3M
™
MetPak
™
2-FB Inverse Header
2 mm 5-Row, Right Angle, Elevated, Solder Tail
MP2 Series
• Elevated connector for offset coplanar/end-to-end
stacking
• Ideal for low profile IU boxes
• Ideal for "pizza box" applications
• Ideal for hot swapping applications
• 16 mm to 18.5 mm high profile stacking
• Mates with MP2-SXXXG sockets
• Prevents removing top cover in rack applications
• Footprint compatible with standard Futurebus+®
• See Regulatory Information Appendix (RIA)
for chemical compliance information
Date Modified: March 29, 2007
TS-1124-04
Sheet 1 of 4
Physical
Insulation
Material: High Temp LCP
Flammability: UL 94V-0
Color: Beige
Contact
Material: Copper Alloy
Plating
Underplating: 50
μ"
(1.27
μm)
Nickel
Wiping Area: See Ordering Information
Solder Tails: See Ordering Information
Electrical
Current Rating:
Signal: 1.5 A - All contacts simultaneously
Insulation Resistance:
10
3
MΩ
Withstanding Voltage:
1000 V
AC
Environmental
-55°C to +125°C
Process Temperature Rating:
260°C (Profile per J-STD-020C)
Moisture Sensitivity Level:
1 (per J-STD-020C)
Temperature Rating:
UL File No: E68080
3M
Interconnect Solutions
http://www.3M.com/interconnects/
MetPak is a trademark of 3M Company.
Futurebus+ is a registered trademark of the Institute of Electrical and Electronic Engineers, Inc. (IEEE)
3M is a trademark of 3M Company.
For technical, sales or ordering information call
800-225-5373
3M
™
MetPak
™
2-FB Inverse Header
2 mm 5-Row, Right Angle, Elevated, Solder Tail
"A"
M A T IN G L EN G T H
MP2 Series
2.00
.079
4X
21.82
.859
R OW
E
D
C
B
A
9 .4 2
.3 7 1
7 .9 2
.3 1 2
POSITION X
POSITION 1
1 2.7 5
.5 0 2
1 6 .7 5
.65 9
T A IL L EN G T H
25.75
1.014
2.00
.079
TYP.
"B"
MP2-PXXXE-5XXX-XXXX
MP2-SXXXG-51XX-XXXX
21.820
.86
7.874
.31
mm
8.000
.31
9.500
.37
15.271
.6
[inch]
Tolerance Unless Noted
0
mm
±3
0.0
±0.3
0.00
±0.13
Note:
1. Refer to IEC 61076-4-104 Futurebus+® global standard.
2. For special pin arrangements, contact 3M.
2
[ ] Dimensions for Reference Only
Ordering Information
MP2 - PXXXE - 51M1 - XXXXX
Plating Options:
(See Table 4)
P--E = Header,
elevated, inversed,
Rt. angle
Tail Length:
(See Table 3)
Rows
5 = 5 Rows
Loading Pattern
(See Table 2)
Termination Style:
M = Solder Tail
TS-1124-04
Sheet 2 of 4
Pin Count
(See Table 1)
3M
Interconnect Solutions
http://www.3M.com/interconnects/
3M is a trademark of 3M Company.
For technical, sales or ordering information call
800-225-5373
3M
™
MetPak
™
2-FB Inverse Header
2 mm 5-Row, Right Angle, Elevated, Solder Tail
Table 1 - Connector & Row Lengths
Pin
Count
120
240
Dim. "A"
mm [inch]
47.95
95.95
[1.888]
[3.778]
Dim "B"
mm [inch]
46.00
94.00
[1.811]
[3.701]
Rows
5
5
Table 2- Mate Length
Loading
Pattern
Code
1
Description
All Positions Filled
Mate length
Row A
5.00
[0.197]
Mate length
Row B
5.00
[0.197]
Mate length
Row C
5.00
[0.197]
Mate length
Row D
5.00
[0.197]
Mate length
Row E
5-Row Prod. Only
5.00
[0.197]
MP2 Series
Table 3- Tail Length
Solder Tail
Option No.
