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89H32T8G2ZCBLGI

Description
FCBGA-484, Tray
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size463KB,40 Pages
ManufacturerIDT (Integrated Device Technology)
Environmental Compliance  
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89H32T8G2ZCBLGI Overview

FCBGA-484, Tray

89H32T8G2ZCBLGI Parametric

Parameter NameAttribute value
Brand NameIntegrated Device Technology
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerIDT (Integrated Device Technology)
Parts packaging codeFCBGA
package instructionFCBGA-484
Contacts484
Manufacturer packaging codeBLG484
Reach Compliance Codecompliant
ECCN codeEAR99
Samacsys DescriptionFLIP CHIP BGA 23 X 23MM 1.0 MM PITCH
Other featuresOPERATES AT 125 MHZ CLOCK FREQUENCY
Bus compatibilityI2C; ISA; VGA; SMBUS
maximum clock frequency100 MHz
Maximum data transfer rate32 MBps
Drive interface standardsIEEE 1149.6AC; IEEE 1149.1
JESD-30 codeS-PBGA-B484
JESD-609 codee1
length23 mm
Humidity sensitivity level4
Number of terminals484
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Encapsulate equivalent codeBGA484,22X22,40
Package shapeSQUARE
Package formGRID ARRAY
Peak Reflow Temperature (Celsius)245
power supply1 V
Certification statusNot Qualified
Maximum seat height3.32 mm
Maximum slew rate5000 mA
Maximum supply voltage1.1 V
Minimum supply voltage0.9 V
Nominal supply voltage1 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Silver/Copper (Sn/Ag/Cu)
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature30
width23 mm
uPs/uCs/peripheral integrated circuit typeBUS CONTROLLER, PCI
32-Lane 8-Port PCIe® Gen2
I/O Expansion Switch
®
89HPES32T8G2
Data Sheet
Device Overview
The 89HPES32T8G2 is a member of the IDT PRECISE™ family of
PCI Express® switching solutions. The PES32T8G2 is a 32-lane, 8-port
switch optimized for PCI Express Gen2 packet switching in high-perfor-
mance applications. Target applications include servers, storage,
communications, embedded systems, and multi-host or intelligent I/O
based systems with inter-domain communication.
• Drive strength
Initialization / Configuration
Features
High Performance Non-Blocking Switch Architecture
32-lane 8-port PCIe switch
• Four x8 switch ports each of which can bifurcate to two x4
ports (total of eight x4 ports)
Integrated SerDes supports 5.0 GT/s Gen2 and 2.5 GT/s
Gen1 operation
Delivers up to 32 GBps (256 Gbps) of switching capacity
Supports 128 Bytes to 2 KB maximum payload size
Low latency cut-through architecture
Supports one virtual channel and eight traffic classes
Standards and Compatibility
PCI Express Base Specification 2.0 compliant
Implements the following optional PCI Express features
• Advanced Error Reporting (AER) on all ports
• End-to-End CRC (ECRC)
• Access Control Services (ACS)
• Power Budgeting Enhanced Capability
• Device Serial Number Enhanced Capability
• Sub-System ID and Sub-System Vendor ID Capability
• Internal Error Reporting ECN
• Multicast ECN
• VGA and ISA enable
• L0s and L1 ASPM
• ARI ECN
Port Configurability
x4 and x8 ports
• Ability to merge adjacent x4 ports to create a x8 port
Automatic per port link width negotiation
(x8
x4
x2
x1)
Crosslink support
Automatic lane reversal
Autonomous and software managed link width and speed
control
Per lane SerDes configuration
• De-emphasis
• Receive equalization
Supports Root (BIOS, OS, or driver), Serial EEPROM, or
SMBus switch initialization
Common switch configurations are supported with pin strap-
ping (no external components)
Supports in-system Serial EEPROM initialization/program-
ming
Quality of Service (QoS)
Port arbitration
• Round robin
Request metering
• IDT proprietary feature that balances bandwidth among
switch ports for maximum system throughput
High performance switch core architecture
• Combined Input Output Queued (CIOQ) switch architecture
with large buffers
Multicast
Compliant to the PCI-SIG multicast ECN
Supports arbitrary multicasting of Posted transactions
Supports 64 multicast groups
Multicast overlay mechanism support
ECRC regeneration support
Clocking
Supports 100 MHz and 125 MHz reference clock frequencies
Flexible clocking modes
• Common clock
• Non-common clock
Hot-Plug and Hot Swap
Hot-plug controller on all ports
• Hot-plug supported on all downstream switch ports
All ports support hot-plug using low-cost external I
2
C I/O
expanders
Configurable presence detect supports card and cable appli-
cations
GPE output pin for hot-plug event notification
• Enables SCI/SMI generation for legacy operating system
support
Hot-swap capable I/O
Power Management
Supports D0, D3hot and D3 power management states
Active State Power Management (ASPM)
• Supports L0, L0s, L1, L2/L3 Ready and L3 link states
• Configurable L0s and L1 entry timers allow performance/
power-savings tuning
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc.
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November 28, 2011

