IC SPECIALTY TELECOM CIRCUIT, PBGA60, 9 X 6 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, FBGA-60, Telecom IC:Other
| Parameter Name | Attribute value |
| Is it lead-free? | Lead free |
| Is it Rohs certified? | conform to |
| Maker | National Semiconductor（TI ） |
| package instruction | LFBGA, |
| Reach Compliance Code | compliant |
| JESD-30 code | R-PBGA-B60 |
| JESD-609 code | e1 |
| length | 9 mm |
| Humidity sensitivity level | 4 |
| Number of functions | 1 |
| Number of terminals | 60 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | LFBGA |
| Package shape | RECTANGULAR |
| Package form | GRID ARRAY |
| Peak Reflow Temperature (Celsius) | 260 |
| Certification status | Not Qualified |
| Maximum seat height | 1.3 mm |
| surface mount | YES |
| technology | CMOS |
| Telecom integrated circuit types | TELECOM CIRCUIT |
| Terminal surface | Tin/Silver/Copper (Sn/Ag/Cu) |
| Terminal form | BALL |
| Terminal pitch | 0.8 mm |
| Terminal location | BOTTOM |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 6 mm |
| LMX5453SMX/NOPB | LMX5453SM/NOPB | |
|---|---|---|
| Description | IC SPECIALTY TELECOM CIRCUIT, PBGA60, 9 X 6 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, FBGA-60, Telecom IC:Other | IC SPECIALTY TELECOM CIRCUIT, PBGA60, 9 X 6 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, FBGA-60, Telecom IC:Other |
| Is it lead-free? | Lead free | Lead free |
| Is it Rohs certified? | conform to | conform to |
| Maker | National Semiconductor（TI ） | National Semiconductor（TI ） |
| package instruction | LFBGA, | LFBGA, |
| Reach Compliance Code | compliant | compliant |
| JESD-30 code | R-PBGA-B60 | R-PBGA-B60 |
| JESD-609 code | e1 | e1 |
| length | 9 mm | 9 mm |
| Humidity sensitivity level | 4 | 4 |
| Number of functions | 1 | 1 |
| Number of terminals | 60 | 60 |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | LFBGA | LFBGA |
| Package shape | RECTANGULAR | RECTANGULAR |
| Package form | GRID ARRAY | GRID ARRAY |
| Peak Reflow Temperature (Celsius) | 260 | 260 |
| Certification status | Not Qualified | Not Qualified |
| Maximum seat height | 1.3 mm | 1.3 mm |
| surface mount | YES | YES |
| technology | CMOS | CMOS |
| Telecom integrated circuit types | TELECOM CIRCUIT | TELECOM CIRCUIT |
| Terminal surface | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) |
| Terminal form | BALL | BALL |
| Terminal pitch | 0.8 mm | 0.8 mm |
| Terminal location | BOTTOM | BOTTOM |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED |
| width | 6 mm | 6 mm |
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