1
Description
All Positions Filled
Tail Length
Row A
3.13
[0.123]
Tail Length
Row B
3.13
[0.123]
Tail Length
Row C
3.13
[0.123]
Tail Length
Row D
2.38
[0.094]
Tail Length
Row E
2.38
[0.094]
Table 4 - Plating
Plating Suffix
TG
(RIA E3 & C2 apply)
Plating Composition
0.25 µm [10 µ"] Min. Au Contact Area
2.54 µm [100 µ"] Min. SnPb Tail Area
1.27 µm [50 µ"] Min. Ni all over
TG30
(RIA E3 & C2 apply)
0.76 µm [30 µ"] Min. Au Contact Area
2.54 µm [100 µ"] Min. SnPb Tail Area
1.27 µm [50 µ"] Min. Ni all over
0.08 µm [3 µ"] Min. Au Contact Area
TR30
(RIA E3 & C2 apply)
0.67 µm [27 µ"] Min. PdNi Contact Area
2.54 µm [100 µ"] Min. SnPb Tail Area
1.27 µm [50 µ"] Min. Ni all over
0.13 µm [5 µ"] Min. Hard Au Contact Area, Lubricated
TR40B
(RIA E3 & C2 apply)
1.02 µm [40 µ"] Min. PdNi Contact Area
0.10 µm [4 µ"] Min. Pd Contact Area
2.54 µm [100 µ"] Min. SnPb Tail Area
1.27 µm [50 µ"] Min. Ni all over
FJ
(RIA E1 & C1 apply)
KR
(RIA E1 & C1 apply)
RF
(RIA E1 & C1 apply)
0.25 µm [10 µ"] Min. Au Contact Area
5.08 µm [200 µ"] Min. Matt Whisker Mitigating Sn Tail Area
1.27 µm [50 µ"] Min. Ni all over
0.76 µm [30 µ"] Min. Au Contact Area
5.08 µm [200 µ"] Min. Matt Whisker Mitigating Sn Tail Area
1.27 µm [50 µ"] Min. Ni all over
1.27 µm [50 µ"] Min. Au Contact Area, Lubricated
5.08 µm [200 µ"] Min. Matt Whisker Mitigating Sn Tail Area
1.27 µm [50 µ"] Min. Ni all over
0.08 µm [3 µ"] Min. Au Contact Area
LR
(RIA E1 & C1 apply)
0.67 µm [27 µ"] Min. PdNi Contact Area
5.08 µm [200 µ"] Min. Matt Whisker Mitigating Sn Tail Area
1.27 µm [50 µ"] Min. Ni all over
0.13 µm [5 µ"] Min. Hard Au Contact Area, Lubricated
PD
(RIA E1 & C1 apply)
1.02 µm [40 µ"] Min. PdNi Contact Area
0.10 µm [4 µ"] Min. Pd Contact Area
5.08 µm [200 µ"] Min. Matt Whisker Mitigating Sn Tail Area
1.27 µm [50 µ"] Min. Ni all over
TS-1124-04
Sheet 3 of 4
3M
Interconnect Solutions
http://www.3M.com/interconnects/
3M is a trademark of 3M Company.
For technical, sales or ordering information call
800-225-5373
3M
™
MetPak
™
2-FB Inverse Header
2 mm 5-Row, Right Angle, Elevated, Solder Tail
MP2 Series
8.00
.315
2.00
.079
2.00
.079
TYP.
A1
4X
5.00
.197
12.00
.472
"B"
O
2.05
.081
+.05
-.00
+.002
-.000
TYP. UNPLATED THRU HOLE
l O
.10
"D" PLATED THRU HOLE
l O
.10
RECOMMENDED PCB HOLE MOUNTING PATTERN
Table 5 -- HOLE PLATING For TG, TG30, TR30, TR40B FINISHES ONLY
HOLE
"D"
Finished Dia.
mm [in]
0.65-0.80 [.0256-.0315]
Cu Thickness mm
[in]
0.025 [.001] min
SnPb Thickness
microns [µ"]
15 [600] max
Drilled Hole Dia.
mm [in]
0.81-0.86 [.0319-.0339]
Table 6 -- HOLE PLATING For FJ, KR, RF, LR, and PD FINISHES ONLY
Finished Dia.
