2 Lead Metal Package Quartz Crystal, 3 mm x 10 mm
Product Features:
Low Cost
Small Footprint Package
Compatible with Leadfree Processing
39 Series
Applications:
Fibre Channel
Server & Storage
Sonet /SDH
802.11 / Wifi
T1/E1, T3/E3
System Clock
3.2
Max.
Frequency
ESR (Equivalent Series Resistance)
3.0 MHz – 3.4 MHz
3.5 MHz – 3.9 MHz
4.0 MHz – 4.9 MHz
5.0 MHz – 5.9 MHz
6.0 MHz – 6.9 MHz
7.0 MHz – 8.9 MHz
9.0 MHz – 12.9 MHz
13.0 MHz – 19.9 MHz
20.0 MHz – 29.9 MHz
30 MHz – 36 MHz
rd
30 MHz – 100 MHz (3 O.T.)
Shunt Capacitance (C0)
Frequency Tolerance @ 25°
C
Frequency Stability over
Temperature
Crystal Cut
Load Capacitance
Drive Level
Aging
Temperature
Operating
Storage
3 MHz to 100.000 MHz
10.5 Max.
200
Ω
Max.
200
Ω
Max.
200
Ω
Max.
150
Ω
Max.
120
Ω
Max.
120
Ω
Max.
80
Ω
Max.
60
Ω
Max.
45
Ω
Max.
40
Ω
Max.
100
Ω
Max.
7 pF Max.
±30
ppm Standard (see Part Number Guide for more options)
±50
ppm Standard (see Part Number Guide for more options)
AT Cut Standard
18 pF Standard
1 mW Max.
±5
ppm Max. / Year Standard
8.0 Min.
1.1
Lead Dia. = 0.3
0° C to +70° C Standard (see Part Number Guide for more
options)
-40° C to +85° C Standard
Dimension Units: mm
Part Number Guide
Package
Tolerance
(ppm) at Room
Temperature
B = ±50 ppm
F = ±30 ppm
39 -
G = ±25 ppm
H = ±20 ppm
I = ±15 ppm
J = ±10 ppm*
Sample Part Number:
Stability
(ppm) over Operating
Temperature
B = ±50 ppm
F = ±30 ppm
G = ±25 ppm
H = ±20 ppm
I = ±15 ppm**
J = ±10 ppm**
39 - FB1F18 - 20.000
Operating
Temperature Range
0 = 0°C to +50°C
1 = 0°C to +70°C
2 = -10°C to +60°C
3 = -20°C to +70°C
5 = -40°C to +85°C
9 = -10°C to +50°C
Mode
(overtone)
F = Fundamental
3 = 3
rd
overtone
Load Capacitance
(pF)
Frequency
18 pF Standard
Or Specify
- 20.000 MHz
* Not available at all frequencies. ** Not available for all temperature ranges.
ILSI
America
Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com
06/09
Specifications subject to change without notice
Page 1
2 Lead Metal Package Quartz Crystal, 3 mm x 10 mm
Pb Free Solder Reflow Profile:
Typical Circuit:
39 Series
*Units are backward compatible with 240C reflow processes
Package Information:
MSL = 1
Termination = e1 (Sn / Cu / Ag over Ni over Kovar base metal).
Environmental Specifications
Thermal Shock
Moisture Resistance
Mechanical Shock
Mechanical Vibration
Resistance to Soldering Heat
Hazardous Substance
Solderability
Terminal Strength
Gross Leak
Fine Leak
Solvent Resistance
MIL-STD-883, Method 1011, Condition A
MIL-STD-883, Method 1004
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 2007, Condition A
J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max)
Pb-Free / RoHS / Green Compliant
JESD22-B102-D Method 2 (Preconditioning E)
MIL-STD-883, Method 2004, Test Condition D
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s
MIL-STD-202, Method 215
Marking
Line 1:
Frequency
ILSI
America
Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com
06/09
Specifications subject to change without notice
Page 2
Microcontroller MCU
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