATCH,SINGLE,8-BIT,BIPOLAR,DIP,16PIN,PLASTIC
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	National Semiconductor（TI ）	National Semiconductor（TI ）	National Semiconductor（TI ）	National Semiconductor（TI ）	National Semiconductor（TI ）
Reach Compliance Code	compliant	unknown	unknown	compliant	unknown
JESD-30 code	R-XDIP-T16	R-XDIP-T16	R-PDIP-T16	R-PDIP-T16	R-PDIP-T16
JESD-609 code	e0	e0	e0	e0	e0
Logic integrated circuit type	D LATCH	D LATCH	D LATCH	D LATCH	D LATCH
Number of digits	8	8	8	8	8
Number of functions	1	1	1	1	1
Number of terminals	16	16	16	16	16
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	CERAMIC	CERAMIC	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	DIP	DIP	DIP	DIP
Encapsulate equivalent code	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
surface mount	NO	NO	NO	NO	NO
technology	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL
Certification status	Not Qualified	-	-	Not Qualified	Not Qualified
package instruction	-	DIP, DIP16,.3	DIP, DIP16,.3	-	DIP, DIP16,.3

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