mm [in]
0.700-0.800
[.0276-.0315]
Cu Thickness
mm [in]
0.025-0.045
[0.001-0.002]
Immersion Matte
Sn Thickness
microns [µ"]
0.5 - 2.5
[20 - 100]
Electrolitic Au
Thickness
microns [µ"]
0.1 - 0.5
[4 - 20]
OSP ENTEK
Thickness
microns [µ"]
0.2 - 0.5
[8 - 20]
Drilled Hole Dia.
mm [in]
0.830-0.860 [.0330-.0340] or
0.85mm [ #66] TWIST DRILL
Hole
"D"
TS-1124-04
Sheet 4 of 4
3M
Interconnect Solutions
http://www.3M.com/interconnects/
3M is a trademark of 3M Company.
For technical, sales or ordering information call
800-225-5373
Regulatory Information Appendix
3M Electronic Solutions Division/Interconnect
EUROPE
Appendix E1: European Union RoHS
Directive 2002/95/EC, Restriction of the Use of Certain Hazardous Substances in Electrical & Electronic Equipment, as
amended by EU Commission Decision 2005/618/EC.
This product is RoHS Compliant 2005/95/EC.
“RoHS Compliant 2005/95/EC” means that the product or part (“Product”) does not contain any of the substances in
excess of the maximum concentration values in EU Directive 2002/95/EC, as amended by Commission Decision 2005/618/
EC, unless the substance is in an application that is exempt under EU RoHS. Unless otherwise stated by 3M in writing, this
information represents 3M’s best knowledge and belief based upon information provided by third party suppliers to 3M.
In the event any product is proven not to conform with 3M’s Regulatory Information Appendix, then 3M’s entire liability
and Buyer’s exclusive remedy will be in accordance with the Warranty stated below.
Appendix E2: European Union RoHS
Directive 2002/95/EC, Restriction of the Use of Certain Hazardous Substances in Electrical & Electronic Equipment, as
amended by EU Commission Decision 2005/618/EC.
This product contains lead in the compliant pin area in excess of the maximum concentration value allowed but is
compliant by exemption under EU Commission Decision 2005/747/EC.
“RoHS Compliant 2005/95/EC” means that the product or part (“Product”) does not contain any of the substances in
excess of the maximum concentration values in EU Directive 2002/95/EC, as amended by Commission Decision 2005/618/
EC, unless the substance is in an application that is exempt under EU RoHS. Unless otherwise stated by 3M in writing, this
information represents 3M’s best knowledge and belief based upon information provided by third party suppliers to 3M.
In the event any product is proven not to conform with 3M’s Regulatory Information Appendix, then 3M’s entire liability
and Buyer’s exclusive remedy will be in accordance with the Warranty stated below.
Appendix E3: European Union RoHS
Directive 2002/95/EC, Restriction of the Use of Certain Hazardous Substances in Electrical & Electronic Equipment as
amended by Commission Decision 2005/618/EC.
This product contains lead in the solder tail area in excess of the maximum concentration value allowed.
Unless otherwise stated by 3M in writing, this information represents 3M’s best knowledge and belief based upon
information provided by third party suppliers to 3M.
In the event any product is proven not to conform with 3M’s Regulatory Information Appendix, then 3M’s entire liability
and Buyer’s exclusive remedy will be in accordance with the Warranty stated below.
Appendix E4: European Union RoHS
Directive 2002/95/EC, Restriction of the Use of Certain Hazardous Substances in Electrical & Electronic Equipment, as
amended by EU Commission Decision 2005/618/EC.
This product contains decaBDE in the insulating material in excess of the maximum concentration value allowed but is
compliant by exemption under EU Commission Decision 2005/17/EC.
“RoHS Compliant 2005/95/EC” means that the product or part (“Product”) does not contain any of the substances in
excess of the maximum concentration values in EU Directive 2002/95/EC, as amended by Commission Decision
2005/618/EC, unless the substance is in an application that is exempt under EU RoHS. Unless otherwise stated by 3M in
writing, this information represents 3M’s best knowledge and belief based upon information provided by third party
suppliers to 3M.
In the event any product is proven not to conform with 3M’s Regulatory Information Appendix, then 3M’s entire liability
and Buyer’s exclusive remedy will be in accordance with the Warranty stated below.
RIA-2217-A
京公网安备 11010802033920号
EEWORLD
