54ACT2726FM datasheet, PDF - EEWORLD Datasheet

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54ACT2726FM: Description512X9 BI-DIRECTIONAL FIFO, CDFP28, FP-28; Categorystorage storage; File Size30KB，1 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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54ACT2726FM Overview

512X9 BI-DIRECTIONAL FIFO, CDFP28, FP-28

54ACT2726FM Parametric

Parameter Name	Attribute value
Maker	Texas Instruments
Parts packaging code	DFP
package instruction	DFP, FL28,.4
Contacts	28
Reach Compliance Code	unknown
ECCN code	EAR99
JESD-30 code	R-GDFP-F28
length	17.8435 mm
memory density	4608 bit
Memory IC Type	BI-DIRECTIONAL FIFO
memory width	9
Number of functions	1
Number of terminals	28
word count	512 words
character code	512
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	512X9
Output characteristics	3-STATE
Exportable	NO
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DFP
Encapsulate equivalent code	FL28,.4
Package shape	RECTANGULAR
Package form	FLATPACK
Parallel/Serial	PARALLEL
power supply	5 V
Certification status	Not Qualified
Maximum seat height	2.286 mm
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal form	FLAT
Terminal pitch	1.27 mm
Terminal location	DUAL
width	8.382 mm

54ACT2726FM Related Products

	54ACT2726FM	74ACT2726FC	54ACT2726DM	74ACT2726PC	74ACT2726SC	74ACT2726SCX	74ACT2726DC
Description	512X9 BI-DIRECTIONAL FIFO, CDFP28, FP-28	512X9 BI-DIRECTIONAL FIFO, CDFP28, FP-28	512X9 BI-DIRECTIONAL FIFO, CDIP28, CERAMIC, DIP-28	512X9 BI-DIRECTIONAL FIFO, PDIP28, PLASTIC, DIP-28	512X9 BI-DIRECTIONAL FIFO, PDSO28, SOIC-28	512X9 BI-DIRECTIONAL FIFO, PDSO28, SOIC-28	512X9 BI-DIRECTIONAL FIFO, CDIP28, CERAMIC, DIP-28
Maker	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Parts packaging code	DFP	DFP	DIP	DIP	SOIC	SOIC	DIP
package instruction	DFP, FL28,.4	DFP, FL28,.4	DIP, DIP28,.6	DIP, DIP28,.6	SOP, SOP28,.4	SOP,	DIP, DIP28,.6
Contacts	28	28	28	28	28	28	28
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
JESD-30 code	R-GDFP-F28	R-GDFP-F28	R-GDIP-T28	R-PDIP-T28	R-PDSO-G28	R-PDSO-G28	R-GDIP-T28
memory density	4608 bit	4608 bit	4608 bit	4608 bit	4608 bit	4608 bit	4608 bit
memory width	9	9	9	9	9	9	9
Number of functions	1	1	1	1	1	1	1
Number of terminals	28	28	28	28	28	28	28
word count	512 words	512 words	512 words	512 words	512 words	512 words	512 words
character code	512	512	512	512	512	512	512
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	125 °C	85 °C	125 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-55 °C	-40 °C	-55 °C	-40 °C	-40 °C	-40 °C	-40 °C
organize	512X9	512X9	512X9	512X9	512X9	512X9	512X9
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Exportable	NO	NO	NO	NO	NO	NO	NO
Package body material	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED
encapsulated code	DFP	DFP	DIP	DIP	SOP	SOP	DIP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	FLATPACK	FLATPACK	IN-LINE	IN-LINE	SMALL OUTLINE	SMALL OUTLINE	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	2.286 mm	2.286 mm	5.715 mm	5.334 mm	2.65 mm	2.65 mm	5.715 mm
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	YES	NO	NO	YES	YES	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	INDUSTRIAL	MILITARY	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	FLAT	FLAT	THROUGH-HOLE	THROUGH-HOLE	GULL WING	GULL WING	THROUGH-HOLE
Terminal pitch	1.27 mm	1.27 mm	2.54 mm	2.54 mm	1.27 mm	1.27 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
width	8.382 mm	8.382 mm	15.24 mm	15.24 mm	7.5 mm	7.5 mm	15.24 mm
length	17.8435 mm	17.8435 mm	-	35.725 mm	17.9 mm	17.9 mm	-
Memory IC Type	BI-DIRECTIONAL FIFO	BI-DIRECTIONAL FIFO	BI-DIRECTIONAL FIFO	BI-DIRECTIONAL FIFO	BI-DIRECTIONAL FIFO	-	BI-DIRECTIONAL FIFO
Encapsulate equivalent code	FL28,.4	FL28,.4	DIP28,.6	DIP28,.6	SOP28,.4	-	DIP28,.6
power supply	5 V	5 V	5 V	5 V	5 V	-	5 V
Is it lead-free?	-	Contains lead	-	Contains lead	Contains lead	-	Contains lead
Is it Rohs certified?	-	incompatible	-	incompatible	incompatible	-	incompatible
JESD-609 code	-	e0	-	e0	e0	-	e0
Peak Reflow Temperature (Celsius)	-	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED
Terminal surface	-	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)
Maximum time at peak reflow temperature	-	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED

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