ATSAM3S4AA-MU datasheet, PDF - EEWORLD Datasheet

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ATSAM3S4AA-MU: Description32-BIT, FLASH, 64 MHz, RISC MICROCONTROLLER, QCC48; CategoryThe embedded processor and controller Microcontrollers and processors; File Size1MB，64 Pages; ManufacturerAtmel (Microchip); Environmental Compliance

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ATSAM3S4AA-MU Overview

32-BIT, FLASH, 64 MHz, RISC MICROCONTROLLER, QCC48

ATSAM3S4AA-MU Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Atmel (Microchip)
Parts packaging code	QFN
package instruction	HVQCCN, LCC48,.27SQ,20
Contacts	48
Reach Compliance Code	compli
ECCN code	3A991.A.2
Factory Lead Time	1 week
Has ADC	YES
Address bus width
bit size	32
CPU series	CORTEX-M3
maximum clock frequency	20 MHz
DAC channel	NO
DMA channel	YES
External data bus width
JESD-30 code	S-XQCC-N48
JESD-609 code	e3
length	7 mm
Humidity sensitivity level	3
Number of I/O lines	34
Number of terminals	48
On-chip program ROM width	32
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
PWM channel	YES
Package body material	UNSPECIFIED
encapsulated code	HVQCCN
Encapsulate equivalent code	LCC48,.27SQ,20
Package shape	SQUARE
Package form	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius)	260
power supply	1.8,3.3 V
Certification status	Not Qualified
RAM (bytes)	49152
rom(word)	65536
ROM programmability	FLASH
Maximum seat height	0.9 mm
speed	64 MHz
Maximum supply voltage	1.95 V
Minimum supply voltage	1.62 V
Nominal supply voltage	1.8 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	MATTE TIN
Terminal form	NO LEAD
Terminal pitch	0.5 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	40
width	7 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER, RISC

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Features

•

Core

– ARM

Cortex

-M3 revision 2.0 running at up to 64 MHz

– Memory Protection Unit (MPU)

– Thumb

-2 instruction set

Pin-to-pin compatible with AT91SAM7S legacy products (48- and 64-pin versions)

Memories

– From 64 to 256 Kbytes embedded Flash, 128-bit wide access, memory accelerator,

single plane

– From 16 to 48 Kbytes embedded SRAM

– 16 Kbytes ROM with embedded bootloader routines (UART, USB) and IAP routines

– 8-bit Static Memory Controller (SMC): SRAM, PSRAM, NOR and NAND Flash

support

– Memory Protection Unit (MPU)

System

– Embedded voltage regulator for single supply operation

– Power-on-Reset (POR), Brown-out Detector (BOD) and Watchdog for safe

operation

– Quartz or ceramic resonator oscillators: 3 to 20 MHz main power with Failure

Detection and optional low power 32.768 kHz for RTC or device clock

– High precision 8/12 MHz factory trimmed internal RC oscillator with 4 MHz default

frequency for device startup. In-application trimming access for frequency

adjustment

– Slow Clock Internal RC oscillator as permanent low-power mode device clock

– Two PLLs up to 130 MHz for device clock and for USB

– Temperature Sensor

– Up to 22 peripheral DMA (PDC) channels

Low Power Modes

– Sleep and Backup modes, down to 3 µA in Backup mode

– Ultra low power RTC

Peripherals

– USB 2.0 Device: 12 Mbps, 2668 byte FIFO, up to 8 bidirectional Endpoints. On-Chip

Transceiver

– Up to 2 USARTs with ISO7816, IrDA

, RS-485, SPI, Manchester and Modem Mode

– Two 2-wire UARTs

– Up to 2 Two Wire Interface (I2C compatible), 1 SPI, 1 Serial Synchronous Controller

(I2S), 1 High Speed Multimedia Card Interface (SDIO/SD Card/MMC)

– Up to 6 Three-Channel 16-bit Timer/Counter with capture, waveform, compare and

PWM mode. Quadrature Decoder Logic and 2-bit Gray Up/Down Counter for

Stepper Motor

– 4-channel 16-bit PWM with Complementary Output, Fault Input, 12-bit Dead Time

Generator Counter for Motor Control

– 32-bit Real-time Timer and RTC with calendar and alarm features

– Up to 15-channel, 1Msps ADC with differential input mode and programmable gain

stage

– One 2-channel 12-bit 1Msps DAC

– One Analog Comparator with flexible input selection, Selectable input hysteresis

– 32-bit Cyclic Redundancy Check Calculation Unit (CRCCU)

I/O

– Up to 79 I/O lines with external interrupt capability (edge or level sensitivity),

debouncing, glitch filtering and on-die Series Resistor Termination

– Three 32-bit Parallel Input/Output Controllers, Peripheral DMA assisted Parallel

Capture Mode

Packages

– 100-lead LQFP, 14 x 14 mm, pitch 0.5 mm/100-ball LFBGA, 9 x 9 mm, pitch 0.8 mm

– 64-lead LQFP, 10 x 10 mm, pitch 0.5 mm/64-pad QFN 9x9 mm, pitch 0.5 mm

– 48-lead LQFP, 7 x 7 mm, pitch 0.5 mm/48-pad QFN 7x7 mm, pitch 0.5 mm

•

AT91SAM

ARM-based

Flash MCU

SAM3S Series

Summary

•

NOTE:

This is a summary document.

The complete document is available on

the Atmel website at www.atmel.com.

