Whether you’re designing at the board or system level,
Microsemi’s customizable System-on-Chip (cSoC) devices and low
power FPGAs are your best choice.
The unique, flash-based technology of Microsemi FPGAs, coupled with their history of reliability,
sets them apart from traditional FPGAs.
Design for today’s rapidly growing markets of consumer and portable medical devices, or tomorrow’s environmentally friendly data
centers, industrial controls and military and commercial aircraft. Only Microsemi can meet the power, size, cost and reliability targets
that reduce time-to-market and enable long-term profitability.
Table of Contents
SmartFusion
®
Fusion
Extended Temperature Fusion
• Customizable System-on-Chip (cSoC)
• Mixed Signal FPGAs
• Mixed Signal Integration Down to –55ºC
• Reprogrammable Digital Logic and Configurable Analog
• Embedded Flash Memory
• Low Power
• Small Package Footprint
• High Logic Density
• Low Power
• Small Package Footprint
• Low Power
• Small Package Footprint
• High I/O-to-Logic Ratio
• High Logic Density
• High Performance
• Low Cost
• Small Package Footprint
• High Performance
• Low Cost
•
•
•
•
Low Power
High Logic Density
High Performance
Low Cost
4
5
6
IGLOO
®
/e
IGLOO nano
IGLOO PLUS
7
8
9
ProASIC 3/E
®
10
ProASIC3 nano
11
ProASIC3L
12
Military ProASIC3/EL
• Unprecedented Low Power Consumption Across
the Full Military Temperature Range
• High-Density Fine-Pitch Ball Grid Packaging
• High Performance and Easy In-System Programming
• Industry’s First Military Screened Flash FPGA
• Full Processing to MIL-STD-883 Class B
• Established Heritage on Commercial and Military Aircraft
• I/O Counts
• Package Dimensions
13
Military ProASIC
I/O Table
FPGA Packages
Axcelerator
®
SX-A
MX
Design Tools
PLUS®
13
14
16
18
19
20
• Design Environment for Microsemi Flash Devices
• Starter, Evaluation and Demonstration Kits
• FlashPro3 and Silicon Sculptor 3 Programmers
• Microsemi IP Cores
21
22
26
27
Development Kits
Programmers
Intellectual Property Cores
Please refer to www.microsemi.com/soc and appropriate product datasheets for the latest device information, valid ordering codes and more
information regarding previous generations of flash and antifuse FPGAs.
www.microsemi.com/soc
3
SmartFusion
The customizable system-on-chip (cSoC) device
SmartFusion cSoCs are the only devices that integrate FPGA fabric, an ARM
®
Cortex
™
-M3 processor and programmable analog, offering full customization, IP
protection and ease-of-use. Based on Microsemi’s proprietary flash process, SmartFusion cSoCs are ideal for hardware and embedded designers who need a true
system-on-chip that gives more flexibility than traditional fixed-function microcontrollers without the excessive cost of soft processor cores on traditional FPGAs.
• Available in commercial, industrial
and military* grades
• Hard 100 MHz 32-bit ARM
Cortex-M3 CPU
• Multi-layer AHB communications
matrix with up to 16 Gbps throughput
* Under development
• 10/100 Ethernet MAC
• Two peripherals of each type:
SPI, I
2
C, UART, and 32-bit timers
• Up to 512 KB flash and
64 KB SRAM
• External memory controller (EMC)
• 8-channel DMA controller
• Integrated analog-to-digital
converters (ADCs) and digital-
to-analog converters (DACs)
with 1 percent accuracy
• On-chip voltage, current and
temperature monitors
• Up to ten 15 ns high-speed
comparators
• Analog compute engine (ACE)
offloads CPU from analog
processing
• Up to 35 analog I/Os and
169 digital GPIOs
SmartFusion Devices
SmartFusion Devices
System Gates
FPGA Fabric
Tiles (D-flip-flops)
RAM Blocks (4,608 bits)
Flash (Kbytes)
SRAM (Kbytes)
Cortex-M3 with
Memory Protection Unit (MPU)
10/100 Ethernet MAC
External Memory Controller (EMC)
Microcontroller
Subsystem (MSS)
DMA
I2C
SPI
16550 UART
32-Bit Timer
PLL
32 KHz Low Power Oscillator
100 MHz On-Chip RC Oscillator
Sm a rtF us io n
Main Oscillator (32 KHz to 20 MHz)
ADCs (8-/10-/12-bit SAR)
DACs (12-bit sigma-delta)
Programmable
Analog
Signal Conditioning Blocks (SCBs)
Comparators
3
Current Monitors
3
Temperature Monitors
3
Bipolar High Voltage Monitors
3
A2F060
60,000
1,536
8
128
16
Yes
No
24-bit address, 16-bit data
8 Ch
2
2
2
2
1
1
1
1
1
1
1
2
1
1
2
A2F200
200,000
4,608
8
256
64
Yes
Yes
24-bit address, 16-bit data
8 Ch
2
2
2
2
1
1
1
1
2
2
4
8
4
4
8
A2F500
500,000
11,520
24
512
64
Yes
Yes
24-bit address, 16-bit data
1
8 Ch
2
2
2
2
2
2
1
1
1
3
4
3
4
5
4
10
4
5
4
5
4
10
4
Notes:
1. Not available on A2F500 for the PQ208 package.
2. Two PLLs are available in CS288 and FG484 (one PLL in FG256 and PQ208).
3. These functions share I/O pins and may not all be available at the same time.
4. Available on FG484 only. PQ208, FG256, and CS288 packages offer the same programmable analog capabilities as A2F200.
Package I/Os: MSS + FPGA I/Os
Device
Direct Analog Input
Shared Analog Input
1
Total Analog Input
Total Analog Output
MSS I/Os
2,3
A2F060
TQ144
11
4
15
1
21
4
A2F200
FG256
11
4
15
1
26
4
A2F500
FG484
8
16
24
2
41
94
161
PQ208
8
16
24
1
22
66
5
CS288
11
4
15
1
28
4
PQ208
8
16
24
1
22
66
113
CS288
8
16
24
2
31
78
135
FG256
8
16
24
2
25
66
117
CS288
8
16
24
2
31
78
135
FG256
8
16
24
2
25
66
117
FG484
12
20
32
3
41
128
204
FPGA I/Os
Total I/Os
33
70
68
112
66
108
113
Notes:
1. These pins are shared between direct analog inputs to the ADCs and voltage/current/temperature monitors.
2. 16 MSS I/Os are multiplexed and can be used as FPGA I/Os, if not needed for the MSS. These I/Os support Schmitt triggers and support only LVTTL and LVCMOS (1.5 / 1.8 / 2.5, 3.3 V) standards.
3. 9 MSS I/Os are primarily for 10/00 Ethernet MAC and are also multiplexed and can be used as FPGA I/Os if Ethernet MAC is not used in a design. These I/Os support Schmitt triggers and support only LVTTL and LVCMOS
(1.5 / 1.8 / 2.5, 3.3 V) standards.
4. 10/100 Ethernet MAC is not available on A2F060.
5. EMC is not available on the A2F500 PQ208 package.
4
www.microsemi.com/soc
Fusion
The world’s first mixed signal FPGA
Fusion FPGAs integrate configurable analog, large flash memory blocks, comprehensive clock generation and management circuitry and high-performance,
flash-based programmable logic in a monolithic device. The Fusion architecture can be used with soft microcontroller cores, such as the performance-optimized
ARM Cortex-M1, 8051s or Microsemi’s own CoreABC, the smallest soft microcontroller for FPGAs.
• Integrated A/D converter (ADC)
with 8-, 10- and 12-bit
resolution and 30 scalable
analog input channels
• ADC accuracy better than
1 percent
• On-chip voltage, current and
temperature monitors
• In-system configurable
analog supports a wide
variety of applications
• Up to 1 MB of user flash memory
• Extensive clocking resources
• Analog PLLs
• 1 percent RC oscillator
• Crystal oscillator circuit
• Real-time counter (RTC)
• Flash FPGA fabric
• Reprogrammable
• Live at power-up
• Maximum design security
• Ultra-low power
• Configuration memory error
immune
• Clock management
• Advanced I/O standards
• User nonvolatile FlashROM
Fusion Devices
Fusion Devices
Cortex-M1 Devices
1
Pigeon Point Devices
MicroBlade Devices
System Gates
Tiles (D–flip–flops)
General
Information
AES-protected ISP
PLLs
Globals
Flash Memory Blocks (2 Mbits)
Total Flash Memory Bits
Memory
FlashROM Bits
RAM Blocks (4,608 bits)
RAM (Kbits)
Analog Quads
Analog Input Channels
Analog and I/Os
Gate Driver Outputs
I/O Banks (+ JTAG)
Maximum Digital I/Os
Analog I/Os
Notes:
1. Refer to the Cortex-M1 product brief for more information.
2. Pigeon Point devices only offered in FG484 and FG256 packages.
3. MicroBlade devices only offered in FG256 package.
AFS090
AFS250
M1AFS250
AFS600
M1AFS600
P1AFS600
2
AFS1500
M1AFS1500
P1AFS1500
2
U1AFS600
3
90,000
2,304
Yes
1
18
1
2M
1,024
6
27
5
15
5
4
75
20
250,000
6,144
Yes
1
18
1
2M
1,024
8
36
6
18
6
4
114
24
600,000
13,824
Yes
2
18
2
4M
1,024
24
108
10
30
10
5
172
40
1,500,000
38,400
Yes
2
18
4
8M
1,024
60
270
10
30
10
5
252
40
F us io n
Package I/Os: Single-/Double-Ended (Analog)
Fusion Mixed Signal FPGAs
Cortex-M1 Devices
Pigeon Point Devices
MicroBlade Devices
QN108
3
QN180
3
AFS090
AFS250
M1AFS250
AFS600
M1AFS600
P1AFS600
1
U1AFS600
2
AFS1500
M1AFS1500
P1AFS1500
1
37/9 (16)
60/16 (20)
—
75/22 (20)
—
—
—
65/15 (24)
93/26 (24)
114/37 (24)
—
—
—
—
95/46 (40)
119/58 (40)
172/86 (40)
—
—
—
—
119/58 (40)
223/109 (40)
252/126 (40)
PQ208
4
FG256
5
FG484
5
FG676
5
Notes:
1. Pigeon Point devices only offered in FG484 and FG256 packages.
2. MicroBlade devices only offered in FG256 package.
3. These packages are available only as RoHS-compliant (QNG package specifier).
4. AFS250 and AFS600 PQ208 devices are not pin-compatible.
5. Available in RoHS-compliant and standard leaded packages.
Use Spartan-6 to make a simple PCIE communication board. When generating the PCIE IP core, open up BAR0 as 128 bytes of IO space, and then directly use the generated reference design to generate the b...
In order to deepen the understanding of 51 single-chip microcomputer instructions for beginners, the process of instruction execution is now described in detail here, hoping to inspire you! The proces...
Electronic Information Network IntroductionMyoelectric signals are the temporal and spatial superposition of motor unit action potentials (MUAPs) in muscles, while surface electromyographic signals ar...
[i=s]This post was last edited by jishuaihu on 2015-1-27 19:44[/i] There is a requirement like this in my work. The waveform I sampled is as shown in the figure below. The waveform is continuous, and ...
[i=s]This post was last edited by zhang1gong on 2022-1-5 22:24[/i]1 Unpacking
On the afternoon of the last day of 2021, I finally received the evaluation board from Silicon Labs: BG22-EK4108A.
I opene...
When choosing a laptop battery, you should consider several factors, such as power, appearance, and quality.
Regarding power, we often see that a manufacturer uses values such as the number ...[Details]
As cellular phones become more advanced, the power consumption of the system during operation and the power consumption during standby are also increasing. Therefore, the power management design of...[Details]
The data collector of the automatic weather station is generally designed based on a single-chip microcomputer or a PC/104 bus controller. It has the characteristics of good compatibility with PC, low...[Details]
Since the No. 4 blast furnace of Handan Iron and Steel was put into operation in 1993, its external equipment has been seriously aged, and the original PLC control system TDC3000 of the hot blast furn...[Details]
The automotive lighting and signal control system is responsible for controlling the vehicle's lighting, signal lights, electric horns, reversing and brake buzzers. Traditional automotive lighting...[Details]
The typical fault troubleshooting listed below is for reference of maintenance personnel.
When the computer is turned on, the indicator light is off and there is no screen display
Mainte...[Details]
In today's body control module (BCM) designs, savvy engineers are moving away from electromechanical relays whenever possible. Their next step is to eliminate fuses. But is eliminating fuses a nece...[Details]
Abstract: With the development and construction of BeiDou II system, China will shift from the situation dominated by GPS to the situation dominated by BeiDou II global navigation system independen...[Details]
The serial interface real-time clock chip DS1302 launched by Dallas Company in the United States can trickle charge the backup battery of the clock chip. Due to the main features of the chip such a...[Details]
System Overview
The system consists of a signal preprocessing circuit, a single-chip computer AT89C2051, a systematic LED display module, a serial port data storage circuit and system software...[Details]
The above is to use MB1404 as a stereo composite signal transmitter. You can use the internal high-frequency amplifier and oscillator or not! According to my experience, I still recommend beginners...[Details]
0 Introduction
In order to improve the automation control of shortwave transmitters, so that they can automatically process from far to near, the technicians here use the ICS system to complete the ...[Details]
Cars equipped with xenon headlights are already common on the road. Whether they are standard equipment on high-end cars or embellishments on modified cars, xenon lamps are gradually becoming a sym...[Details]
One in five car failures are caused by batteries, a problem that will become more serious in the coming years as electric-by-wire, start/stop engine management and hybrid (electric/gas) vehicles be...[Details]
The future energy storage hotspot is not coal or iron ore, but lithium. This lightest metal in nature may be the heaviest resource in the future energy landscape. China launched an ambitious electr...[Details]
FPGA/CPLD
京公网安备 11010802033920号
EEWORLD
