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W25Q64DWZPIP

Description
256K X 32 SPI BUS SERIAL EEPROM, 7.5 ns, PDSO16
Categorystorage    storage   
File Size1MB,82 Pages
ManufacturerWinbond Electronics Corporation
Websitehttp://www.winbond.com.tw
Environmental Compliance
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W25Q64DWZPIP Overview

256K X 32 SPI BUS SERIAL EEPROM, 7.5 ns, PDSO16

W25Q64DWZPIP Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
Parts packaging codeSON
package instructionHVSON, SOLCC8,.25
Contacts8
Reach Compliance Codecompli
ECCN codeEAR99
Maximum access time7.5 ns
Other featuresTOP/BOTTOM BOOT BLOCK
Maximum clock frequency (fCLK)104 MHz
Data retention time - minimum20
Durability100000 Write/Erase Cycles
JESD-30 codeR-PDSO-N8
length6 mm
memory density8388608 bi
Memory IC TypeFLASH
memory width32
Number of functions1
Number of terminals8
word count262144 words
character code256000
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize256KX32
Package body materialPLASTIC/EPOXY
encapsulated codeHVSON
Encapsulate equivalent codeSOLCC8,.25
Package shapeRECTANGULAR
Package formSMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Parallel/SerialSERIAL
power supply1.8 V
Programming voltage1.8 V
Certification statusNot Qualified
Maximum seat height0.8 mm
Serial bus typeSPI
Maximum standby current0.00002 A
Maximum slew rate0.04 mA
Maximum supply voltage (Vsup)1.95 V
Minimum supply voltage (Vsup)1.7 V
Nominal supply voltage (Vsup)1.8 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formNO LEAD
Terminal pitch1.27 mm
Terminal locationDUAL
typeNOR TYPE
width5 mm
write protectHARDWARE/SOFTWARE
Base Number Matches1
W25Q64DW
1.8V 64M-BIT
SERIAL FLASH MEMORY WITH
DUAL/QUAD SPI & QPI
-1-
Publication Release Date: September 18, 2012
Revision D

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Description 256K X 32 SPI BUS SERIAL EEPROM, 7.5 ns, PDSO16 256K X 32 SPI BUS SERIAL EEPROM, 7.5 ns, PDSO16 256K X 32 SPI BUS SERIAL EEPROM, 7.5 ns, PDSO16 256K X 32 SPI BUS SERIAL EEPROM, 7.5 ns, PDSO16
Is it Rohs certified? conform to conform to conform to conform to
Parts packaging code SON SOIC SOIC SON
package instruction HVSON, SOLCC8,.25 SOP, SOP16,.4 SOP, SOP8,.3 HVSON, SOLCC8,.3
Contacts 8 16 8 8
Reach Compliance Code compli compli compli compli
ECCN code EAR99 EAR99 EAR99 EAR99
Maximum access time 7.5 ns 7.5 ns 7.5 ns 7.5 ns
Other features TOP/BOTTOM BOOT BLOCK TOP/BOTTOM BOOT BLOCK TOP/BOTTOM BOOT BLOCK TOP/BOTTOM BOOT BLOCK
Maximum clock frequency (fCLK) 104 MHz 104 MHz 104 MHz 104 MHz
Data retention time - minimum 20 20 20 20
Durability 100000 Write/Erase Cycles 100000 Write/Erase Cycles 100000 Write/Erase Cycles 100000 Write/Erase Cycles
JESD-30 code R-PDSO-N8 R-PDSO-G16 R-PDSO-G8 R-PDSO-N8
length 6 mm 10.31 mm 5.28 mm 8 mm
memory density 8388608 bi 8388608 bi 8388608 bi 8388608 bi
Memory IC Type FLASH FLASH FLASH FLASH
memory width 32 32 32 32
Number of functions 1 1 1 1
Number of terminals 8 16 8 8
word count 262144 words 262144 words 262144 words 262144 words
character code 256000 256000 256000 256000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C
organize 256KX32 256KX32 256KX32 256KX32
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code HVSON SOP SOP HVSON
Encapsulate equivalent code SOLCC8,.25 SOP16,.4 SOP8,.3 SOLCC8,.3
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Parallel/Serial SERIAL SERIAL SERIAL SERIAL
power supply 1.8 V 1.8 V 1.8 V 1.8 V
Programming voltage 1.8 V 1.8 V 1.8 V 1.8 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 0.8 mm 2.64 mm 2.16 mm 0.8 mm
Serial bus type SPI SPI SPI SPI
Maximum standby current 0.00002 A 0.00002 A 0.00002 A 0.00002 A
Maximum slew rate 0.04 mA 0.04 mA 0.04 mA 0.04 mA
Maximum supply voltage (Vsup) 1.95 V 1.95 V 1.95 V 1.95 V
Minimum supply voltage (Vsup) 1.7 V 1.7 V 1.7 V 1.7 V
Nominal supply voltage (Vsup) 1.8 V 1.8 V 1.8 V 1.8 V
surface mount YES YES YES YES
technology CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form NO LEAD GULL WING GULL WING NO LEAD
Terminal pitch 1.27 mm 1.27 mm 1.27 mm 1.27 mm
Terminal location DUAL DUAL DUAL DUAL
type NOR TYPE NOR TYPE NOR TYPE NOR TYPE
width 5 mm 7.49 mm 5.23 mm 6 mm
write protect HARDWARE/SOFTWARE HARDWARE/SOFTWARE HARDWARE/SOFTWARE HARDWARE/SOFTWARE
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