•

6500CS–ATARM–24-Jan-11

ATSAM3S4AA-MU Related Products

	ATSAM3S4AA-MU	SAM3S	SAM3S_11	ATSAM3S2AA-AU	ATSAM3S2BA-AU	ATSAM3S4BA-MU	ATSAM3S4CA-CU
Description	32-BIT, FLASH, 64 MHz, RISC MICROCONTROLLER, QCC48	32-BIT, FLASH, 64 MHz, RISC MICROCONTROLLER, PQFP48	32-BIT, FLASH, 64 MHz, RISC MICROCONTROLLER, PQFP48	32-BIT, FLASH, 64 MHz, RISC MICROCONTROLLER, PQFP48	32-BIT, FLASH, 64 MHz, RISC MICROCONTROLLER, PQFP64	32-BIT, FLASH, 64 MHz, RISC MICROCONTROLLER, QCC64	32-BIT, FLASH, 64 MHz, RISC MICROCONTROLLER, PBGA100
DMA channel	YES	Yes	Yes	YES	YES	YES	YES
Number of terminals	48	48	48	48	64	64	100
Maximum operating temperature	85 °C	85 Cel	85 Cel	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 Cel	-40 Cel	-40 °C	-40 °C	-40 °C	-40 °C
PWM channel	YES	Yes	Yes	YES	YES	YES	YES
surface mount	YES	Yes	Yes	YES	YES	YES	YES
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	NO LEAD	GULL WING	GULL WING	GULL WING	GULL WING	NO LEAD	BALL
Terminal location	QUAD	Four	Four	QUAD	QUAD	QUAD	BOTTOM
Is it lead-free?	Lead free	-	-	Lead free	Lead free	Lead free	Lead free
Is it Rohs certified?	conform to	-	-	conform to	conform to	conform to	conform to
Maker	Atmel (Microchip)	-	-	-	Atmel (Microchip)	Atmel (Microchip)	Atmel (Microchip)
Parts packaging code	QFN	-	-	QFP	QFP	QFN	BGA
package instruction	HVQCCN, LCC48,.27SQ,20	-	-	LFQFP, QFP48,.35SQ,20	LFQFP, QFP64,.47SQ,20	HVQCCN, LCC64,.35SQ,20	TFBGA, BGA100,10X10,32
Contacts	48	-	-	48	64	64	100
Reach Compliance Code	compli	-	-	compli	compliant	compli	compli
ECCN code	3A991.A.2	-	-	3A991.A.2	3A991.A.2	3A991.A.2	3A991.A.2
Factory Lead Time	1 week	-	-	-	1 week	1 week	1 week
Has ADC	YES	-	-	YES	YES	YES	YES
bit size	32	-	-	32	32	32	32
CPU series	CORTEX-M3	-	-	CORTEX-M3	CORTEX-M3	CORTEX-M3	CORTEX-M3
maximum clock frequency	20 MHz	-	-	20 MHz	20 MHz	20 MHz	20 MHz
DAC channel	NO	-	-	NO	YES	YES	YES
JESD-30 code	S-XQCC-N48	-	-	S-PQFP-G48	S-PQFP-G64	S-XQCC-N64	S-PBGA-B100
JESD-609 code	e3	-	-	e3	e3	e3	e1
length	7 mm	-	-	7 mm	10 mm	9 mm	9 mm
Humidity sensitivity level	3	-	-	3	3	-	3
Number of I/O lines	34	-	-	34	47	47	79
On-chip program ROM width	32	-	-	32	32	32	32
Package body material	UNSPECIFIED	-	-	PLASTIC/EPOXY	PLASTIC/EPOXY	UNSPECIFIED	PLASTIC/EPOXY
encapsulated code	HVQCCN	-	-	LFQFP	LFQFP	HVQCCN	TFBGA
Encapsulate equivalent code	LCC48,.27SQ,20	-	-	QFP48,.35SQ,20	QFP64,.47SQ,20	LCC64,.35SQ,20	BGA100,10X10,32
Package shape	SQUARE	-	-	SQUARE	SQUARE	SQUARE	SQUARE
Package form	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	-	-	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	260	-	-	260	260	NOT SPECIFIED	260
power supply	1.8,3.3 V	-	-	1.8,3.3 V	1.8,3.3 V	1.8,3.3 V	1.8,3.3 V
Certification status	Not Qualified	-	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified
RAM (bytes)	49152	-	-	32768	32768	49152	49152
rom(word)	65536	-	-	32768	32768	65536	65536
ROM programmability	FLASH	-	-	FLASH	FLASH	FLASH	FLASH
Maximum seat height	0.9 mm	-	-	1.6 mm	1.6 mm	1 mm	1.1 mm
speed	64 MHz	-	-	64 MHz	64 MHz	64 MHz	64 MHz
Maximum supply voltage	1.95 V	-	-	1.95 V	1.95 V	1.95 V	1.95 V
Minimum supply voltage	1.62 V	-	-	1.62 V	1.62 V	1.62 V	1.62 V
Nominal supply voltage	1.8 V	-	-	1.8 V	1.8 V	1.8 V	1.8 V
technology	CMOS	-	-	CMOS	CMOS	CMOS	CMOS
Terminal surface	MATTE TIN	-	-	Matte Tin (Sn)	Matte Tin (Sn)	MATTE TIN	TIN SILVER COPPER
Terminal pitch	0.5 mm	-	-	0.5 mm	0.5 mm	0.5 mm	0.8 mm
Maximum time at peak reflow temperature	40	-	-	40	40	NOT SPECIFIED	40
width	7 mm	-	-	7 mm	10 mm	9 mm	9 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER, RISC	-	-	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC

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