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89H24NT6AG2ZCHLGI

Description
FCBGA-484, Tray
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size516KB,35 Pages
ManufacturerIDT (Integrated Device Technology)
Environmental Compliance  
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89H24NT6AG2ZCHLGI Overview

FCBGA-484, Tray

89H24NT6AG2ZCHLGI Parametric

Parameter NameAttribute value
Brand NameIntegrated Device Technology
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerIDT (Integrated Device Technology)
Parts packaging codeFCBGA
package instructionBGA, BGA484,22X22,40
Contacts484
Manufacturer packaging codeHLG484
Reach Compliance Codecompliant
ECCN codeEAR99
Samacsys DescriptionFLIP CHIP BGA 23 X 23MM 1.0 MM PITCH
Other featuresALSO OPERATES AT 100 MHZ
Bus compatibilityI2C; ISA; VGA
maximum clock frequency125 MHz
Drive interface standardsIEEE 1149.6AC; IEEE 1149.1
JESD-30 codeS-PBGA-B484
JESD-609 codee1
length23 mm
Humidity sensitivity level4
Number of terminals484
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Encapsulate equivalent codeBGA484,22X22,40
Package shapeSQUARE
Package formGRID ARRAY
Peak Reflow Temperature (Celsius)250
power supply1,3.3 V
Certification statusNot Qualified
Maximum seat height2.92 mm
Maximum supply voltage1.1 V
Minimum supply voltage0.9 V
Nominal supply voltage1 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Silver/Copper (Sn/Ag/Cu)
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width23 mm
uPs/uCs/peripheral integrated circuit typeBUS CONTROLLER, PCI
24-Lane 6-Port PCIe® Gen2
System Interconnect Switch
®
89HPES24NT6AG2
Datasheet
Device Overview
The 89HPES24NT6AG2 is a member of the IDT family of PCI
Express® switching solutions. The PES24NT6AG2 is a 24-lane, 6-port
system interconnect switch optimized for PCI Express Gen2 packet
switching in high-performance applications, supporting multiple simulta-
neous peer-to-peer traffic flows. Target applications include multi-host or
intelligent I/O based systems where inter-domain communication is
required, such as servers, storage, communications, and embedded
systems.
Features
High Performance Non-Blocking Switch Architecture
24-lane, 6-port PCIe switch with flexible port configuration
Integrated SerDes supports 5.0 GT/s Gen2 and 2.5 GT/s
Gen1 operation
Delivers up to 24 GBps (192 Gbps) of switching capacity
Supports 128 Bytes to 2 KB maximum payload size
Low latency cut-through architecture
Supports one virtual channel and eight traffic classes
Port Configurability
Six x4 ports
Automatic per port link width negotiation
(x4
x2
x1)
Crosslink support
Automatic lane reversal
Per lane SerDes configuration
De-emphasis
Receive equalization
Drive strength
Innovative Switch Partitioning Feature
Supports up to 6 fully independent switch partitions
Logically independent switches in the same device
Configurable downstream port device numbering
Supports dynamic reconfiguration of switch partitions
Dynamic port reconfiguration — downstream, upstream,
non-transparent bridge
Dynamic migration of ports between partitions
Movable upstream port within and between switch partitions
Non-Transparent Bridging (NTB) Support
Supports up to 6 NT endpoints per switch, each endpoint can
communicate with other switch partitions or external PCIe
domains or CPUs
6 BARs per NT Endpoint
Bar address translation
All BARs support 32/64-bit base and limit address translation
Two BARs (BAR2 and BAR4) support look-up table based
address translation
32 inbound and outbound doorbell registers
4 inbound and outbound message registers
Supports up to 64 masters
Unlimited number of outstanding transactions
Multicast
Compliant with the PCI-SIG multicast
Supports 64 multicast groups
Supports multicast across non-transparent port
Multicast overlay mechanism support
ECRC regeneration support
Integrated Direct Memory Access (DMA) Controllers
Supports up to 2 DMA upstream ports, each with 2 DMA chan-
nels
Supports 32-bit and 64-bit memory-to-memory transfers
Fly-by translation provides reduced latency and increased
performance over buffered approach
Supports arbitrary source and destination address alignment
Supports intra- as well as inter-partition data transfers using
the non-transparent endpoint
Supports DMA transfers to multicast groups
Linked list descriptor-based operation
Flexible addressing modes
Linear addressing
Constant addressing
Quality of Service (QoS)
Port arbitration
Round robin
Request metering
IDT proprietary feature that balances bandwidth among
switch ports for maximum system throughput
High performance switch core architecture
Combined Input Output Queued (CIOQ) switch architecture
with large buffers
Clocking
Supports 100 MHz and 125 MHz reference clock frequencies
Flexible port clocking modes
Common clock
Non-common clock
Local port clock with SSC (spread spectrum setting) and port
reference clock input
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc.
1 of 34
2013 Integrated Device Technology, Inc
December 17, 2013

