M392T5660QZA-CF70 datasheet, PDF

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M392T5660QZA-CF70: DescriptionDDR DRAM Module, 256MX72, 0.4ns, CMOS, ROHS COMPLIANT, DIMM-240; Categorystorage storage; File Size615KB，27 Pages; ManufacturerSAMSUNG; Websitehttp://www.samsung.com/Products/Semiconductor/

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M392T5660QZA-CF70 Overview

DDR DRAM Module, 256MX72, 0.4ns, CMOS, ROHS COMPLIANT, DIMM-240

M392T5660QZA-CF70 Parametric

Parameter Name	Attribute value
Maker	SAMSUNG
Parts packaging code	DIMM
package instruction	DIMM,
Contacts	240
Reach Compliance Code	unknown
ECCN code	EAR99
access mode	SINGLE BANK PAGE BURST
Maximum access time	0.4 ns
Other features	AUTO/SELF REFRESH
JESD-30 code	R-XDMA-N240
memory density	19327352832 bit
Memory IC Type	DDR DRAM MODULE
memory width	72
Number of functions	1
Number of ports	1
Number of terminals	240
word count	268435456 words
character code	256000000
Operating mode	SYNCHRONOUS
organize	256MX72
Package body material	UNSPECIFIED
encapsulated code	DIMM
Package shape	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY
Certification status	Not Qualified
self refresh	YES
Maximum supply voltage (Vsup)	1.9 V
Minimum supply voltage (Vsup)	1.7 V
Nominal supply voltage (Vsup)	1.8 V
surface mount	NO
technology	CMOS
Terminal form	NO LEAD
Terminal location	DUAL

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VLP RDIMM

DDR2 SDRAM

DDR2 VLP Registered SDRAM MODULE

240pin VLP Registered Module based on 1Gb Q-die

72-bit ECC

60FBGA / 63FBGA / 65FBGA with Lead-free and Halogen-free

(RoHS compliant)

INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS,

AND IS SUBJECT TO CHANGE WITHOUT NOTICE.

NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE,

EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE,

TO ANY INTELLECTUAL PROPERTY RIGHTS IN SAMSUNG PRODUCTS OR TECHNOLOGY. ALL

INFORMATION IN THIS DOCUMENT IS PROVIDED

ON AS "AS IS" BASIS WITHOUT GUARANTEE OR WARRANTY OF ANY KIND.

1. For updates or additional information about Samsung products, contact your nearest Samsung office.

2. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or similar

applications where Product failure couldresult in loss of life or personal or physical harm, or any military or

defense application, or any governmental procurement to which special terms or provisions may apply.

* Samsung Electronics reserves the right to change products or specification without notice.

1 of 27

Rev. 1.0 April 2008

VLP RDIMM

Table of Contents

DDR2 SDRAM

1.0 DDR2 Registered DIMM Ordering Information ...........................................................................4

2.0 Features .........................................................................................................................................4

3.0 Address Configuration .................................................................................................................4

4.0 Pin Configurations (Front side/Back side) .................................................................................5

5.0Pin Description ...............................................................................................................................5

6.0 Input/Output Function Description .............................................................................................6

7.0 Functional Block Diagram ............................................................................................................7

7.1 1GB, 128Mx72 Module - M392T2863QZA

...........................................................................................7

7.2 2GB, 256Mx72 Module - M392T5663QZA

...........................................................................................8

7.3 2GB, 256Mx72 Module - M392T5660QZA

...........................................................................................9

7.4 4GB, DDP 512Mx72 Module - M392T5160QJA

..................................................................................10

7.5 8GB, QDP 1Gx72 Module - M392T1G60QQA

....................................................................................11

8.0 Absolute Maximum DC Ratings .................................................................................................12

9.0 AC & DC Operating Conditions .................................................................................................12

9.1 Recommended DC Operating Conditions (SSTL - 1.8)

.......................................................................12

9.2 Operating Temperature Condition

..................................................................................................13

9.3 Input DC Logic Level

....................................................................................................................13

9.4 Input AC Logic Level

....................................................................................................................13

9.5 AC Input Test Conditions

..............................................................................................................13

10.0 IDD Specification Parameters Definition ................................................................................14

11.0 Operating Current Table ...........................................................................................................15

11.1 M392T2863QZA : 1GB(128Mx8 *9) Module

..................................................................................15

11.2 M392T2863QZA : 1GB(128Mx8 *9) Module - considering Register and PLL current value

.................15

11.3 M392T5663QZA : 2GB(128Mx8 *18) Module

.................................................................................16

11.4 M392T5663QZA : 2GB(128Mx8 *18) Module - considering Register and PLL current value

.............. 16

11.5 M392T5660QZA : 2GB(256Mx4 *18) Module

................................................................................ 17

11.6 M392T5660QZA : 2GB(256Mx4 *18) Module - considering Register and PLL current value

...............17

11.7 M392T5160QJA : 4GB(DDP 512Mx4 *18) Module

.........................................................................18

11.8 M392T5160QJA : 4GB(DDP 512Mx4 *18) Module - considering Register and PLL current value

.......18

11.9 M392T1G60QQA : 8GB(QDP 1Gx4 *18) Module

...........................................................................19

11.10 M392T1G60QQA : 8GB(QDP 1Gx4 *18) Module - considering Register and PLL current value

........19

12.0 Input/Output Capacitance ........................................................................................................20

