CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product
reliability and result in failures not covered by warranty.
NOTES:
3. Extended operation at these conditions may compromise reliability. Exceeding these limits will result in damage. Recommended operating conditions
define limits where specifications are established.
4. Refer to
“Bottom Metal Mounting Guidelines” on page 15.
5. Product capability established by initial characterization. The “EH” version is acceptance tested on a wafer-by-wafer basis to 50krad(Si) at low dose rate.
6.
θ
JA
is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See
TechBrief
TB379.
7. For
JC
, the “case temp” location is the center of the exposed metal pad on the package underside.
8. Electromigration specification defined as lifetime average junction temperature of +150°C where maximum rated DC current = lifetime average
current.
9. SET performance of ±5% applies to V
OUT
≥
2.5V. For V
OUT
<2.5V SEE testing will need to be performed to ensure system SET goals are met.
Electrical Specifications
Unless otherwise noted, V
IN
= V
OUT
+ 0.5V, V
OUT
= 4.0V, C
IN
= C
OUT
= 2x100µF 60mΩ, KEMET type
T541X107N025AH or equivalent, T
J
= +25°C, I
L
= 0A. Applications must follow thermal guidelines of the package to determine worst case junction
temperature. Please refer to
“Applications Information” on page 15
and Tech Brief
TB379.
Boldface limits apply across the operating temperature range,
-55°C to +125°C. Pulse load techniques used by ATE to ensure T
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Microcontroller MCU
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