EEWORLDEEWORLDEEWORLD

Part Number

Search

SAM3S_11

Description
32-BIT, FLASH, 64 MHz, RISC MICROCONTROLLER, PQFP48
Categorysemiconductor    The embedded processor and controller   
File Size1MB,64 Pages
ManufacturerAtmel (Microchip)
Download Datasheet Parametric Compare View All

SAM3S_11 Overview

32-BIT, FLASH, 64 MHz, RISC MICROCONTROLLER, PQFP48

SAM3S_11 Parametric

Parameter NameAttribute value
Number of functions1
Number of terminals48
Maximum operating temperature85 Cel
Minimum operating temperature-40 Cel
Maximum supply/operating voltage1.95 V
Minimum supply/operating voltage1.62 V
Rated supply voltage1.8 V
External data bus width0.0
Number of input and output buses34
Line speed64 MHz
Processing package description7 × 7 MM, 0.50 MM PITCH, Green, MS-026, LQFP-48
Lead-freeYes
EU RoHS regulationsYes
stateACTIVE
CraftsmanshipCMOS
packaging shapeSQUARE
Package SizeFLATPACK, LOW PROFILE, FINE PITCH
surface mountYes
Terminal formGULL WING
Terminal spacing0.5000 mm
terminal coatingMATTE Tin
Terminal locationFour
Packaging MaterialsPlastic/Epoxy
Temperature levelINDUSTRIAL
ADC channelYes
Address bus width0.0
Number of digits32
Maximum FCLK clock frequency20 MHz
DMA channelYes
Microprocessor typeReduced Instruction Set Microcontroller
PWM channelYes
ROM programmingFLASH
Features
Core
– ARM
®
Cortex
®
-M3 revision 2.0 running at up to 64 MHz
– Memory Protection Unit (MPU)
– Thumb
®
-2 instruction set
Pin-to-pin compatible with AT91SAM7S legacy products (48- and 64-pin versions)
Memories
– From 64 to 256 Kbytes embedded Flash, 128-bit wide access, memory accelerator,
single plane
– From 16 to 48 Kbytes embedded SRAM
– 16 Kbytes ROM with embedded bootloader routines (UART, USB) and IAP routines
– 8-bit Static Memory Controller (SMC): SRAM, PSRAM, NOR and NAND Flash
support
– Memory Protection Unit (MPU)
System
– Embedded voltage regulator for single supply operation
– Power-on-Reset (POR), Brown-out Detector (BOD) and Watchdog for safe
operation
– Quartz or ceramic resonator oscillators: 3 to 20 MHz main power with Failure
Detection and optional low power 32.768 kHz for RTC or device clock
– High precision 8/12 MHz factory trimmed internal RC oscillator with 4 MHz default
frequency for device startup. In-application trimming access for frequency
adjustment
– Slow Clock Internal RC oscillator as permanent low-power mode device clock
– Two PLLs up to 130 MHz for device clock and for USB
– Temperature Sensor
– Up to 22 peripheral DMA (PDC) channels
Low Power Modes
– Sleep and Backup modes, down to 3 µA in Backup mode
– Ultra low power RTC
Peripherals
– USB 2.0 Device: 12 Mbps, 2668 byte FIFO, up to 8 bidirectional Endpoints. On-Chip
Transceiver
– Up to 2 USARTs with ISO7816, IrDA
®
, RS-485, SPI, Manchester and Modem Mode
– Two 2-wire UARTs
– Up to 2 Two Wire Interface (I2C compatible), 1 SPI, 1 Serial Synchronous Controller
(I2S), 1 High Speed Multimedia Card Interface (SDIO/SD Card/MMC)
– Up to 6 Three-Channel 16-bit Timer/Counter with capture, waveform, compare and
PWM mode. Quadrature Decoder Logic and 2-bit Gray Up/Down Counter for
Stepper Motor
– 4-channel 16-bit PWM with Complementary Output, Fault Input, 12-bit Dead Time
Generator Counter for Motor Control
– 32-bit Real-time Timer and RTC with calendar and alarm features
– Up to 15-channel, 1Msps ADC with differential input mode and programmable gain
stage
– One 2-channel 12-bit 1Msps DAC
– One Analog Comparator with flexible input selection, Selectable input hysteresis
– 32-bit Cyclic Redundancy Check Calculation Unit (CRCCU)
I/O
– Up to 79 I/O lines with external interrupt capability (edge or level sensitivity),
debouncing, glitch filtering and on-die Series Resistor Termination
– Three 32-bit Parallel Input/Output Controllers, Peripheral DMA assisted Parallel
Capture Mode
Packages
– 100-lead LQFP, 14 x 14 mm, pitch 0.5 mm/100-ball LFBGA, 9 x 9 mm, pitch 0.8 mm
– 64-lead LQFP, 10 x 10 mm, pitch 0.5 mm/64-pad QFN 9x9 mm, pitch 0.5 mm
– 48-lead LQFP, 7 x 7 mm, pitch 0.5 mm/48-pad QFN 7x7 mm, pitch 0.5 mm
AT91SAM
ARM-based
Flash MCU
SAM3S Series
Summary
NOTE:
This is a summary document.
The complete document is available on
the Atmel website at www.atmel.com.
6500CS–ATARM–24-Jan-11

