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SSI73K322L-22IP

Description
Modem, CMOS, PDIP22
CategoryWireless rf/communication    Telecom circuit   
File Size2MB,27 Pages
ManufacturerSilicon Systems Inc.
Download Datasheet Parametric Compare View All

SSI73K322L-22IP Overview

Modem, CMOS, PDIP22

SSI73K322L-22IP Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerSilicon Systems Inc.
package instructionDIP, DIP22,.4
Reach Compliance Codeunknown
JESD-30 codeR-PDIP-T22
JESD-609 codee0
Number of terminals22
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP22,.4
Package shapeRECTANGULAR
Package formIN-LINE
power supply5 V
Certification statusNot Qualified
Maximum slew rate10 mA
Nominal supply voltage5 V
surface mountNO
technologyCMOS
Telecom integrated circuit typesMODEM
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL

SSI73K322L-22IP Related Products

SSI73K322L-22IP 73K322LS-IP SSI73K322L-22IC SSI73K322L-28IC SSI73K322L-28IH SSI73K322L-28IP
Description Modem, CMOS, PDIP22 Modem, CMOS, PDIP22 Modem, CMOS, CDIP22 Modem, CMOS, CDIP28 Modem, CMOS, PQCC28 Modem, CMOS, PDIP28
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible
Maker Silicon Systems Inc. Silicon Systems Inc. Silicon Systems Inc. Silicon Systems Inc. Silicon Systems Inc. Silicon Systems Inc.
package instruction DIP, DIP22,.4 DIP, DIP22,.4 DIP, DIP22,.4 DIP, DIP28,.6 QCCJ, LDCC28,.5SQ DIP, DIP28,.6
Reach Compliance Code unknown unknown unknown unknown unknown unknown
JESD-30 code R-PDIP-T22 R-PDIP-T22 R-XDIP-T22 R-XDIP-T28 S-PQCC-J28 R-PDIP-T28
JESD-609 code e0 e0 e0 e0 e0 e0
Number of terminals 22 22 22 28 28 28
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY CERAMIC CERAMIC PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIP DIP DIP DIP QCCJ DIP
Encapsulate equivalent code DIP22,.4 DIP22,.4 DIP22,.4 DIP28,.6 LDCC28,.5SQ DIP28,.6
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR SQUARE RECTANGULAR
Package form IN-LINE IN-LINE IN-LINE IN-LINE CHIP CARRIER IN-LINE
power supply 5 V 5 V 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum slew rate 10 mA 10 mA 10 mA 10 mA 10 mA 10 mA
Nominal supply voltage 5 V 5 V 5 V 5 V 5 V 5 V
surface mount NO NO NO NO YES NO
technology CMOS CMOS CMOS CMOS CMOS CMOS
Telecom integrated circuit types MODEM MODEM MODEM MODEM MODEM MODEM
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE J BEND THROUGH-HOLE
Terminal pitch 2.54 mm 2.54 mm 2.54 mm 2.54 mm 1.27 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL QUAD DUAL
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