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B82412-A3121-J

Description
1 ELEMENT, 0.12uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD, ROHS COMPLIANT
CategoryPassive components    inductor   
File Size101KB,6 Pages
ManufacturerEPCOS (TDK)
Environmental Compliance  
Download Datasheet Parametric View All

B82412-A3121-J Overview

1 ELEMENT, 0.12uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD, ROHS COMPLIANT

B82412-A3121-J Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerEPCOS (TDK)
Reach Compliance Codecompliant
ECCN codeEAR99
core materialCERAMIC
DC Resistance0.35 Ω
Nominal inductance(L)0.12 µH
Inductor ApplicationsRF INDUCTOR
Inductor typeGENERAL PURPOSE INDUCTOR
JESD-609 codee4
Number of functions1
Number of terminals2
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Minimum quality factor (at nominal inductance)25
Maximum rated current0.38 A
self resonant frequency900 MHz
Shape/Size DescriptionRECTANGULAR PACKAGE
shieldNO
special characteristicsQ MEASURED AT 30MHZ
surface mountYES
Terminal surfaceSilver (Ag)
Terminal locationDUAL ENDED
Terminal shapeFLAT
Test frequency1 MHz
Tolerance5%
SMT Inductors, SIMID Series
SIMID 1210-01
Size 1210 (EIA) or 3225 (IEC)
Rated inductance 0,010 to 10
µH
Rated current 90 to 700 mA
Construction
s
s
s
s
B82412-A
Ceramic or ferrite core
Single-layer winding fixed by glue
US-welded winding
Without encapsulation
Features
s
s
s
s
Low height
High
Q
factor
High resonance frequency
Suitable for reflow (IR and vapor phase)
and wave soldering
Applications
s
s
s
s
Filtering of supply voltages, coupling, decoupling
Antenna systems
Automotive electronics
Telecommunications
Terminals
s
s
s
s
s
Silver-plated
1–2
µm
Cu, 4–6
µm
Ag
Base material CuSn6
Suitable for soldering and conductive adhesion
No leaching during wave soldering
Marking
No marking on component
Minimum data on reel:
Manufacturer, part number, ordering code,
L
value and tolerance of
L
value,
quantity, date of packing
Delivery mode
8-mm blister tape, wound on 180-mm or 330-mm
reel
For details on taping, packing and packing units
see page 153
87
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