SAM3S_11 Related Products

SAM3S_11 SAM3S ATSAM3S2AA-AU ATSAM3S2BA-AU ATSAM3S4AA-MU ATSAM3S4BA-MU ATSAM3S4CA-CU
Description 32-BIT, FLASH, 64 MHz, RISC MICROCONTROLLER, PQFP48 32-BIT, FLASH, 64 MHz, RISC MICROCONTROLLER, PQFP48 32-BIT, FLASH, 64 MHz, RISC MICROCONTROLLER, PQFP48 32-BIT, FLASH, 64 MHz, RISC MICROCONTROLLER, PQFP64 32-BIT, FLASH, 64 MHz, RISC MICROCONTROLLER, QCC48 32-BIT, FLASH, 64 MHz, RISC MICROCONTROLLER, QCC64 32-BIT, FLASH, 64 MHz, RISC MICROCONTROLLER, PBGA100
Number of terminals 48 48 48 64 48 64 100
Maximum operating temperature 85 Cel 85 Cel 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 Cel -40 Cel -40 °C -40 °C -40 °C -40 °C -40 °C
surface mount Yes Yes YES YES YES YES YES
Terminal form GULL WING GULL WING GULL WING GULL WING NO LEAD NO LEAD BALL
Terminal location Four Four QUAD QUAD QUAD QUAD BOTTOM
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
DMA channel Yes Yes YES YES YES YES YES
PWM channel Yes Yes YES YES YES YES YES
Is it lead-free? - - Lead free Lead free Lead free Lead free Lead free
Is it Rohs certified? - - conform to conform to conform to conform to conform to
Parts packaging code - - QFP QFP QFN QFN BGA
package instruction - - LFQFP, QFP48,.35SQ,20 LFQFP, QFP64,.47SQ,20 HVQCCN, LCC48,.27SQ,20 HVQCCN, LCC64,.35SQ,20 TFBGA, BGA100,10X10,32
Contacts - - 48 64 48 64 100
Reach Compliance Code - - compli compliant compli compli compli
ECCN code - - 3A991.A.2 3A991.A.2 3A991.A.2 3A991.A.2 3A991.A.2
Has ADC - - YES YES YES YES YES
bit size - - 32 32 32 32 32
CPU series - - CORTEX-M3 CORTEX-M3 CORTEX-M3 CORTEX-M3 CORTEX-M3
maximum clock frequency - - 20 MHz 20 MHz 20 MHz 20 MHz 20 MHz
DAC channel - - NO YES NO YES YES
JESD-30 code - - S-PQFP-G48 S-PQFP-G64 S-XQCC-N48 S-XQCC-N64 S-PBGA-B100
JESD-609 code - - e3 e3 e3 e3 e1
length - - 7 mm 10 mm 7 mm 9 mm 9 mm
Humidity sensitivity level - - 3 3 3 - 3
Number of I/O lines - - 34 47 34 47 79
On-chip program ROM width - - 32 32 32 32 32
Package body material - - PLASTIC/EPOXY PLASTIC/EPOXY UNSPECIFIED UNSPECIFIED PLASTIC/EPOXY
encapsulated code - - LFQFP LFQFP HVQCCN HVQCCN TFBGA
Encapsulate equivalent code - - QFP48,.35SQ,20 QFP64,.47SQ,20 LCC48,.27SQ,20 LCC64,.35SQ,20 BGA100,10X10,32
Package shape - - SQUARE SQUARE SQUARE SQUARE SQUARE
Package form - - FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius) - - 260 260 260 NOT SPECIFIED 260
power supply - - 1.8,3.3 V 1.8,3.3 V 1.8,3.3 V 1.8,3.3 V 1.8,3.3 V
Certification status - - Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
RAM (bytes) - - 32768 32768 49152 49152 49152
rom(word) - - 32768 32768 65536 65536 65536
ROM programmability - - FLASH FLASH FLASH FLASH FLASH
Maximum seat height - - 1.6 mm 1.6 mm 0.9 mm 1 mm 1.1 mm
