UPD43100AGZ-B10-9KH datasheet, PDF

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UPD43100AGZ-B10-9KH: DescriptionUPD43100AGZ-B10-9KH; Categorystorage storage; File Size704KB，19 Pages; ManufacturerRenesas Electronics Corporation; Websitehttps://www.renesas.com/

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UPD43100AGZ-B10-9KH

UPD43100AGZ-B10-9KH Parametric

Parameter Name	Attribute value
Maker	Renesas Electronics Corporation
package instruction	,
Reach Compliance Code	compliant

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UPD43100AGZ-B10-9KH Related Products

	UPD43100AGZ-B10-9KH	UPD43100AGZ-B10-9JH	UPD43100AGZ-B10-KJH	UPD431000BCZ-85	UPD431000AGW(F)-10L	UPD431000BCZ-70	UPD431000BGZ-55L-KKH	UPD431000BGZ-70L-KKH
Description	UPD43100AGZ-B10-9KH	UPD43100AGZ-B10-9JH	UPD43100AGZ-B10-KJH	IC,SRAM,128KX8,CMOS,DIP,32PIN,PLASTIC	IC,SRAM,128KX8,CMOS,SOP,32PIN,PLASTIC	IC,SRAM,128KX8,CMOS,DIP,32PIN,PLASTIC	IC,SRAM,128KX8,CMOS,TSSOP,32PIN,PLASTIC	IC,SRAM,128KX8,CMOS,TSSOP,32PIN,PLASTIC
package instruction	,	,	,	DIP, DIP32,.6	SOP, SOP32,.56	DIP, DIP32,.6	TSSOP, TSSOP32,.8,20	TSSOP, TSSOP32,.8,20
Reach Compliance Code	compliant	compliant	compliant	unknown	unknown	unknown	unknown	unknown
Is it Rohs certified?	-	-	-	incompatible	incompatible	incompatible	incompatible	incompatible
Objectid	-	-	-	1156994867	1156994859	1156994865	1156994877	1156994881
ECCN code	-	-	-	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	-	-	-	85 ns	100 ns	70 ns	55 ns	70 ns
I/O type	-	-	-	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	-	-	-	R-PDIP-T32	R-PDSO-G32	R-PDIP-T32	R-PDSO-G32	R-PDSO-G32
JESD-609 code	-	-	-	e0	e0	e0	e0	e0
memory density	-	-	-	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit
Memory IC Type	-	-	-	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	-	-	-	8	8	8	8	8
Number of terminals	-	-	-	32	32	32	32	32
word count	-	-	-	131072 words	131072 words	131072 words	131072 words	131072 words
character code	-	-	-	128000	128000	128000	128000	128000
Operating mode	-	-	-	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	-	-	-	70 °C	85 °C	70 °C	70 °C	70 °C
organize	-	-	-	128KX8	128KX8	128KX8	128KX8	128KX8
Output characteristics	-	-	-	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	-	-	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	-	-	-	DIP	SOP	DIP	TSSOP	TSSOP
Encapsulate equivalent code	-	-	-	DIP32,.6	SOP32,.56	DIP32,.6	TSSOP32,.8,20	TSSOP32,.8,20
Package shape	-	-	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	-	-	-	IN-LINE	SMALL OUTLINE	IN-LINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial	-	-	-	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
power supply	-	-	-	5 V	5 V	5 V	5 V	5 V
Certification status	-	-	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum standby current	-	-	-	0.00005 A	0.0001 A	0.00005 A	0.000005 A	0.000005 A
Minimum standby current	-	-	-	2 V	2 V	2 V	2 V	2 V
Maximum slew rate	-	-	-	0.06 mA	0.07 mA	0.065 mA	0.07 mA	0.065 mA
Nominal supply voltage (Vsup)	-	-	-	5 V	5 V	5 V	5 V	5 V
surface mount	-	-	-	NO	YES	NO	YES	YES
technology	-	-	-	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	-	-	-	COMMERCIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	-	-	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	-	-	-	THROUGH-HOLE	GULL WING	THROUGH-HOLE	GULL WING	GULL WING
Terminal pitch	-	-	-	2.54 mm	1.27 mm	2.54 mm	0.5 mm	0.5 mm
Terminal location	-	-	-	DUAL	DUAL	DUAL	DUAL	DUAL

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