HGL341A thru HGL341M
SURFACE
SURFACE MOUNT GLASS
FEATURES
Ldeal for surface mounted applications
Low leakage current
Glass passivated chips
High temperature soldering guaranteed
250
o
C/10 seconds/.375 , (9.5mm) lead lengths
DO-213AA / MINI MELF
SOLDERABLE ENDS
D1= 0.066(1.676)
0.060(1.524)
CATHODE BAND
D2
MECHANICAL DATA
Molded plastic use UL94V-0 recoqnized
flame retardant epoxy
Terminals Plated terminals, solderable per
MIL-STD-202, Method208
Polarity Color band on body denotes cathode
Mounting position Any
Weight 0.036gram
Case
0.022(0.559)
0.016(0.406)
0.145(3.683)
0.131(3.327)
D2=D1 +0
-0.008(0.20)
Dimension in inches (millimeters )
MAXIMUM RATIXGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25
o
C ambient temp. unless otherwise specified
Single phase, half sine wave, 60Hz, resistive or inductive load
For capacitive load, derate current by 20%
SYMBOL
Maximum Current Peak Reverse Voltage
Maximum RMS Voltage
Maximum DC Blocking Voltage
Maximum Average Forward Rectified Current T
T
=55
0
C
Peak Forward Surge Current Single Sine-Wave on Rated
Load (JEDEC Method)
Maximum Instantaneous Forward Voltage Drop at 1.0A DC
Maximum DC Reverse Current T
A
=25
0
C
at Rated DC Blocking Voltage T
A
=125
0
C
Maximum Reverse Recovery Time, Test Conditions I
F
=0.5A,
I
R
=1.0A , I
RR
=0.25A
Typical Junction Capacitance
Operating Junction and Storage Temperature Range
V
RRM
V
RMS
V
DC
I
(AV)
I
FSM
V
F
I
R
1.1
HGL
341A
HGL
341B
HGL
341D
HGL
341G
HGL
341J
HGL
341K
HGL
341M
UNITS
Volts
Volts
Volts
Amps
Amps
50
35
50
100
70
100
200
140
200
400
280
400
1.0
10
1.3
5.0
100
600
420
600
800
560
800
1000
700
1000
1.75
Volts
A
T
RR
C
J
T
J
T
STG
50
17
75
15
nS
pF
0
-55 to +150
C
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