RH1573K_12 datasheet, PDF - EEWORLD Datasheet

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RH1573K_12: DescriptionRH1573K LOW DROPOUT PNP REGULATOR DRIVER DICE; File Size218KB，13 Pages; ManufacturerLinear ( ADI ); Websitehttp://www.analog.com/cn/index.html

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RH1573K LOW DROPOUT PNP REGULATOR DRIVER DICE

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SPEC NO. 05-08-5223 REV. B

RH1573K LOW DROPOUT PNP REGULATOR DRIVER DICE

REVISION RECORD

REV

INITIAL RELEASE

DESCRIPTION

•

PAGE 8, CHANGED OUT ORIGINAL BURN-IN CIRCUIT WITH THE ACTUAL BURN-IN

CIRCUIT FROM 04-06-0689.

•

PAGE 13, CHANGED RH CANNED SAMPLE TABLE III FOR QUALIFYING DICE SALES

ADDED TEMPERATURE CYCLE, CONSTANT ACCELERATION & REMOVED PIND TEST.

Page 2, amended section 3.3 Special Handling of Dice to more accurately describe our current

procedures and requirements.

DATE

09/22/08

03/03/09

04/03/12

CAUTION: ELECTROSTATIC DISCHARGE SENSITIVE PART

REVISION

INDEX

REVISION

INDEX

PAGE NO.

REVISION

PAGE NO.

REVISION

ORIG

DSGN

ENGR

MFG

APPLICATION

PROG

FUNCT

SIGNOFFS

LINEAR TECHNOLOGY

CORPORATION

MILPITAS, CALIFORNIA

TITLE:

MICROCIRCUIT, LINEAR,

RH1573K LOW DROPOUT PNP

REGULATOR DRIVER DICE

SIZE

CAGE

CODE

DRAWING NUMBER

REV

64155

DATE

CONTRACT:

05-08-5223

FOR OFFICIAL USE ONLY

LINEAR TECHNOLOGY CORPORATION

PAGE

OF13

SPEC NO. 05-08-5223 REV. B

RH1573K LOW DROPOUT PNP REGULATOR DRIVER DICE

1.0

SCOPE:

1.1

This specification defines the performance and test requirements for a microcircuit processed to a space

level manufacturing flow.

2.0

APPLICABLE DOCUMENTS:

2.1

Government Specifications and Standards: the following documents listed in the Department of

Defense Index of Specifications and Standards, of the issue in effect on the date of solicitation, form a

part of this specification to the extent specified herein.

SPECIFICATIONS:

MIL-PRF-38535

MIL-STD-883

MIL-STD-1835

2.2

Integrated Circuits (Microcircuits) Manufacturing, General Specification for

Test Method and Procedures for Microcircuits

Microcircuits Case Outlines

Order of Precedence: In the event of a conflict between the documents referenced herein and the

contents of this specification, the order of precedence shall be this specification, MIL-PRF-38535 and

other referenced specifications.

3.0

REQUIREMENTS:

3.1

General Description: This specification details the requirements for the RH1573K, DICE and Element

Evaluation Test Samples, processed to space level manufacturing flow as specified herein.

Part Number:

RH1573K Dice

3.2

3.3

Special Handling of Dice:

Rad Hard dice require special handling as compared to standard IC dice.

Rad Hard dice are susceptible to surface damage due to the absence of silicon nitride passivation that is

present on most standard dice. Silicon nitride protects the dice surface from scratches by its hard and

dense properties. The passivation on Linear Technology’s Rad Hard dice is silicon dioxide which is

much “softer” than silicon nitride. . During the visual and preparation for shipment, ESD safe Tweezers

are used and only the edge of the die are touched.

LTC recommends that dice handling be performed with extreme care so as to protect the die surface

from scratches. If the need arises to move the die in or out of the chip shipment tray (waffle pack), use

an ESD-Safe-Plastic-tipped Bent Metal Vacuum Probe, preferably .020” OD x .010” ID (for use with

tiny parts). The wand should be compatible with continuous air vacuums. The tip material should be

static dissipative Delrin (or equivalent) plastic.

During die attach, care must be exercised to ensure no tweezers, or other equipment, touch the top of

the dice.

LINEAR TECHNOLOGY CORPORATION

PAGE

OF13

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