89H32T8G2ZCBLGI Related Products

89H32T8G2ZCBLGI 89H32T8G2ZCBLG8 89H32T8G2ZCBLI
Description FCBGA-484, Tray FCBGA-484, Reel FCBGA-484, Tray
Brand Name Integrated Device Technology Integrated Device Technology Integrated Device Technology
Is it lead-free? Lead free Lead free Contains lead
Is it Rohs certified? conform to conform to incompatible
Maker IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
Parts packaging code FCBGA FCBGA FCBGA
package instruction FCBGA-484 BGA, FCBGA-484
Contacts 484 484 484
Manufacturer packaging code BLG484 BLG484 BL484
Reach Compliance Code compliant compliant not_compliant
ECCN code EAR99 EAR99 EAR99
Other features OPERATES AT 125 MHZ CLOCK FREQUENCY HAVING 125MHZ INPUT REFERENCE CLOCK FREQUENCY. OPERATES AT 125 MHZ CLOCK FREQUENCY
Bus compatibility I2C; ISA; VGA; SMBUS I2C; ISA; SMBUS; VGA I2C; ISA; VGA; SMBUS
Maximum data transfer rate 32 MBps 32000 MBps 32 MBps
JESD-30 code S-PBGA-B484 S-PBGA-B484 S-PBGA-B484
JESD-609 code e1 e1 e0
length 23 mm 23 mm 23 mm
Humidity sensitivity level 4 4 4
Number of terminals 484 484 484
Maximum operating temperature 85 °C 70 °C 85 °C
Minimum operating temperature -40 °C - -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA BGA BGA
Package shape SQUARE SQUARE SQUARE
Package form GRID ARRAY GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Celsius) 245 245 225
Maximum seat height 3.32 mm 3.32 mm 3.32 mm
Maximum supply voltage 1.1 V 1.1 V 1.1 V
Minimum supply voltage 0.9 V 0.9 V 0.9 V
Nominal supply voltage 1 V 1 V 1 V
surface mount YES YES YES
technology CMOS CMOS CMOS
Temperature level INDUSTRIAL COMMERCIAL INDUSTRIAL
Terminal surface Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Lead (Sn/Pb)
Terminal form BALL BALL BALL
Terminal pitch 1 mm 1 mm 1 mm
Terminal location BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature 30 NOT SPECIFIED NOT SPECIFIED
width 23 mm 23 mm 23 mm
uPs/uCs/peripheral integrated circuit type BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI
Samacsys Description FLIP CHIP BGA 23 X 23MM 1.0 MM PITCH FLIP CHIP BGA 23 X 23MM 1.0 MM PITCH -
maximum clock frequency 100 MHz - 100 MHz
Drive interface standards IEEE 1149.6AC; IEEE 1149.1 - IEEE 1149.6AC; IEEE 1149.1
Encapsulate equivalent code BGA484,22X22,40 - BGA484,22X22,40
power supply 1 V - 1 V
Certification status Not Qualified - Not Qualified
Maximum slew rate 5000 mA - 5000 mA
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