|
5082-0113 |
5082-0840 |
5082-0833 |
5082-0114 |
5082-0151 |
| Description |
Step Recovery Diode, Ultra High Frequency to KU Band, 26GHz Max, Silicon |
Step Recovery Diode, Ultra High Frequency to KU Band, 26GHz Max, Silicon |
Step Recovery Diode, Ultra High Frequency to KU Band, 26GHz Max, Silicon |
Step Recovery Diode, Ultra High Frequency to KU Band, 26GHz Max, Silicon |
Step Recovery Diode, Ultra High Frequency to KU Band, 26GHz Max, Silicon |
| Is it Rohs certified? |
incompatible |
incompatible |
incompatible |
incompatible |
incompatible |
| Maker |
Hewlett Packard Co. |
Hewlett Packard Co. |
Hewlett Packard Co. |
Hewlett Packard Co. |
Hewlett Packard Co. |
| package instruction |
O-LALF-W2 |
O-LALF-W2 |
O-LALF-W2 |
O-LALF-W2 |
O-LALF-W2 |
| Reach Compliance Code |
unknown |
unknown |
unknown |
unknown |
unknown |
| ECCN code |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
| application |
FREQUENCY MULTIPLIER |
FREQUENCY MULTIPLIER |
FREQUENCY MULTIPLIER |
FREQUENCY MULTIPLIER |
FREQUENCY MULTIPLIER |
| Minimum breakdown voltage |
35 V |
15 V |
25 V |
35 V |
15 V |
| Shell connection |
ISOLATED |
ISOLATED |
ISOLATED |
ISOLATED |
ISOLATED |
| Configuration |
SINGLE |
SINGLE |
SINGLE |
SINGLE |
SINGLE |
| Maximum diode capacitance |
4.85 pF |
0.6 pF |
1.6 pF |
3.85 pF |
0.65 pF |
| Nominal diode capacitance |
4.8 pF |
0.6 pF |
1.6 pF |
3.8 pF |
0.65 pF |
| Diode component materials |
SILICON |
SILICON |
SILICON |
SILICON |
SILICON |
| Diode type |
STEP RECOVERY DIODE |
STEP RECOVERY DIODE |
STEP RECOVERY DIODE |
STEP RECOVERY DIODE |
STEP RECOVERY DIODE |
| frequency band |
ULTRA HIGH FREQUENCY TO KU BAND |
ULTRA HIGH FREQUENCY TO KU BAND |
ULTRA HIGH FREQUENCY TO KU BAND |
ULTRA HIGH FREQUENCY TO KU BAND |
ULTRA HIGH FREQUENCY TO KU BAND |
| JESD-30 code |
O-LALF-W2 |
O-LALF-W2 |
O-LALF-W2 |
O-LALF-W2 |
O-LALF-W2 |
| JESD-609 code |
e0 |
e0 |
e0 |
e0 |
e0 |
| Number of components |
1 |
1 |
1 |
1 |
1 |
| Number of terminals |
2 |
2 |
2 |
2 |
2 |
| Maximum operating temperature |
200 °C |
200 °C |
200 °C |
200 °C |
200 °C |
| Minimum operating temperature |
-65 °C |
-65 °C |
-65 °C |
-65 °C |
-65 °C |
| Maximum output frequency |
26 GHz |
26 GHz |
26 GHz |
26 GHz |
26 GHz |
| Package body material |
GLASS |
GLASS |
GLASS |
GLASS |
GLASS |
| Package shape |
ROUND |
ROUND |
ROUND |
ROUND |
ROUND |
| Package form |
LONG FORM |
LONG FORM |
LONG FORM |
LONG FORM |
LONG FORM |
| Peak Reflow Temperature (Celsius) |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
| Maximum power dissipation |
0.5833 W |
0.2917 W |
0.2917 W |
0.5833 W |
0.2917 W |
| Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
| surface mount |
NO |
NO |
NO |
NO |
NO |
| Terminal surface |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
| Terminal form |
WIRE |
WIRE |
WIRE |
WIRE |
WIRE |
| Terminal location |
AXIAL |
AXIAL |
AXIAL |
AXIAL |
AXIAL |
| Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |