SN74LVC1GX04YZPR datasheet, PDF

SN74LVC1GX04YZPR: DescriptionLVC/LCX/Z SERIES, 1-INPUT INV/NINV GATE, BGA6, LEAD FREE, DSBGA-6; Categorylogic logic; File Size296KB，13 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/; Environmental Compliance

Stay tuned Parametric Compare

SN74LVC1GX04YZPR Overview

LVC/LCX/Z SERIES, 1-INPUT INV/NINV GATE, BGA6, LEAD FREE, DSBGA-6

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Texas Instruments
Parts packaging code	BGA
package instruction	VFBGA,
Contacts	6
Reach Compliance Code	compliant
series	LVC/LCX/Z
JESD-30 code	R-XBGA-B6
length	1.4 mm
Logic integrated circuit type	INVERTER/BUFFER
Number of functions	1
Number of entries	1
Number of terminals	6
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	UNSPECIFIED
encapsulated code	VFBGA
Package shape	RECTANGULAR
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
propagation delay (tpd)	18 ns
Certification status	Not Qualified
Maximum seat height	0.5 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	1.65 V
Nominal supply voltage (Vsup)	1.8 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	BALL
Terminal pitch	0.5 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	0.9 mm

	SN74LVC1GX04YZPR	SN74LVC1GX04YEPR
Description	LVC/LCX/Z SERIES, 1-INPUT INV/NINV GATE, BGA6, LEAD FREE, DSBGA-6	LVC/LCX/Z SERIES, 1-INPUT INV/NINV GATE, BGA6, DSBGA-6
Maker	Texas Instruments	Texas Instruments
Parts packaging code	BGA	BGA
package instruction	VFBGA,	VFBGA,
Contacts	6	6
Reach Compliance Code	compliant	unknown
series	LVC/LCX/Z	LVC/LCX/Z
JESD-30 code	R-XBGA-B6	R-XBGA-B6
length	1.4 mm	1.4 mm
Logic integrated circuit type	INVERTER/BUFFER	INVERTER/BUFFER
Number of functions	1	1
Number of entries	1	1
Number of terminals	6	6
Maximum operating temperature	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C
Package body material	UNSPECIFIED	UNSPECIFIED
encapsulated code	VFBGA	VFBGA
Package shape	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
propagation delay (tpd)	18 ns	18 ns
Certification status	Not Qualified	Not Qualified
Maximum seat height	0.5 mm	0.5 mm
Maximum supply voltage (Vsup)	5.5 V	5.5 V
Minimum supply voltage (Vsup)	1.65 V	1.65 V
Nominal supply voltage (Vsup)	1.8 V	1.8 V
surface mount	YES	YES
technology	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL
Terminal form	BALL	BALL
Terminal pitch	0.5 mm	0.5 mm
Terminal location	BOTTOM	BOTTOM
width	0.9 mm	0.9 mm

Shortcut: 00 01 02 03 04 05 06 07 08 09 0A 0C 0F 0J 0L 0M 0R 0S 0T 0Z 10 11 12 13 14 15 16 17 18 19 1A 1B 1C 1D 1E 1F 1H 1K 1M 1N 1P 1S 1T 1V 1X 1Z 20 21 22 23 24 25 26 27 28 29 2A 2B 2C 2D 2E 2F 2G 2K 2M 2N 2P 2Q 2R 2S 2T 2W 2Z 30 31 32 33 34 35 36 37 38 39 3A 3B 3C 3D 3E 3F 3G 3H 3J 3K 3L 3M 3N 3P 3R 3S 3T 3V 40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4M 4N 4P 4S 4T 50 51 52 53 54 55 56 57 58 59 5A 5B 5C 5E 5G 5H 5K 5M 5N 5P 5S 5T 5V 60 61 62 63 64 65 66 67 68 69 6A 6C 6E 6F 6M 6N 6P 6R 6S 6T 70 71 72 73 74 75 76 77 78 79 7A 7B 7C 7M 7N 7P 7Q 7V 7W 7X 80 81 82 83 84 85 86 87 88 89 8A 8D 8E 8L 8N 8P 8S 8T 8W 8Y 8Z 90 91 92 93 94 95 96 97 98 99 9A 9B 9C 9D 9F 9G 9H 9L 9S 9T 9W

Popular Components