13.0 Electrical Characteristics & AC Timing for DDR2-800/667/533 .............................................20

13.1 Refresh Parameters by Device Density

.......................................................................................20

13.2 Speed Bins and CL, tRCD, tRP, tRC and tRAS for Corresponding Bin

............................................20

13.3 Timing Parameters by Speed Grade

...........................................................................................21

14.0 Physical Dimensions : ..............................................................................................................23

14.1 128Mbx8 based 128Mx72 Module (1 Rank)

..................................................................................23

14.2 128Mbx8/256Mbx4 based 256Mx72 Module (2/1 Ranks)

.................................................................24

14.3 DDP 512Mbx4 based 512Mx72 Module (2 Ranks)

..........................................................................25

14.4 QDP 1G x4 based 1Gx72 Module (4 Ranks)

..................................................................................26

15.0 240 Pin DDR2 Registered DIMM Clock Topology ..................................................................27

2 of 27

Rev. 1.0 April 2008

M392T5660QZA-CF70 Related Products

	M392T5660QZA-CF70	M392T2863QZA-CF70	M392T5160QJA-CE60	M392T5160QJA-CF70	M392T1G60QQA-CD50	M392T5663QZA-CE60	M392T5660QZA-CE60	M392T2863QZA-CE60
Description	DDR DRAM Module, 256MX72, 0.4ns, CMOS, ROHS COMPLIANT, DIMM-240	DDR DRAM Module, 128MX72, 0.4ns, CMOS, ROHS COMPLIANT, DIMM-240	DDR DRAM Module, 512MX72, 0.45ns, CMOS, ROHS COMPLIANT, DIMM-240	DDR DRAM Module, 512MX72, 0.4ns, CMOS, ROHS COMPLIANT, DIMM-240	DDR DRAM Module, 1GX72, 0.5ns, CMOS, ROHS COMPLIANT, DIMM-240	DDR DRAM Module, 256MX72, 0.45ns, CMOS, ROHS COMPLIANT, DIMM-240	DDR DRAM Module, 256MX72, 0.45ns, CMOS, ROHS COMPLIANT, DIMM-240	DDR DRAM Module, 128MX72, 0.45ns, CMOS, ROHS COMPLIANT, DIMM-240
Maker	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG
Parts packaging code	DIMM	DIMM	DIMM	DIMM	DIMM	DIMM	DIMM	DIMM
package instruction	DIMM,	DIMM,	DIMM,	DIMM,	DIMM,	DIMM,	DIMM,	DIMM,
Contacts	240	240	240	240	240	240	240	240
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
access mode	SINGLE BANK PAGE BURST	SINGLE BANK PAGE BURST	DUAL BANK PAGE BURST	DUAL BANK PAGE BURST	FOUR BANK PAGE BURST	DUAL BANK PAGE BURST	SINGLE BANK PAGE BURST	SINGLE BANK PAGE BURST
Maximum access time	0.4 ns	0.4 ns	0.45 ns	0.4 ns	0.5 ns	0.45 ns	0.45 ns	0.45 ns
Other features	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH
JESD-30 code	R-XDMA-N240	R-XDMA-N240	R-XDMA-N240	R-XDMA-N240	R-XDMA-N240	R-XDMA-N240	R-XDMA-N240	R-XDMA-N240
memory density	19327352832 bit	9663676416 bit	38654705664 bit	38654705664 bit	77309411328 bit	19327352832 bit	19327352832 bit	9663676416 bit
Memory IC Type	DDR DRAM MODULE	DDR DRAM MODULE	DDR DRAM MODULE	DDR DRAM MODULE	DDR DRAM MODULE	DDR DRAM MODULE	DDR DRAM MODULE	DDR DRAM MODULE
memory width	72	72	72	72	72	72	72	72
Number of functions	1	1	1	1	1	1	1	1
Number of ports	1	1	1	1	1	1	1	1
Number of terminals	240	240	240	240	240	240	240	240
word count	268435456 words	134217728 words	536870912 words	536870912 words	1073741824 words	268435456 words	268435456 words	134217728 words
character code	256000000	128000000	512000000	512000000	1000000000	256000000	256000000	128000000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
organize	256MX72	128MX72	512MX72	512MX72	1GX72	256MX72	256MX72	128MX72
Package body material	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
encapsulated code	DIMM	DIMM	DIMM	DIMM	DIMM	DIMM	DIMM	DIMM
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
self refresh	YES	YES	YES	YES	YES	YES	YES	YES
Maximum supply voltage (Vsup)	1.9 V	1.9 V	1.9 V	1.9 V	1.9 V	1.9 V	1.9 V	1.9 V
Minimum supply voltage (Vsup)	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V
Nominal supply voltage (Vsup)	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V
surface mount	NO	NO	NO	NO	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Terminal form	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL

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