RGSB560-819GG datasheet, PDF - EEWORLD Datasheet

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RGSB560-819GG: DescriptionIC Socket, BGA560, 560 Contact(s),; CategoryThe connector socket; File Size128KB，1 Pages; ManufacturerAdvanced Interconnections Corp.; Environmental Compliance

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RGSB560-819GG Overview

IC Socket, BGA560, 560 Contact(s),

RGSB560-819GG Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Advanced Interconnections Corp.
Reach Compliance Code	compliant
ECCN code	EAR99
Other features	STANDARD: UL 94V-0
Contact to complete cooperation	GOLD OVER NICKEL
Contact completed and terminated	Gold (Au) - with Nickel (Ni) barrier
Contact material	BERYLLIUM COPPER/COPPER ALLOY
Device slot type	IC SOCKET
Type of equipment used	BGA560
Shell material	POLYETHYLENE
JESD-609 code	e4
Number of contacts	560

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Ball Grid Array

(BGA) Sockets

5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 • Email info@advintcorp.com • Internet http://www.advintcorp.com

BGA Sockets

Standard Socket (S):

• Mates with Standard Adapter (A)

• Socket size same size as BGA device body

• Use with SMT Adapter for LGA and reworked

BGA device socketing

Extraction Socket (SB):

• Mates with Extraction Slot Adapter (AX)

• Socket size equals BGA body + .079/(2.0)

• Protects valuable PCB during device/adapter

extraction - tool never touches PCB

• Available in 1.0, 1.27 and 1.5mm pitch only

Features:

• Advanced

exclusive eutectic solder ball

terminals offer superior SMT processing.

• Uses same footprint as BGA device.

• Proven long-term performance in vigorous

temperature cycling applications - solder

ball terminal absorbs TCE mismatch.

• Closed bottom socket terminal for 100%

anti-wicking of solder.

• Gold contacts allow gold/gold

interconnections to male Adapter pins.

• Low insertion force socket with multi-

fingered high reliability Beryllium Copper

contacts.

• Coplanarity consistently under .006 inch

industry standard.

• In-house Tape and Reel packaging

available.

• See page 4 for How It Works.

Guide Post Socket (SG):

• Integral molded corners allow accurate positioning of

device/adapter assembly in blind-mating applications.

• Mates with Extraction Slot Adapter (AX)

• Socket size equals BGA body + .276/(7.00)

• Available in 1.27 and 1.5mm pitch only

Terminals:

1.27 & 1.5mm Pitch Terminals

Type -636

Type -673

Solder Ball

STANDARD

.117

(2.97)

1.0mm Pitch Terminals

Type -716

Type -717

Solder Ball

.105

(2.67)

.090

(2.29)

Thru-Hole

.090

(2.29)

.125

(3.18)

.024/(0.61) Dia.

PATENTED

.015 Dia.

(0.38)

Thru-Hole

.117

(2.97)

.095

(2.41)

.030 Dia.

(0.76)

.128

(3.25)

.018 Dia.

(0.46)

.105

(2.67)

PATENTED

Terminals and Contacts:

Terminals: Brass - Copper Alloy (C36000)

ASTM-B-16

Contacts: Beryllium Copper - Copper

Alloy (C17200), ASTM-B-194

0.80mm Pitch Terminals

Type -731

Type -702

Solder Ball

Thru-Hole

0.75mm Pitch Terminals

Type -758

Solder Ball

.125

(3.18)

.125

(3.18)

.080

(2.03)

.011 Dia.

(0.28)

.125

(3.18)

.020/(0.51) Dia.

.018/(0.46) Dia.

PATENTED

Plating:

G - Gold over Nickel

PATENTED

Body Material:

M - Molded High Temp. Glass Filled

Thermoplastic (P.P.S.), U.L. Rated 94V-O,

-60˚C to 260˚C (-76˚F to 500˚F)

F - FR-4 Glass Epoxy, U.L. Rated 94V-O

Footprint Dash#

If Applicable

How To Order

XXX -636

Contact Plating

G - Gold

Terminal Plating

G - Gold

Terminal Type

Number of Positions

See BGA Footprint section or web site

Model Type

= Standard Socket

= Extraction Slot (1.5, 1.27 and 1.0mm pitch only)

= Guide Post Socket (1.5 and 1.27mm pitch only)

Solder:

63Sn/37Pb, Eutectic, 183˚C (361.4˚F)

Body Type

M - Molded PPS (1.27 & 1.5mm pitch)

F - FR-4 (0.75, 0.80 & 1.0mm pitch)

Pitch

B = .059/(1.5mm)

G = .050/(1.27mm)

H = .039/(1.0mm)

J = .0315/(0.80mm)

K = .0295/(0.75mm)

inch/(mm)

Products shown covered by patents issued and/or pending. Specifications subject to change without notice.

Page 5

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