speed - - 64 MHz 64 MHz 64 MHz 64 MHz 64 MHz
Maximum supply voltage - - 1.95 V 1.95 V 1.95 V 1.95 V 1.95 V
Minimum supply voltage - - 1.62 V 1.62 V 1.62 V 1.62 V 1.62 V
Nominal supply voltage - - 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V
technology - - CMOS CMOS CMOS CMOS CMOS
Terminal surface - - Matte Tin (Sn) Matte Tin (Sn) MATTE TIN MATTE TIN TIN SILVER COPPER
Terminal pitch - - 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.8 mm
Maximum time at peak reflow temperature - - 40 40 40 NOT SPECIFIED 40
width - - 7 mm 10 mm 7 mm 9 mm 9 mm
uPs/uCs/peripheral integrated circuit type - - MICROCONTROLLER, RISC MICROCONTROLLER, RISC MICROCONTROLLER, RISC MICROCONTROLLER, RISC MICROCONTROLLER, RISC
Maker - - - Atmel (Microchip) Atmel (Microchip) Atmel (Microchip) Atmel (Microchip)
Factory Lead Time - - - 1 week 1 week 1 week 1 week
A detailed description of the development history of Bluetooth technology from 1.0 to 5.0
At present, Bluetooth has become one of the largest wireless communication technologies, and is used in various products such as smart home, consumer electronics, smart wearable devices, instruments a...
btty038 RF/Wirelessly
Why is the ASEBRKAK/ASEBRK pin of the Renesas MCU supper H series emulator low level after power-on after adding a pull-up resistor?
As the title says: Why is the ASEBRKAK/ASEBRK pin of the Renesas MCU supper H series emulator low level after power on after adding a pull-up resistor? I encountered a problem with a Renesas board. Wh...
aboutnow Renesas Electronics MCUs
The Secret of AGND and DGND - Grounding Principles for Mixed-Signal Devices
[i=s]This post was last edited by qwqwqw2088 on 2016-5-19 08:18[/i] [align=left][size=3][color=#a0522d] Grounding is an issue that cannot be ignored for all analog designs, and in PCB-based circuits, ...
qwqwqw2088 Analogue and Mixed Signal
Last day: Apply for domestic USB and Touchkey microcontroller CH554 evaluation board
[align=left][size=14px][size=2][color=#ffffff][backcolor=red][font=宋体]About the development board for evaluation application: [/font][font=宋体]CH554 evaluation board[/font][/backcolor][/color][/size][/...
nmg MCU
Looking for some C programming experts
I really hope to meet some experts who are good at C language programming for 51 MCU. My QQ is: 836587669...
bingbing123 MCU
arm9 ldr r13,=0x1000
I am using Feiling's ok2440. Alas, I am a newbie. AREA |DATA|,CODE,READONLY ENTRY ldr r13,=0x1000 IMPORT LedMain b LedMain END I have seen this assembly jump routine in bare metal programs such as led...
testttest ARM Technology

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2443  1624  1246  1245  449  50  33  26  10  40 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号