DIVD Function: Double-byte binary unsigned number division Entry condition: dividend is in R2, R3, R4, R5, divisor is in R6, R7. Exit information: when OV=0, double-byte quotient is in R2, R3, overflo...
1 OverviewThis is a μCOS-III operating system compatibility layer for the RT-Thread operating system, which allows projects based on the μCOS-III operating system of Micriμm, an American company, to q...
The two-month trial of TI LM3S8962 development board ( https://www.eeworld.com.cn/zhuanti/20101013TI/index.html ) has ended. Thank you for your efforts and sharing over the past period of time.Althoug...
After I cut out a lot of things, the size of NK.nb0 is still 30M, but it is obvious that I cut out a lot of content. I would like to ask you for advice....
AD When making PCB, the IC was rotated 45 degrees and the original pin number and network number were no longer in the center of the pad! Is there any way to return it to the center of the original pi...
Flip-chip and ball grid array (BGA) are two widely used packaging technologies in the electronics industry. Each has its own advantages and limitations, and in some cases, they can complement each ...[Details]
The most significant feature of IPS panels is that both electrodes are located on the same surface, unlike other LCD panels, which have electrodes arranged on top and bottom surfaces in a three-dim...[Details]
Amidst the wave of intelligent automotive transformation, advanced driver assistance is gradually emerging from cutting-edge technology into the mainstream, becoming a new frontier of industry comp...[Details]
According to foreign media reports, BMW has just been granted a patent for a screen that could cover the entire roof. BMW hopes to transform at least a portion of the vehicle's headliner into a dis...[Details]
On August 21, WeRide officially launched WePilot AiDrive, a one-stage end-to-end assisted driving solution developed in cooperation with Bosch. This comes only half a year after the two parties' "t...[Details]
Charging is a familiar process for new energy vehicles, and as a source of battery energy, charging piles are crucial. New energy vehicle charging can be divided into fast charging and slow chargin...[Details]
1. Multi-channel DAC technology bottleneck
Currently,
the development of multi-channel DAC technology focuses on two core challenges.
First, industrial applications urgently ...[Details]
Reflow soldering is one of the most commonly used methods in electronics manufacturing, allowing for the soldering of large numbers of components in a relatively short time. However, any experience...[Details]
During daily operation of an R-type power transformer, the voltage used varies as the equipment being used adjusts. This raises the question: can the transformer change voltage at this point? The a...[Details]
A patent disclosed by Ford proposes replacing traditional segmented side curtain airbags with integrated full-width side curtain airbags that span the side of the vehicle and can be deployed simult...[Details]
Tools/Materials
Yitong Chuanglian MODBUS to PROFIBUS Gateway YT-PB-03
Siemens s7-300
This article describes how to configure the YT-PB-03 MODBUS to PROFIBUS gat...[Details]
"I want to ask why there are so many manufacturers making mobile phone CPUs, but only Intel and AMD make computer CPUs?"
The progress of domestic PC CPU production has disappointed many ...[Details]
Most cameras on the market use chips manufactured by Japanese companies like Sony, Sharp, Panasonic, and LG. South Korea now has the capability to produce chips, but the quality is somewhat inferio...[Details]
Anyone who has driven a pure electric vehicle will find that it starts much faster than a fuel vehicle. So why do pure electric vehicles start so quickly?
We all know that an engine's to...[Details]
With the rapid development of the automotive industry, automotive requirements for control, communication, and network management are becoming increasingly stringent. Hardware platforms based on 32...[Details]