Adder/Subtractor, CMOS, CDIP16
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | RCA |
| package instruction | DIP, DIP16,.3 |
| Reach Compliance Code | unknown |
| JESD-30 code | R-XDIP-T16 |
| JESD-609 code | e0 |
| Logic integrated circuit type | ADDER/SUBTRACTOR |
| Number of terminals | 16 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP16,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | 3/15 V |
| Certification status | Not Qualified |
| surface mount | NO |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |


| CD4008AD | CD4008AF | CD4008AE | CD4008AH | |
|---|---|---|---|---|
| Description | Adder/Subtractor, CMOS, CDIP16 | Adder/Subtractor, CMOS, CDIP16, | Adder/Subtractor, CMOS, PDIP16 | Adder/Subtractor, CMOS |
| Maker | RCA | RCA | RCA | RCA |
| package instruction | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | , DIE OR CHIP |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| Logic integrated circuit type | ADDER/SUBTRACTOR | ADDER/SUBTRACTOR | ADDER/SUBTRACTOR | ADDER/SUBTRACTOR |
| Maximum operating temperature | 125 °C | 125 °C | 85 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -40 °C | -55 °C |
| Encapsulate equivalent code | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIE OR CHIP |
| power supply | 3/15 V | 3/15 V | 3/15 V | 3/15 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| technology | CMOS | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | MILITARY | INDUSTRIAL | MILITARY |
| Is it Rohs certified? | incompatible | incompatible | incompatible | - |
| JESD-30 code | R-XDIP-T16 | R-XDIP-T16 | R-PDIP-T16 | - |
| JESD-609 code | e0 | e0 | e0 | - |
| Number of terminals | 16 | 16 | 16 | - |
| Package body material | CERAMIC | CERAMIC | PLASTIC/EPOXY | - |
| encapsulated code | DIP | DIP | DIP | - |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | - |
| Package form | IN-LINE | IN-LINE | IN-LINE | - |
| surface mount | NO | NO | NO | - |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | - |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | - |
| Terminal location | DUAL | DUAL | DUAL | - |