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U86-K6126-00131

Description
Telecom and Datacom Connector
CategoryThe connector    The connector   
File Size139KB,2 Pages
ManufacturerAmphenol
Websitehttp://www.amphenol.com/
Environmental Compliance
Download Datasheet Parametric View All

U86-K6126-00131 Overview

Telecom and Datacom Connector

U86-K6126-00131 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerAmphenol
Reach Compliance Codeunknown
Connector typeTELECOM AND DATACOM CONNECTOR
Contact to complete cooperationGOLD (30)
Contact materialCOPPER ALLOY
Manufacturer's serial numberU86
SFP
U77-A4114-2001
U77-A1118-2001
Amphenol’s SFP interconnect system consists of a 20-position connector enclosed in a metal cage mounted
to a host PCB.
Amphenol single port and stacked SFP connectors are rated up to 6 Gbps. They are available in standard
RoHS compliant or non-RoHS compliant versions. The cages have a one-piece construction with enhanced
transceiver mating tabs available in press-fit version and solder tail version. Longer or shorter pins are available
as custom options.
Single Row versions (1xN) consist of SMT connectors used with a separate single row cage (press-fit or solder
tail). Stacked versions (2xN) consist of a 2 row cage with integrated 2 row connectors. The entire assembly is
press-fit compliant pin.
Specification Highlights
The interconnect system is comprised of a cage assembly which is used with 20-position
SFP connectors complying with MSA Agreement INF-8074i.
General Characteristics
• RoHS compliant
• Industry standard footprint
• Industry standard EIA-364
Mechanical Characteristics
• Accepts multiple transceivers per INF-8074i
• Compliant press-fit pins or solder tails (1x1 cages)
• Durability: 250 mating cycles minimum
Electrical Characteristics
• Hot swappable
• Operating voltage: 3.3 V
• Operating current: 0.5 A
• Differential impedance: 100
Ω+/-
10
• DWV: 300 V AC
• Insulation resistance: 1000 MΩ min
• Contact resistance: 70 mΩ max
• Spring fingers for superior EMI grounding
Packaging
• Tape and reel packaging: connector or 1x1 cage
• Tray packaging: cage of all sizes
• Bulk packaging: dust cover
Materials
• Cage
• Base material: copper alloy
• Plating: nickel or tin
• Light pipe: optical grade polycarbonate
• Heat sink: aluminum alloy
• Heat sink clip: stainless steel
• Dust cover: thermoplastic
• EMI ground tabs: stainless steel
• Connector
• Contact base material: copper alloy
• Contact plating: gold on mating area; gold or matte tin on termination
• Housings: glass reinforced, lead-free solder reflow process
compatible thermoplastic, UL94V-0 rated
Temperature Rating
• Operating temperature: -55 °C to +85 °C
• Storage temperature: -55 °C to +105 °C
Configurations
(Rows x Ports per row)
• 1x1
• 1x2
• 1x4
• 2x1
• 2x2
• 2x4
Options
• Light pipes
• Heat sink (standard fin for final cage combo)
• Enhanced EMI performance cage
• Dust cover
• 1x6
• 2x6
1x4 SFP cage with heat sinks
U77-E4124-2041
2x2 SFP Combo
U78-B2127-00121
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