LMX5453SM/NOPB datasheet, PDF - EEWORLD Datasheet

LMX5453SM/NOPB: DescriptionIC SPECIALTY TELECOM CIRCUIT, PBGA60, 9 X 6 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, FBGA-60, Telecom IC:Other; CategoryWireless rf/communication Telecom circuit; File Size518KB，4 Pages; ManufacturerNational Semiconductor（TI ）; Websitehttp://www.ti.com; Environmental Compliance

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LMX5453SM/NOPB Overview

IC SPECIALTY TELECOM CIRCUIT, PBGA60, 9 X 6 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, FBGA-60, Telecom IC:Other

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	National Semiconductor（TI ）
package instruction	LFBGA,
Reach Compliance Code	compliant
JESD-30 code	R-PBGA-B60
JESD-609 code	e1
length	9 mm
Humidity sensitivity level	4
Number of functions	1
Number of terminals	60
Package body material	PLASTIC/EPOXY
encapsulated code	LFBGA
Package shape	RECTANGULAR
Package form	GRID ARRAY
Peak Reflow Temperature (Celsius)	260
Certification status	Not Qualified
Maximum seat height	1.3 mm
surface mount	YES
technology	CMOS
Telecom integrated circuit types	TELECOM CIRCUIT
Terminal surface	Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	6 mm

	LMX5453SM/NOPB	LMX5453SMX/NOPB
Description	IC SPECIALTY TELECOM CIRCUIT, PBGA60, 9 X 6 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, FBGA-60, Telecom IC:Other	IC SPECIALTY TELECOM CIRCUIT, PBGA60, 9 X 6 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, FBGA-60, Telecom IC:Other
Is it lead-free?	Lead free	Lead free
Is it Rohs certified?	conform to	conform to
Maker	National Semiconductor（TI ）	National Semiconductor（TI ）
package instruction	LFBGA,	LFBGA,
Reach Compliance Code	compliant	compliant
JESD-30 code	R-PBGA-B60	R-PBGA-B60
JESD-609 code	e1	e1
length	9 mm	9 mm
Humidity sensitivity level	4	4
Number of functions	1	1
Number of terminals	60	60
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LFBGA	LFBGA
Package shape	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY	GRID ARRAY
Peak Reflow Temperature (Celsius)	260	260
Certification status	Not Qualified	Not Qualified
Maximum seat height	1.3 mm	1.3 mm
surface mount	YES	YES
technology	CMOS	CMOS
Telecom integrated circuit types	TELECOM CIRCUIT	TELECOM CIRCUIT
Terminal surface	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form	BALL	BALL
Terminal pitch	0.8 mm	0.8 mm
Terminal location	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED
width	6 mm	6 mm

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