89H24NT6AG2ZCHLGI Related Products

89H24NT6AG2ZCHLGI 89H24NT6AG2ZCHLG8 89H24NT6AG2ZBHL 89H24NT6AG2ZBHLG 89H24NT6AG2ZBHLGI8 89H24NT6AG2ZBHLI 89H24NT6AG2ZCHL 89H24NT6AG2ZCHLG
Description FCBGA-484, Tray FCBGA-484, Reel FCBGA-484, Tray FCBGA-484, Tray FCBGA-484, Reel FCBGA-484, Tray FCBGA-484, Tray FCBGA-484, Tray
Brand Name Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology
Is it lead-free? Lead free Lead free Contains lead Lead free Lead free Contains lead Contains lead Lead free
Is it Rohs certified? conform to conform to incompatible conform to conform to incompatible incompatible conform to
Maker IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
Parts packaging code FCBGA FCBGA FCBGA FCBGA FCBGA FCBGA FCBGA FCBGA
Contacts 484 484 484 484 484 484 484 484
Manufacturer packaging code HLG484 HLG484 HL484 HLG484 HLG484 HL484 HL484 HLG484
Reach Compliance Code compliant compliant not_compliant compliant compliant not_compliant not_compliant compliant
ECCN code EAR99 EAR99 3A001.A.3 EAR99 EAR99 3A001.A.3 3A001.A.3 EAR99
JESD-609 code e1 e1 e0 e1 e1 e0 e0 e1
Humidity sensitivity level 4 4 4 4 4 4 4 4
Peak Reflow Temperature (Celsius) 250 250 225 250 250 225 225 250
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Terminal surface Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Lead (Sn/Pb) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Silver/Copper (Sn/Ag/Cu)
Maximum time at peak reflow temperature NOT SPECIFIED 30 NOT SPECIFIED NOT SPECIFIED 30 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
uPs/uCs/peripheral integrated circuit type BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI
package instruction BGA, BGA484,22X22,40 - FCBGA-484 BGA, BGA484,22X22,40 , FCBGA-484 23 X 23 MM, 1 MM PITCH, FCBGA-484 23 X 23 MM, 1 MM PITCH, GREEN, FCBGA-484
Samacsys Description FLIP CHIP BGA 23 X 23MM 1.0 MM PITCH FLIP CHIP BGA 23 X 23MM 1.0 MM PITCH - FLIP CHIP BGA 23 X 23MM 1.0 MM PITCH FLIP CHIP BGA 23 X 23MM 1.0 MM PITCH - - FLIP CHIP BGA 23 X 23MM 1.0 MM PITCH
Other features ALSO OPERATES AT 100 MHZ - ALSO OPERATES AT 100 MHZ ALSO OPERATES AT 100 MHZ - ALSO OPERATES AT 100 MHZ ALSO OPERATES AT 100 MHZ ALSO OPERATES AT 100 MHZ
Bus compatibility I2C; ISA; VGA - I2C; ISA; VGA I2C; ISA; VGA - I2C; ISA; VGA I2C; ISA; VGA I2C; ISA; VGA
maximum clock frequency 125 MHz - 125 MHz 125 MHz - 125 MHz 125 MHz 125 MHz
Drive interface standards IEEE 1149.6AC; IEEE 1149.1 - IEEE 1149.6AC; IEEE 1149.1 IEEE 1149.6AC; IEEE 1149.1 - IEEE 1149.6AC; IEEE 1149.1 IEEE 1149.6AC; IEEE 1149.1 IEEE 1149.6AC; IEEE 1149.1
JESD-30 code S-PBGA-B484 S-PBGA-B484 S-PBGA-B484 S-PBGA-B484 - S-PBGA-B484 S-PBGA-B484 S-PBGA-B484
length 23 mm - 23 mm 23 mm - 23 mm 23 mm 23 mm
Number of terminals 484 484 484 484 - 484 484 484
Maximum operating temperature 85 °C 70 °C 70 °C 70 °C - 85 °C 70 °C 70 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA BGA BGA BGA - BGA BGA BGA
Encapsulate equivalent code BGA484,22X22,40 BGA484,22X22,40 BGA484,22X22,40 BGA484,22X22,40 - BGA484,22X22,40 BGA484,22X22,40 BGA484,22X22,40
Package shape SQUARE SQUARE SQUARE SQUARE - SQUARE SQUARE SQUARE
Package form GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY - GRID ARRAY GRID ARRAY GRID ARRAY
power supply 1,3.3 V 1,3.3 V 1,3.3 V 1,3.3 V - 1,3.3 V 1,3.3 V 1,3.3 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified - Not Qualified Not Qualified Not Qualified
Maximum seat height 2.92 mm - 2.92 mm 2.92 mm - 2.92 mm 2.92 mm 2.92 mm
Maximum supply voltage 1.1 V - 1.1 V 1.1 V - 1.1 V 1.1 V 1.1 V
Minimum supply voltage 0.9 V - 0.9 V 0.9 V - 0.9 V 0.9 V 0.9 V
Nominal supply voltage 1 V - 1 V 1 V - 1 V 1 V 1 V
surface mount YES YES YES YES - YES YES YES
Temperature level INDUSTRIAL COMMERCIAL COMMERCIAL COMMERCIAL - INDUSTRIAL COMMERCIAL COMMERCIAL
Terminal form BALL BALL BALL BALL - BALL BALL BALL
Terminal pitch 1 mm 1 mm 1 mm 1 mm - 1 mm 1 mm 1 mm
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM - BOTTOM BOTTOM BOTTOM
width 23 mm - 23 mm 23 mm - 23 mm 23 mm 23 mm
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