5962-01-141-9246 datasheet, PDF

5962-01-141-9246: DescriptionPage Mode DRAM, 16KX1, 120ns, MOS, CDIP16,; Categorystorage storage; File Size303KB，5 Pages; ManufacturerIntel; Websitehttp://www.intel.com/

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5962-01-141-9246 Overview

Page Mode DRAM, 16KX1, 120ns, MOS, CDIP16,

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Intel
package instruction	DIP, DIP16,.3
Reach Compliance Code	compliant
Maximum access time	120 ns
I/O type	SEPARATE
JESD-30 code	R-XDIP-T16
memory density	16384 bit
Memory IC Type	PAGE MODE DRAM
memory width	1
Number of terminals	16
word count	16384 words
character code	16000
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	16KX1
Output characteristics	3-STATE
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP16,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Certification status	Not Qualified
refresh cycle	128
Filter level	38535Q/M;38534H;883B
Maximum slew rate	0.025 mA
surface mount	NO
technology	MOS
Temperature level	MILITARY
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

	5962-01-141-9246	ABSM33A-06.999MHZ-D-1-X	5962-01-208-8851
Description	Page Mode DRAM, 16KX1, 120ns, MOS, CDIP16,	Parallel - Fundamental Quartz Crystal	Page Mode DRAM, 16KX1, 150ns, MOS, CDIP16,
Is it Rohs certified?	incompatible	conform to	incompatible
Reach Compliance Code	compliant	compliant	compli
Maximum operating temperature	125 °C	85 °C	125 °C
Minimum operating temperature	-55 °C	-40 °C	-55 °C
surface mount	NO	YES	NO
Maker	Intel	-	Intel
package instruction	DIP, DIP16,.3	-	DIP, DIP16,.3
Maximum access time	120 ns	-	150 ns
I/O type	SEPARATE	-	SEPARATE
JESD-30 code	R-XDIP-T16	-	R-XDIP-T16
memory density	16384 bit	-	16384 bi
Memory IC Type	PAGE MODE DRAM	-	PAGE MODE DRAM
memory width	1	-	1
Number of terminals	16	-	16
word count	16384 words	-	16384 words
character code	16000	-	16000
organize	16KX1	-	16KX1
Output characteristics	3-STATE	-	3-STATE
Package body material	CERAMIC	-	CERAMIC
encapsulated code	DIP	-	DIP
Encapsulate equivalent code	DIP16,.3	-	DIP16,.3
Package shape	RECTANGULAR	-	RECTANGULAR
Package form	IN-LINE	-	IN-LINE
Certification status	Not Qualified	-	Not Qualified
refresh cycle	128	-	128
Maximum slew rate	0.025 mA	-	0.023 mA
technology	MOS	-	MOS
Temperature level	MILITARY	-	MILITARY
Terminal form	THROUGH-HOLE	-	THROUGH-HOLE
Terminal pitch	2.54 mm	-	2.54 mm
Terminal location	DUAL	-	DUAL

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